• 문화기술의 융합
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• 제9권6호
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• pp.957-966
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• 2023

본 논문에서는 새로운 실시간 적응형 PID 온도제어 기법을 제안한다. 제어대상을 표현하는 모델을 도입하여 오버슈트가 발생하지 않도록 하는 기법이다. 오버슈트의 원인이 되는 과도한 적분을 막기 위해 적분 제어량이 실시간으로 모델의 열손실을 추종하도록 적분 이득을 조정한다. 기본적으로 비례 제어는 오버슈트를 유발하지 않는다. PID 제어에서 오버슈트의 발생 원인은 적분에서 기인한다. 기존의 PID 제어는 적분이 비례 제어에 종속되고 개인이 상수로 고정되었다. 그 결과 서로에게 부정합되는 두 이득을 적용하면 과도한 오버슈트가 발생할 수 있었다. 그러나 제안하는 적응형 제어는 적분 제어량이 항상 열손실을 초과하지 않도록 능동적으로 오버슈트를 제거한다. 따라서 제안하는 기법에 따라 튜닝 실험이 필요 없는 적응형 PID 제어를 실현할 수 있다.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2000년도 춘계학술발표대회 논문집
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• pp.53-58
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• 2000

During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it requires a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis considering the exothermic reaction. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.

• 대한기계학회논문집A
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• 제24권11호
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• pp.2853-2865
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• 2000

During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it takes a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20 mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one, and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.

• 한국초전도ㆍ저온공학회논문지
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• 제20권4호
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• pp.65-69
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• 2018

Due to large in-field current carrying capacity and strong mechanical strength, a REBCO wire has been regarded as a viable high temperature superconductor (HTS) option for high field MRI and > 1 GHz (>23.5 T) NMR magnets. However, a REBCO magnet is well known to have an inherent problem of field inhomogeneity, so-called 'Screening Current induced magnetic Field (SCF)'. Recently, 'field shaking' and 'current overshoot operation' techniques have been successfully demonstrated to mitigate the SCF and enhance the field homogeneity by experiments. To investigate the effectiveness of current overshooting operation technique, a numerical simulation is conducted for a test REBCO magnet composed of a stack of double pancake coils using '2D edge-element magnetic field formulation' combined with 'domain homogenization' scheme. The simulation result demonstrates that an appropriate amount of current overshoot can negate the SCF. To verify the simulation results, current overshoot experiments are conducted for the REBCO magnet in liquid nitrogen. Experimental results also demonstrate the possible application of current overshoot technique to mitigate the SCF and enhance the field homogeneity.

• 소성∙가공
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• 제10권7호
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• pp.565-572
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• 2001

It is well known that a multicomponent $Zr_{4l.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ bulk metallic glass alloy shows good bulk glass forming ability due to its high resistance to crystallization in the undercooled liquid state. DSC and XRD have been performed to confirm the amorphous structure of the master alloy. To investigate the mechanical properties and deformation behavior of the bulk metallic $Zr_{4l.2}Ti_{13.8}Cu_{12.5}Ni_{10}Be_{22.5}$ alloy, a series of compression tests has been carried out at the temperatures ranging from $351^{\circ}C$ to $461^{\circ}C$at the various initial strain rates from $2{\times}10^4s^1$ to $2{\times}10^2s^1$. Three types of nominal stress-strain curves have been identified such as linear stress-strain relationship meaning fracture at maximum stress, plastic deformation including stress overshoot and steady-state flow, plastic deformation without stress overshoot depending on the strain rate and test temperature. Also DSC analysis for the compressed specimens was carried out to investigate the change of structure, thermal stability and crystallization behavior for the various test conditions.

• 대한기계학회논문집
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• 제10권6호
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• pp.861-869
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• 1986

본 연구에서는 동시확립문제의 속도장해석에 있어서 단면내의 속도분포에 대 한 일체의 가정을 하지 않고 운동량방정식을 직접 해석하여 단면내의 속도분포를 구하 였다. 또한 Prandtl수, 반경비 및 편심도가 열전달특성에 미치는 영향에 대한 해석 도 수행하였다.

• 한국추진공학회지
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• 제6권2호
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• pp.53-63
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• 2002

터보프롭 엔진(PT6A-62)의 정상상태 및 동적 성능모사를 위한 프로그램을 개발하였다. 특히 이 프로그램은 Flat-rated 성능특성과 압축기서지 및 압축기터빈 입구제한온도 초과 방지를 위한 한도제어 알고리즘을 포함하였다. 해석오차를 최소화 하기 위해 조합 오차 값을 이용한 구성품 성능 데이터의 보간 방법과 온도의 함수로서 계산된 정압비열가 비열비가 사용되었다. 개발된 정상상태 성능해석 프로그램은 고도, 비행속도, 블리드유량, 흡입구온도 및 압력, 제한출력등의 여러 조건을 고려 할 수 있으며, 천이상태 성능해석 프로그램은 일반모드와 압축기 서지 방지 모드, 터빈 제한온도 초과방지 모드로 선택하여 해석을 수행할 수 있도록 구성하였다.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2000년도 제15차 학술회의논문집
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• pp.62-62
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• 2000

An auto-tuning PID controller which is adequate for temperature control is developed based on relay-control and pole-placement Using the critical frequency which is obtained from relay-control parameters of assumed model are identified. Pole/zero-placement PID controller is designed for the identified model. The desired pole/zeros are determined so that the closed-loop has overshoot free step response. The developed auto-tuning PID controller was successfully applied to the temperature control of RTP.

• JSTS:Journal of Semiconductor Technology and Science
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• 제8권2호
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• pp.115-120
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• 2008

Carrier velocity in the MOSFET channel is the main driving force for improved transistor performance with scaling. We report measurements of the drift velocity of electrons and holes in silicon inversion layers. A technique for extracting effective carrier velocity which is a more accurate extraction method based on the actual inversion charge measurement is used. This method gives more accurate result over the whole range of $V_{ds}$, because it does not assume a linear approximation to obtain the inversion charge and it does not limit the range of applicable $V_{ds}$. For a very short channel length device, the electron velocity overshoot is observed at room temperature in 37 nm MOSFETs while no hole velocity overshoot is observed down to 36 nm. The electron velocity of short channel device was found to be strongly dependent on the longitudinal field.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1997년도 한국자동제어학술회의논문집; 한국전력공사 서울연수원; 17-18 Oct. 1997
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• pp.77-80
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• 1997

In this paper presented is a temperature controller for a semiconductor test handler. Using ARMAX model and least square method, the chamber model for the design of a controller is identified through experiment. With the identified model an LQG/LTR controller is designed. Experiment with a real test handler demonstrated good performance in that its overshoot is small and response time is fast.