• Proceedings of the IEEK Conference
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• 2000.06b
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• pp.20-23
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• 2000

We have investigated a process for the preparation of high-quality tantalum oxynitride ( $T_{a}$ $O_{x}$ $N_{y}$) via the N $H_3$ annealing of 7$_{a2}$ $O_{5}$, for use in gate dielectric applications. Compared with tantalum oxide (7$_{a2}$ $O_{5}$), a significant improvement in the dielectric constant was obtained by the N $H_3$ treatment. In addition, light reoxidation in a wet ambient at 45$0^{\circ}C$ resulted in a significantly reduced leakage current. We confirmed nitrogen incorporation in the tantalum oxynitride ( $T_{a}$ $O_{x}$ $N_{y}$ by Auger Electron Spectroscopy. By optimizing the nitridation and reoxidation process, we obtained an equivalent oxide thickness as thin as 1.6nm and a leakage current of less than 10mA/$\textrm{cm}^2$ at 1.5V..5V..5V..5V..5V..5V.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.829-832
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• 2005

This paper describes a wide-range dual-loop Delay Locked Loop (DLL) using Voltage Controlled Delay Line (VCDL) based on Transmission Gate(TG) inverters. One loop is used when the minimum VCDL delay is greater than a half of $T_{REF}$, the reference clock period. The other loop is initiated when the minimum delay is less than $0.5{\times}T_{REF}$. The proposed VCDL improves the dynamic operation range of a DLL. The DLL with a VCDL of 10 TG inverters provides a lock range from 70MHz to 700MHz when designed using $0.18{\mu}m$ CMOS technology with 1.8 supply voltage. The DLL consumes 11.5mW for locking operation with a 700MHz reference clock. The proposed DLL can be used for high-speed memory devices and processors, communication systems, high-performance display interfaces, etc.

• Journal of Multimedia Information System
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• v.6 no.4
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• pp.323-328
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• 2019

In this paper, a method of constructing an advanced sequential circuit over finite fields is proposed. The method proposed an algorithm for assigning all elements of finite fields to digital code from the properties of finite fields, discussed the operating characteristics of T-gate used to construct sequential digital system of finite fields, and based on this, formed sequential circuit without trajectory. For this purpose, the state transition diagram was allocated to the state dependency code and a whole table was drawn showing the relationship between the status function and the current state and the previous state. The following status functions were derived from the status function and the preceding table, and the T-gate and the device were used to construct the sequential circuit. It was confirmed that the proposed method was able to organize sequential digital systems effectively and systematically.

• Proceedings of the IEEK Conference
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• 2002.06b
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• pp.249-252
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• 2002

we have studied the characteristics of PHEMT's with gate recess etching method. The DC characterization of PHTMT fabricated with the wide single recess methods is a maximum drain current density of 319.4 ㎃/mm and a peak transconductance of 336.7 ㎳/mm. The RF measurements were obtained in the frequency range of 1~50GHz. At 50GHz, 3.69dB of 521 gain were obtained and a current gain cut-off frequency(f$_{T}$) of 113 CH and a maximum frequency of oscillation(f$_{max}$) of 172 Ghz were achieved from this device. On the other hand, a maximum drain current of 367 mA/mm, a peak transconduclancc of 504.6 mS/mm, S$_{21}$ gain of 2.94 dB, a current gain cut-off frequency(f$_{T}$) of 101 CH and a maximum frequency of oscillation(f$_{max}$) of 113 fa were achieved from the PHEMT's fabricated by the .narrow single recess methods.methods.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.2
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• pp.106-109
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• 2004

A high-density 3-transistor cell one-time programmable (OTP) ROM array using standard CMOS Gate-Oxide antifuse (AF) is proposed, fabricated, and characterized with $0.18{\mu}m$ CMOS process. The proposed non-volatile high-density OTP ROM is composed of an array of 3-T OTP cells with the 3-T consisting of an nMOS AF, a high voltage (HV) blocking transistor, and a cell access transistor, all compatible with standard CMOS technology.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.30A no.12
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• pp.60-68
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• 1993

Thw VLSI device of submicron level trends to have a low level of reliability because of hot carriers which are caused by short channel effects and which do not appear in a long-channel MOSFET operated in 5V. In order to minimize the generation of hot carrier, much research has been made into various types of drain structures. This study has suggested CG MOSFET (Concaved Gate MOSFET) as new drain structure and compared its electrical characteristics with those of the conventional MOSFET and LDD-structured MOSFET by making use of a simulation method. These three device were assumed to be produced by the LOCOS process and a computer-based analysis(PISCES-2B simulator) was carried out to verify the hot electron-resistant behaviours of the devices. In the present simulation, the channel length of these devises was 1.0$\mu$m and their DC characteristics, such as VS1DT-IS1DT curves, gate and substrate current, potential contours, breakdown voltage and electric field were compared with one another.

• JSTS:Journal of Semiconductor Technology and Science
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• v.10 no.2
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• pp.130-133
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• 2010

This paper presents a study of the influence of variation of counter doping thickness on short channel effect in symmetric double-gate (DG) nano MOSFETs. Short channel effects are estimated from the computed values of current-voltage (I-V) characteristics. Two dimensional Quantum transport equations and Poisson equations are used to compute DG MOSFET characteristics. We found that the transconductance ($g_m$) and the drain conductance ($g_d$) increase with an increase in p-type counter-doping thickness ($T_c$). Very high value of transconductance ($g_m=38\;mS/{\mu}m$) is observed at 2.2 nm channel thickness. We have established that the threshold voltage of DG MOSFETs can be tuned by selecting the thickness of counter-doping in such device.

• Annual Conference of KIPS
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• 2023.05a
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• pp.165-167
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• 2023

양자 컴퓨터는 기존의 클래식 컴퓨터와 달리 양자역학 원리를 활용해 정보 처리를 수행하며, 특정 문제들을 훨씬 빠르게 해결할 수 있다. 양자 컴퓨터는 큐빗을 기본 단위로 사용하고, 아다마르 게이트, CNOT 게이트, 파울리 게이트, 토플리 게이트 등을 조합하여 양자 회로를 구성한다. Toffoli 게이트는 유니버설 게이트 중 하나로, 세 개의 큐빗을 입력받아 조건부 (Controlled-Controlled) NOT 연산을 수행한다. 이 게이트는 복잡한 작업을 기본 양자 게이트로 분해할 수 있어, 회로의 게이트 수, 깊이 및 오류율 측면에서 최적화할 수 있다. 기본 양자 게이트 중 T 게이트는 노이즈와 오류에 영향을 받을 수 있으므로, T 게이트의 수와 깊이를 최적화하는 것이 중요하다. 본 논문은 Toffoli 게이트 분해를 통해 양자 회로의 게이트 수와 깊이를 최적화하는 방법을 조사한다.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.4
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• pp.377-387
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• 2012

An intrinsic small signal equivalent circuit model of Cylindrical/Surrounded gate MOSFET is proposed. Admittance parameters of the device are extracted from circuit analysis and intrinsic circuit elements are presented in terms of real and imaginary parts of the admittance parameters. S parameters are then evaluated and justified with the simulated data extracted from 3D device simulation.

• Journal of information and communication convergence engineering
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• v.9 no.5
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• pp.583-586
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• 2011

In this paper, subthreshold swing characteristics have been presented for double-gate MOSFETs, using the analytical model based on series form of potential distribution. Subthreshold swing is very important factor for digital devices because of determination of ON and OFF. In general, subthreshold swings have to be under 100mV/dec. The channel length $L_g$ is varied from 30nm to 100nm, and channel thickness $t_{si}$ from 15 to 20nm according to channel length, and oxide thickness 5nm to investigate subthreshold swing. The doping of channel is fixed with $10^{16}cm^{-3}$ p-type. The results show good agreement with numerical simulations, confirming this model.