• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.11a
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• pp.119-123
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• 2001

In this paper, a new structure and fabrication method for the wafer level package(WLP) is presented. A packaged VLSI chip is encapsulated by a parylene(which is a low k material) layer as a dielectric layer and is molded by SUB photo-epoxy with dielectric constant of 3.0 at 100 MHz. The electrical parameters (R, L, C) of package traces are extracted by using the Maxwell 3-D simulator. Based on HSPICE simulation results, the proposed wafer level package can operate for frequencies up to 20GHz.

• Journal of the Korean Society for Precision Engineering
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• v.1 no.3
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• pp.52-70
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• 1984

This paper presents a micro-computer simulation package for the various vibratory systems. The Package consists of 10 programs which describe the dynamical characteristics of the vibratory system. The programs have been written in BASIC (Appoesoft) language and programmed on the 6502 CPU with 48 KRAM. This simulation package is stored in 5 $^1/_4$ inch floppy disk. The user requires no simulation expertise on the part of designer. Through a process of disk operation, the user can easily under- stand how to use this package.

• IE interfaces
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• v.13 no.3
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• pp.479-485
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• 2000

We consider a Location-Allocation Problem with the Cost of Land(LAPCL). LAPCL has extremely huge size of problem and complex characteristic of location and allocation problem. Heuristics and decomposition approaches on simple Location-Allocation Problem were well developed in last three decades. Recently, genetic algorithm(GA) is used widely at combinatorics and NLP fields. A lot of research shows that GA has efficiency for finding good solution. Our main motive of this research is developing of a package for LAPCL. We found that LAPCL could be reduced to trivial problem, if locations were given. In this case, we can calculate fitness function by simple technique. We built a database constructed by zipcode, latitude, longitude, administrative address and posted land price. This database enables any real field problem to be coded into a mathematical location problem. We developed a package for a class of multi-location problem at PC. The package allows for an interactive interface between user and computer so that user can generate various solutions easily.

• Journal of Korea Multimedia Society
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• v.6 no.4
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• pp.668-675
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• 2003

Now a days many industries and bigger organisation (Indian Railways, Bharat Heavy Electricals Ltd.) are facing difficulties in implementing the new technology because of non-availability of fully trained staff. Also for the employed technical and other staff lot of resistance management has to face to get them trained for adoption of new technology. There are also very less organisations who can design effective training programmes and at the same time develop course material specially multimedia packages and computer base training (CBT) which can satisfy the need of different target groups of industries. Indian Railways was also facing similar situation while implementing the Air Brake System technology In Indian Railways. TTTI Bhopal took that challenge and designed, developed and trained Indian Railways trainer for implementation of the package on different target group. The present paper offers a case study on the same.

• Structural Engineering and Mechanics
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• v.52 no.4
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• pp.739-753
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• 2014

There have been many packages that can be employed to analyze plane frames. However, because most structural analysis packages suffer from closeness of system, it is very difficult to integrate it with an optimization package. To overcome the difficulty, we proposed a possible alternative, DAMDO, which integrate Design, Analysis, Modeling, Definition, and Optimization phases into an integrative environment. The DAMDO methodology employs neural networks to integrate structural analysis package and optimization package so as not to need directly to integrate these two packages. The key problem of the DAMDO approach is how to generate a set of reasonable random designs in the first phase. According to the characteristics of optimized plane frames, we proposed the ratio variable approach to generate them. The empirical results show that the ratio variable approach can greatly improve the accuracy of the neural networks, and the plane frame optimization problems can be solved by the DAMDO methodology.

• Journal of Sensor Science and Technology
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• v.22 no.1
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• pp.44-48
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• 2013

For a successful commercialization of microbolometer, it is required to develop a robust package including thermal stabilizing mechanism. In order to regulate the temperature within some operating range, thermoelectric cooler is generally used but it's not easy to model the whole package due to the coupled physics nature of thermoelectric cooler. In this paper, SPICE-compatible modeling methodology of a microbolometer package is presented, whose steady-state results matched well with FEM results at the maximum difference of 5.95%. Although the time constant difference was considerable as 15.7%, it can be offset by the quite short simulation time compared to FEM simulation. The developed model was also proven to be useful for designing the thermal stabilizer through parametric and transient analyses under the various working conditions.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.75-79
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• 2013

A power distribution network (PDN) is a network that provides connection between the voltage source supply and the power/ground terminals of a microprocessor chip. It consists of a voltage regulator module, a printed circuit board, a package substrate, a microprocessor chip as well as decoupling capacitors. For power integrity analysis, the board and package layouts have to be transformed into an electrical network of resistor, inductor and capacitor components which may be expressed using the S-parameters models. This modeling process generally takes from several hours up to a few days for a complete board or package layout. When the board and package layouts change, they need to be re-extracted and the S-parameters models also need to be re-generated for power integrity assessment. This not only consumes a lot of resources such as time and manpower, the task of PDN modeling is also tedious and mundane. In this paper, a block-based PDN modeling is proposed. Here, the board or package layout is partitioned into sub-blocks and each of them is modeled independently. In the event of a change in power rails routing, only the affected sub-blocks will be reextracted and re-modeled. Simulation results show that the proposed block-based PDN modeling not only can save at least 75% of processing time but it can, at the same time, keep the modeling accuracy on par with the traditional PDN modeling methodology.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.4
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• pp.216-231
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• 2001

Several methods for improving device yields and characteristics have been studied by IC manufacturers, as the options for programming components become diversified through the introduction of novel processes. Especially, the sequential repair steps on wafer level and package level are essentially required in DRAMs to improve the yield. Several repair methods for DRAMs are reviewed in this paper. They include the optical methods (laser-fuse, laser-antifuse) and the electrical methods (electrical-fuse, ONO-antifuse). Theses methods can also be categorized into the wafer-level(on wafer) and the package-level(post-package) repair methods. Although the wafer-level laser-fuse repair method is the most widely used up to now, the package-level antifuse repair method is becoming an essential auxiliary technique for its advantage in terms of cost and design efficiency. The advantages of the package-level antifuse method are discussed in this paper with the measured data of manufactured devices. With devices based on several processes, it was verified that the antifuse repair method can improve the net yield by more than 2%~3%. Finally, as an illustration of the usefulness of the package-level antifuse repair method, the repair method was applied to the replica delay circuit of DLL to get the decrease of clock skew from 55ps to 9ps.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.1349-1353
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• 2003

CEMTool is a command style design and analyzing package for scientific and technological algorithm and a matrix based computation language. In this paper, we present a compiler based approach to the implementation of the command mode generalized PDE solver in CEMTool. In contrast to the existing MATLAB PDE Toolbox, our proposed FEM package can deal with the combination of the reserved words such as "laplace" and "convect". Also, we can assign the border lines and the boundary conditions in a very easy way. With the introduction of the lexical analyzer and the parser, our FEM toolbox can handle the general boundary condition and the various PDEs represented by the combination of equations. That is why we need not classify PDE as elliptic, hyperbolic, parabolic equations. Consequently, with our new FEM toolbox, we can overcome some disadvantages of the existing MATLAB PDE Toolbox.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.10
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• pp.1590-1597
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• 2004

Three methods of design sensitivity analysis for structures such as numerical method, analytical method and semi-analytical method have been developed for the last three decades. Although analytical design sensitivity analysis can provide very exact result, it is difficult to implement into practical design problems. Therefore, numerical method such as finite difference method is widely used to simply obtain the design sensitivity in most cases. The numerical differentiation is sufficiently accurate and reliable fur most linear problems. However, it turns out that the numerical differentiation is inefficient and inaccurate in nonlinear design sensitivity analysis because its computational cost depends on the number of design variables and large numerical errors can be included. Thus the semi-analytical method is more suitable for complicated design problems. Moreover, semi-analytical method is easy to be performed in design procedure, which can be coupled with an analysis solver such as commercial finite element package. In this paper, implementation procedure fur the semi-analytical design sensitivity analysis outside of the commercial finite element package is studied and the computational technique is proposed for evaluating the partial differentiation of internal nodal force, so called pseudo-load. Numerical examples coupled with commercial finite element package are shown to verify usefulness of proposed semi-analytical sensitivity analysis procedure and computational technique for pseudo-load.