• Title/Summary/Keyword: TDR simulation

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Equivalent Circuit Model of RF passive components based on its simulated frequency response data (EM Solver 의 주파수 응답 데이터를 이용한 RF 수동 소자의 등가회로 모델링에 관한 연구)

  • Oh, Sang-Bae;Ko, Jae-Hyeong;Han, Hyeong-Seok;Kim, Hyeong-Seok
    • 한국정보통신설비학회:학술대회논문집
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    • 2007.08a
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    • pp.27-30
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    • 2007
  • This paper deals with an equivalent circuit model for RF passive components. Rational functions are obtained from the frequency responses of EM simulation by using Foster canonical partial fraction expressions. The Vector Fitting(VF) and the Adaptive Frequency Sampling(AFS) scheme are also implemented to obtain the rational functions. A passivity enforcement algorithm is applied to ensure the stability of the equivalent circuit model. In order to verify the schemes, S parameters of the equivalent circuit model is compared to those of EM simulation in case of the microstrip line structure with 3 slots in ground.

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Transmission Line Parameter Extraction and Signal Integrity Verification of VLSI Interconnects Under Silicon Substrate Effect (실리콘 기판 효과를 고려한 VLSI 인터컨넥트의 전송선 파라미터 추출 및 시그널 인테그러티 검증)

  • 유한종;어영선
    • Journal of the Korean Institute of Telematics and Electronics C
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    • v.36C no.3
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    • pp.26-34
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    • 1999
  • A new silicon-based IC interconnect transmission line parameter extraction methodology is presented and experimentally examined. Unlike the PCB or MCM interconnects, a dominant energy propagation mode in the silicon-based IC interconnects is not quasi-TEM but slow wave mode(SWM). The transmission line parameters are extracted taking the silicon substrate effect (i.e., slow wave mode) into account. The capacitances are calculated considering silicon substrate surface as a ground. Whereas the inductances are calculated by using an effective dielectric constant. In order to verify the proposed method, test patterns were designed. Experimental data have agreement within 10%. Further, crosstalk noise simulation shows excellent agreements with the measurements which are performed with high-speed time domain measurement ( i.e., TDR/TDT measurements) for test pattern, while RC model or RLC model without silicon substrate effect show about 20~25% underestimation error.

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Implementation of Windows Based Underground Pipe Network Monitoring System Reproduced with Embedded Program (임베디드 프로그램으로 재구성한 윈도우 기반 지하관망 모니터링 시스템의 구현)

  • Park, Jun-Tae;Hong, In-Sik
    • Journal of Korea Multimedia Society
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    • v.14 no.8
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    • pp.1041-1049
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    • 2011
  • According to the development of society and infrastructure, effective underground facility management is growing more important them ever. In the process various monitoring systems are studied and developed for water works pipe-network. Especially, RTD-1000 system with the based on Pc. Reflector-monitoring device is constructed and steered by several local governments. But, this system have to be improved result from based on PC system structure at the point of resource management, heat, power consumption and size. In this paper, RTD-2000 is proposed are a substitution of improved RTD-1000 with many respect and portable one. This system is designed and implemented with ARM-9 development kit based on WinCE and LCD eliminate TDR(Time Domain Reflector-Meter). Various surveillance programs based on windows are mounted on RTD-1000 are replaced with dedicated embedded application softwares. Simulation and evaluation for performance comparison are performed for the prove of effectiveness of RTD-2000.

An Experimental and Simulation Analysis of Condensation in the Walk-in Closet Attached to Apartment Bathroom (욕실과 인접한 아파트 드레스룸의 결로 원인 분석)

  • Choi, Young-Woo;Kim, Sean Hay
    • KIEAE Journal
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    • v.17 no.4
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    • pp.89-94
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    • 2017
  • Purpose: Condensation in walk-in closets attached to apartment bathroom has been known as an emerging issue that may threat occupants' comfort and health. Despite a number of design guidelines and enforcements to prevent condensation, condensation issues may still occur depending on various cases and scenarios. We aim to identify what condensation scenarios may lead to walk-in closet condensation and/or worse the existing condensation issues. Method: First we choose an actual walk-in closet of an apartment that suffers from sporadic condensation and resulting mold and mildew. Then we observe its relative humidity and temperature after the bathroom is used, in which excessive vapor is thought to be transported to the walk-in closet. We analyze Temperature Difference Ratio - a domestic indicator of condensation occurrence, and dew point temperature to compare it with surface temperature using 2D heat transfer simulation upon various condensation scenarios. Result: TDR of the test walk-in closet turns out be OK despite mold and mildew actually occurring. Hot water pipe installed in the floor would greatly reduce condensation. If hot water pipe in the upper floor, however, is not used, or hot water pipe of the closet is turned off during swing seasons, it is expected that condensations may still occur.

Insulation Performance and Heating and Cooling Energy Consumption depending on the Window Reveal Depth in External Wall Insulation (외단열 벽체에서 창호 설치 위치에 따른 단열성능 및 냉난방 에너지 소비량)

  • Rhee, Kyu-Nam;Jung, Gun-Joo
    • Journal of the Architectural Institute of Korea Structure & Construction
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    • v.33 no.12
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    • pp.91-98
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    • 2017
  • In this study, the effect of window installation position in the residential building with the external insulation was numerically investigated in terms of insulation performance and heating/cooling energy consumption. For different window positions, 2-D heat transfer simulation was conducted to deduce the linear thermal transmittance, which was inputted to the dynamic energy simulation in order to analyze heating/cooling energy consumption. Simulation results showed that the linear thermal transmittance ranges from 0.05 W/mK to 0.7 W/mK, and is reduced as the window is installed near the external finish line. Indoor surface temperature and TDR analysis showed that the condensation risk is the lowest when the window is installed at the middle of the insulation and wall structure. It was also found that the window installation near the external finish can reduce the annual heating/cooling energy consumption by 12~16%, compared with the window installation near the interior finish. Although the window installation near the external finish can achieve the lowest heating/cooling energy consumption, it might lead to increased condensation risks unless additional insulation is applied. Thus, it can be concluded that the window should be installed near the insulation-wall structure junction, in consideration of the overall performance including energy consumption, condensation prevention and constructability.