• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.112-112
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• 1999

고분자 표면에 MeV급 이온을 주입하게 되면 화학적, 광학적, 물리적, 전기적 특성 등 기존의 재래식 공정으로는 불가능한 다양한 특성변화가 일어나게 된다. 본 실험에서는 이온 조사에 따른 micro-hardness의 변화에 중점을 두어 관찰하였다. 수 MeV로 가속시킨 Cl과 C 이온을 Kapton, Teflon, PMMA에 조사량을 바꾸어가며 조사하였다. 이때 조사 전후 고분자 시료의 표면 경도는 depth-sensing nanoindentation technique (Nano Indenter II, USA)을 이용하여 측정하였다. 측정깊이는 극표면 효과와 기측효과의 영향을 무시할 수 없는 100nm로 결정하였다. 또한 이와 같은 경도변화를 규명하기 위하여 각각의 시료에 대해 FTIR, Raman, UV-VIS, RBS, XPS 스펙트럼을 측정하였으며, 조사중에 발생되는 가스상 분자들을 RGA를 이용하여 측정하였다. 1 MeV Cl 이온을 Kato에 4x1015ions/cm2 조사하면 경도가 0.35 GPa에서 7.1GPa로 약 20배 정도 증가하게 되며, 이 경도는 stainless steel 경도 2~3 GPa, martensite steel 8~12와 비교하여 보면 상당히 높은 수준임을 알 수 있다. Teflon과 PMMA 시료의 경우 1MeV Cl 이온 4X1015ions/cm2를 조사시키면 각각 경도가 0.31GPa에서 4.1a, 0.30 GPa에서 3.9GPa로 변화하였으며 Kapton에 비하여 상대적으로 경도의 변화가 적음을 알 수 있었다. 이온 주입된 Kapton의 경우 FT-IR측정에 의하여 이온 조사량이 증가함에 따라 C=O 진동, 이미드그룹의 CONH, tertiary amine의 C-N 흡수 피크가 감소되며, 1X1014ions/cm2 이상의 양이 조사되어야 개질변화가 일어남을 알 수 있었다. XPS 측정 결과 Kapton에 조사되는 이온양이 증가할수록 C=O, C-O 및 C-N의 탄소는 감소하고 페닐고리 탄소가 증가함을 알 수 있었다. 또한 이온 조사 중 측정한 RGA에서도 CO 가스가 대량 방출되는 현상을 관찰하였으며 FTIR 및 XPS에서의 C=O 결합의 감소와도 일치하였다. RBS에 의한 CNO 원소의 변화에서도 다른 원소보다 O의 감소가 현저하게 나타남을 확인하였다. UV-VIS 측정을 통해 조사 이온량에 따라 에너지 준위가 변동하여 흡수스펙트럼이 장파장으로 확대됨을 알 수 있었으며, 이는 공액 2중 결합의 형성에 의한 $\pi$-전자 및 기타 결함에 기인한다. PMMA 및 Teflon의 경우 FTIR 측정에 의하여 이온 조사됨에 따라 function group 들의 peak가 세기가 감소되면서 완만해지는 경향을 보이며 원래의 구조를 상실하게 된다. PMMA와 Teflon은 이온 조사가 되면 가교형서보다는 사슬절단이 주로 일어나므로 가교형성이 잘 일어나는 Kapton보다는 상대적으로 경도의 증가가 적음을 알 수 있었다.

• Journal of Radiation Protection and Research
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• v.24 no.1
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• pp.39-43
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• 1999

Thermoluminescent (TL) response characteristics of a thin LiF:Mg,Cu,Na,Si Teflon detectors have been studied for use in beta radiation detection. The detectors were fabricated from a mixture of LiF:Mg,Cu,Na,Si phosphor and Teflon powder which was molded into a thin disk form of $50mg/cm^2$ thickness. These detectors were irradiated to beta fields of $^{147}Pm,\;^{204}Tl\;and\;^{90}Sr/^{90}Y$ sources with a covering of Kapton foil ($2mg/cm^2$) and photon irradiation was carried out with a $^{137}Cs$ source at the Korea Atomic Energy Research Institute (KAERI). Batch uniformity was estimated to be 4.7% and the beta dose response presented linear relationship from 0.1 mGy to 100 Gy. The beta energy responses of thin detectors normalized to $^{137}Cs$ were presented as 0.46, 1.09 and 1.06 for $^{147}Pm,\;^{204}Tl\;and\;^{90}Sr/^{90}Y$ beta rays, respectively. The evaluated values for angular responses were $0.93{\pm}0.03\;(^{147}Pm),\;0.94{\pm}0.04\;(^{204}Tl),\;and\;0.92{\pm}0.05\;(^{90}Sr/^{90}Y)$. The results satisfied well a proposed ISO Standard for beta ray dosimeters.

• The Journal of the Petrological Society of Korea
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• v.25 no.2
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• pp.107-119
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• 2016

Trace element abundances in the igneous rocks are important data for petrogenetic interpretation. Their concentrations are generally measured using ICP-MS from the dissolved solution. The acid digestion of rock powder can be performed by conventional teflon vial or pressure bomb. In this paper, we investigated a problem that happened during acid digestion experiment using conventional teflon vial or pressure bomb of BCR2 and GSP2 USGS rock standard materials. The results show that the measured concentrations of the elements like Cr, Ni, Zn, Ta, W in the BCR2 are different from the recommended values of USGS whereas those of the elements like Rb, Sr, Zr, Hf, Ta, W in the GSP2 are different from those values. Our experiment shows that defect of specific elements like Cr, Ni may happen during the sample digestion. Our results also indicate that the Cr, Ni, W, Zr, Hf, Ta concentration obtained based on an acid digestion of geological samples need to be careful in their geochemical interpretation.

• Korean Chemical Engineering Research
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• v.62 no.1
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• pp.105-111
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• 2024

The SLA (Stereolithography Apparatus) method is a type of 3D printing technique predicated on the transformation of liquid photocurable resin into a solid form through UV laser exposure, and its application is increasing in various fields. In this study, we conducted research to enhance the hydrophobicity and transparency of SLA 3D printing surfaces for microfluidic system production. The enhancement of surface hydrophobicity in SLA outputs was attainable through the application of hydrophobic coating methods, but the coating durability under different conditions varied depending on the type of hydrophobic coating. Additionally, to simultaneously achieve the required transparency and hydrophobic properties for the fabrication of microfluidic systems, we applied hydrophobic coatings to the proposed transparency enhancement method from prior research and compared the changes in contact angles. Teflon coating was proposed as a suitable hydrophobic coating method for the fabrication of microfluidic systems, given its excellent transparency and high coating durability in various environmental conditions, in comparison to titanium dioxide coating. Finally, we produced an Electrophoresis of Charged Droplet (ECD) chip, one of the digital microfluidics systems, using SLA 3D printing with the proposed Teflon coating method (Fluoropel 800). Droplet manipulation was successfully demonstrated with the fabricated chip, confirming the potential application of SLA 3D printing technology in the production of microfluidic systems.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.57-58
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• 2007

• The Transactions of The Korean Institute of Electrical Engineers
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• v.62 no.11
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• pp.1633-1639
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• 2013

In a section of AC electric railway, a phase between the sections is different although voltage levels supplied from substations are the same. Therefore, section insulators have been installed to electrically divide between the sections. Two differenet types of section insulator, namely an overlap type and insulator type, are used. In Korean high-speed lines, overlap type section insulator has been adopted. And, insulator type is used in conventional line. The overlap type has the advantage of having no speed limit, but has the disadvantage of requiring long section length. However, the insulator type has the advantage of section length, but also has the disadvantage of having speed limit. In Korean conventional line, an insulator type one relies on the import and there is some problem with wear. In this study, we developed the insulator type section insulator which adopts Teflon tube insulation material. The Teflon material has advantage of the excellent electrical characteristics and wear-resistance characteristics for a longer expected life than that made of existing FRP. In order to compare wear characteristics between the materials, wear tests with reciprocal wear tester are performed. And dynamic behavior tests between the insulators and pantograph are also performed for showing its better dynamic characteristics.

• Journal of Korean Society for Atmospheric Environment
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• v.19 no.4
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• pp.437-449
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• 2003

A multi-functional indoor smog chamber was designed and evaluated to investigate photochemical or water vapor reaction mechanisms of air pollutants. Various smog chamber experiments could be conducted using ambient air or purified air in this smog chamber. The smog chamber consisted of a housing, a Teflon bag, blacklights, injection ports, sampling ports, and utility facilities. The characteristics of light source, the wall losses of air pollutants, and the quality of purified air were experimentally investigated. The maximum NO$_2$ photolysis rate was 1.10 min$^{-1}$ . In a 2.5-m$^3$ Teflon bag, the wall losses of ambient $O_3$, NO, and NO$_2$ were 1.2~2.4$\times$10$^{-3}$ min$^{-1}$ , 0.7~2.0$\times$10$^{-3}$ min$^{-1}$ , and 0.4~2.0$\times$10$^{-3}$ min$^{-1}$ , respectively. The wall loss of ambient particles ranging 0.05 to 0.2 ${\mu}{\textrm}{m}$ was 1.8~5.4$\times$10$^{-3}$ min$^{-1}$ , which was slightly higher than those of ambient gaseous species. The purified air supply system provided high quality of air with NO$_{x}$ < 1 ppb, and total hydrocarbons < 5 ppb.b.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.24 no.1 s.173
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• pp.87-93
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• 2000

Warm, forming technique which is one of the new forming technologies to improve formability of sheet metal is applied to the cylindrical cup drawing of stainless-aluminum. clad sheets. In experiments the temperature of die and blank holder is varied from room temperature to 18$0^{\circ}C$, while the punch is cooled by circulation of coolant to increase the fracture strength of workpiece on the punch corner area. Test materials chosen for experiments are STS304-A1050-STS304, STS304-A1050-STS430 clad sheets and A1050-0 aluminum sheet. Teflon film as a lubricant is used on both sides of a workpiece. The limit drawing ratio as well as quality of drawn cups(distribution of thickness and hardness)are investigated and validity of warm drawing process is also discussed.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.10a
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• pp.297-300
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• 2009

본 연구는 Knife형 전극을 사용하여 $SF_6$와 $N_2/O_2$의 혼합체적률이 각각 100:0, 80:20, 60:40인 혼합가스에서의 캡 변화에 따른 연면방전 특성을 연구할 목적으로 교류고전압 인가 시 압력 (P), 전극간거리 (d) 및 사용된 가스의 변화에 따른 절연파괴특성을 연구 하였다. 본 연구를 통해 챔버 내의 P와 d가 증가할수록 연면절연파괴전압은 상승하다가 일정한 압력 이상에서는 포화하는 경향을 보였고, $N_2:O_2$의 혼합체적률이 100:0인 경우는 $SF_6$의 37%, 80:20은 47%, 60:40은 46%로 나타났다. $N_2:O_2$ 혼합가스 중에서 체적혼합비율이 80:20인 경우가 연면절연내력이 가장 좋게 나타났다.

• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1531_1532
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• 2009

This paper presents a method of self-arranging solderballs by using surface energy difference. After evaporating Au which has high surface energy on Si substrates, Teflon passivation layer which has low surface energy was patterned by lift-off process. Droplets formed only on the hydrophilic Au solderball lands by the surface energy difference, not the hydrophobic Teflon surface. Scattered solderballs sticked by themselves to the wetted solderball lands on the tilted substrate. After setting preheating of $200^{\circ}C$ and soldering of $245^{\circ}C$ hot plates, the solderballs were soldered on the solderball lands and two substrates were soldered together completely. After measuring the mechanical shear strength of the soldered substrates with solderballs of $3{\times}3$, $4{\times}4$ and $5{\times}5$ arrays. the calculated shear strength per one solderball was 1.1~2.4kgf as high as the previous report.