• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.199-199
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• 2010

최근 평판 디스플레이 산업의 발전에 따라 능동행렬 액정 표시 소자 (AMOLED : Active Matrix Organic Liquid Crystral Display) 가 차세대 디스플레이 분야에서 각광을 받고있다. 기존의 TFT-LCD에 사용되는 a-Si:H는 균일도가 좋지만 전기적인 스트레스에 의해 쉽게 열화되고 낮은 이동도는 갖는 단점이 있으며, ELA (Eximer Laser Annealing) 결정화 poly-Si은 전기적인 특성은 좋지만 uniformity가 떨어지는 단점을 가지고 있어서 AMOLED 및 대면적 디스플레이에 적용하기 어렵다. 따라서 a-Si:H TFT보다 좋은 전기적인 특성을 보이며 ELA 결정화 poly-Si TFT보다 좋은 uniformity를 갖는 SPC (Solid Phase Crystallization) poly-Si TFT가 주목을 받고있다. 본 연구에서는 차세대 디스플레이 적용을 위해서 glass 기판위에 증착된 a-Si을 SPC 로 결정화 시킨 후 TFT를 제작하고 평가하였다. 또한 TFT 형성시에 저온공정을 실현하기 위해서 소스/드레인 영역에 실리사이드를 형성시켰다. 소자 제작시의 최고온도는 $500^{\circ}C$ 이하에서 공정을 진행하는 저온 공정을 실현하였다. Glass 기판위에 a-Si이 80 nm 증착된 기판을 퍼니스에서 24시간 동안 N2 분위기로 약 $600^{\circ}C$ 에서 결정화를 진행하였다. 노광공정을 통하여 Active 영역을 형성시키고 E-beam evaporator를 이용하여 약 70 nm 의 Pt를 증착시킨 후, 소스와 드레인 영역의 실리사이드 형성은 N2 분위기에서 $450^{\circ}C$, $500^{\circ}C$, $550^{\circ}C$에서 열처리를 통하여 형성하였다. 게이트 절연막은 스퍼터링을 이용하여 SiO2를 약 15 nm 의 두께로 증착하였다. 게이트 전극의 형성을 위하여 E-beam evaporator 을 이용하여 약 150 nm 두께의 알루미늄을 증착하고 노광공정을 통하여 게이트 영역을 형성 후 에 $450^{\circ}C$, H2/N2 분위기에서 약 30분 동안 forming gas annealing (FGA)을 실시하였다. 제작된 소자는 실리사이드 형성 온도에 따라서 각각 다른 특성을 보였으며 $450^{\circ}C$에서 실리사이드를 형성시킨 소자는 on currnet와 SS (Subthreshold Swing)이 가장 낮은것을 확인하였다. $500^{\circ}C$와 $550^{\circ}C$에서 실리사이드를 형성시킨 소자는 거의 동일한 on current와 SS값을 나타냈다. 이로써 glass 기판위의 SB-TFT 제작 시 실리사이드 형성의 최적온도는 $500^{\circ}C$로 생각되어 진다. 위의 결과를 토대로 본 연구에서는 SPC 결정화 방법을 이용하여 SB-TFT를 성공적으로 제작 및 평가하였고, 차세대 디스플레이에 적용할 경우 우수한 특성이 기대된다.

• Proceedings of the IEEK Conference
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• 2004.06b
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• pp.375-378
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• 2004

In this paper, we fabricated pantacene TFTs using PVP copolymer and cross-linked PVP as gate insulator on glass and plastic (PET) substrate. Depending on the density of PVP and poly (melamine-co-formaldehyde) the performance has been changed. We obtained the best performance with the mobility of 0.12cm2/V sec and the on/off current ratio of $1.19{\times}10^6$ for the case of $10wt\%$ PVP copolymer mixed with $5wt\%$ poly(melamine-co-formaldehyde). Additionally using OTFTs with the above PVP gate insulator, we fabricated the integrated circuit including inverter which produced the gain of 5.56 on the glass substrate and gain of 9.7 on the plastic (PET) substrate. And the threshold voltage was respectively +8V and +14v$ldots$

• 한국정보디스플레이학회:학술대회논문집
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• 2004.08a
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• pp.957-961
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• 2004

In order to realize high performance thin film transistor (TFT) on plastic substrate, Si film was deposited on plastic substrate at 170$^{\circ}C$ by using inductivity coupled plasma chemical vapor deposition (ICPCVD). Hydrogen concentration in as-deposited Si film was 3.8% which is much lower than that in film prepared by using conventional plasma enhanced chemical vapor deposition (PECVD). Si film was deposited as micro crystalline phase rather than amorphous phase even at 170$^{\circ}C$ because of high density plasma. By step-by-step Excimer laser annealing, dehydrogenation and recrystallization of Si film were carried out simultaneously. With step-by-step annealing and optimization of underlayer structure, it has succeeded to achieve large grain size of 300nm by using ICPCVD. Base on these results, poly-Si TFT was fabricated on plastic substrate successfully, and it is sufficient to drive pixels of OLEDs, as well as LCDs.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1998.06a
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• pp.239-242
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• 1998

Ca $F_2$ films have superior gate insulator properties than conventional gate insulator such as $SiO_2$, Si $N_{x}$, $SiO_{x}$, and T $a_2$ $O_{5}$ to the side of lattice mismatch between Si substrate and interface trap charge density( $D_{it}$). Therefore, this material is enable to apply Thin Film Transistor(TFT) gate insulator. Most of gate oxide film have exhibited problems on high trap charge density, interface state in corporation with O-H bond created by mobile hydrogen and oxygen atom. This paper performed Ca $F_2$ property evaluation as MIM, MIS device fabrication. Ca $F_2$ films were deposited at the various substrate temperature using a thermal evaporation. Ca $F_2$ films was grown as polycrystalline film and showed grain size variation as a function of substrate temperature and RTA post-annealing treatment. C-V, I-V results exhibit almost low $D_{it}$(1.8$\times$10$^{11}$ $cm^{-1}$ /le $V^{-1}$ ) and higher $E_{br}$ (>0.87MV/cm) than reported that formerly. Structural analysis indicate that low $D_{it}$ and high $E_{br}$ were caused by low lattice mismatch(6%) and crystal growth direction. Ca $F_2$ as a gate insulator of TFT are presented in this paper paperaper

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.04a
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• pp.73-77
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• 2003

The backlight unit(BLU) is used as a light source of TFT liquid-crystalline-display (TFT-LCD) module. In this backlight unit, one of important components is the light guide, which is usually made of transparent polymers. Currently the screen-printing method is mainly used for the light guide as a manufacturing process. However, it has limitation to the flexibility of three-dimensional optical design. In the present paper a new alternative manufacturing method for the light guide with low-cost is proposed. This manufacturing method is named as direct surface forming (DSF), which is very similar to the well-known hot embossing except for partial contact between mold and substrate. The results of this new manufacturing method are presented in terms of processing condition, dimensional accuracy, productivity, etc.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1122-1125
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• 2006

The TFT performances were enhanced and stabilized by plasma oxidation of the polycrystalline Si surface prior to the plasma enhanced atomic layer deposition of $Al_2O_3$ gate dielectric film. We attribute the improvement to the formation of a high quality oxide interface layer between the gate dielectric film and the poly-Si film. The interface oxide has a predominant effect on the TFT's characteristics, and is regulated by the gap distance between the electrode and the polycrystalline Si surface.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.185-188
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• 2002

In this paper, Amorphous silicon on glass substrate was recrytallized to poly-crystalline silicon by solid phase crystallization(SPC) technology The active region of thin film transistor(TFT) was fabricated by amorphous silicon. The output and transfer characteristics of thin film transistor with lightly doped drain(LDD) structure was measured and analyzed. As a results, analyzed TFT's reliability with LDD's length by various kinds argument such as sub-threshold swing coefficient, mobility and threshold voltages were evaluated. Stress effects in TFT were able to improve to the characteristics of turn-on current and hot carrier effects by LDD's length variations

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.163-166
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• 2002

We studied the growth of large-grain pentacene film by organic vapour phase deposition. The optimizations of the growth of pentacene are carried out by varying the gas pressure in the reactor and substrate temperature. We found that the grain size depends strongly on the gas pressure in the reactor. The grain size of $20{\mu}m$ has been obtained at the gas pressure of 200 Torr. The film was found to be strongly (001) oriented and its grain size decreases with decreasing the gas pressure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.10
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• pp.1114-1119
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• 2004

The photodepositioned tungsten film by laser CVD has been carried out the taping test with scotch tape over 10 times. As a result, it exhibited strong adhesion to the under-film such as ITO and SiNx patterned on the LCD substrate. However, it was seriously attacked by alkaline solution used for removing polyimide. And a thickness of laser CVD tungsten film had a close relation to a speed of laser scanning. Also we have improved the success rate of a laser CVD repair with making two pairs of contact hole structure and decreasing laser scanning speed.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.260-260
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• 2010

현대 사회가 고도의 정보화 사회로 변화하는 가운데 능동행렬 액정 표시 소자(AMLCD : Active Matrix Liquid Crystal Display)는 정보 디스플레이 분야에서 없어서는 안될 중요한 위치를 차지하게 됐다. AMOLED는 자체발광형이므로 LCD에 비해 시야각, contrast, 시인성이 우수하며, 화소를 낮은 전류 밀도로 구동시킨다는 장점이 있다. OLED 소자는 각 화소를 구동할 수 있는 박막 트랜지스타가 필요하며, OLED 소자와 결합된 TFT의 연구도 진행되고 있다. 더욱이 모바일 소자에서 낮은 구동 전압과 비용의 절감을 위해 System On Panels (SOP)에 대한 연구가 또한 진행되고 있다. LCD 패널위에 콘트롤러와 메모리와 같은 소자를 직접화시킴으로써 액정 표시 장치를 소형화시킬 수 있으며 신뢰성을 향상시킬 수가 있다. 본 연구에서는 SOP를 위한 ELA 방법을 통하여 결정화한 poly-Si TFT memory를 제작하여 전기적 특성을 조사하였다.