• Title/Summary/Keyword: System-in-Package

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An expert system for control system designs (제어시스템 설계를 위한 전문가 시스템)

  • 권욱현;박재현;김상우
    • 제어로봇시스템학회:학술대회논문집
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    • 1987.10b
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    • pp.277-281
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    • 1987
  • This paper describes the development of an expert system for control system designs. Our CACSD expert system consists of 2 parts; one is the knowledge manager and the other is the CACSD package. The knowledge manager contains the inference engine and the control experts' knowledge. The CACSD package consists of the control algorithms used by the knowledge manager. The prototype system of our CACSD expert system is implemented on the IBM PC/AT and the results of tests are given in this paper.

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Development of Curing Process for EMC Encapsulation of Ultra-thin Semiconductor Package (초박형 반도체 패키지의 EMC encapsulation을 위한 경화 공정 개발)

  • Park, Seong Yeon;On, Seung Yoon;Kim, Seong Su
    • Composites Research
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    • v.34 no.1
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    • pp.47-50
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    • 2021
  • In this paper, the Curing process for Epoxy Molding Compound (EMC) Package was developed by comparing the performance of the EMC/Cu Bi-layer package manufactured by the conventional Hot Press process system and Carbon Nanotubes (CNT) Heater process system of the surface heating system. The viscosity of EMC was measured by using a rheometer for the curing cycle of the CNT Heater. In the EMC/Cu Bi-layer Package manufactured through the two process methods by mentioned above, the voids inside the EMC was analyzed using an optical microscope. In addition, the interfacial void and warpage of the EMC/Cu Bi-layer Package were analyzed through C-Scanning Acoustic Microscope and 3D-Digital Image Correlation. According to these experimental results, it was confirmed that there was neither void in the EMC interior nor difference in the warpage at room temperature, the zero-warpage temperature and the change in warpage.

The Low Height Looping Technology for Multi-chip Package in Wire Bonder (와이어 본더에서의 초저 루프 기술)

  • Kwak, Byung-Kil;Park, Young-Min;Kook, Sung-June
    • Journal of the Semiconductor & Display Technology
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    • v.6 no.1 s.18
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    • pp.17-22
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    • 2007
  • Recent new packages such as MCP(Multi-Chip Package), QDP(Quadratic Die Package) and DDP(Dual Die Package) have stack type configuration. This kind of multi-layer package is thicker than single layer package. So there is need for the low height looping technology in wirebonder to make these packages thinner. There is stiff zone above ball in wirebonder wire which is called HAZ(Heat Affect Zone). When making low height loop (below $80\;{\mu}m$) with traditional forward loop, stiff wire in HAZ(Heat Affected Zone) above ball is bended and weakened. So the traditional forward looping method cannot be applied to low height loop. SSB(stand-off stitch) wire bonding method was applied to many packages which require very low loops. The drawback of SSB method is making frequent errors at making ball, neck damage above ball on lead and the weakness of ball bonding on lead. The alternative looping method is BNL(ball neckless) looping technology which is already applied to some package(DDP, QDP). The advantage of this method is faster in bonding process and making little errors in wire bonding compared with SSB method. This paper presents the result of BNL looping technology applied in assembly house and several issues related to low loop height consistence and BNL zone weakness.

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Development of decision supporting package for the design of a physical distribution system (물류시스템 설계를 위한 의사결정지원 패키지의 개발)

  • 송성헌;양병학
    • Korean Management Science Review
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    • v.10 no.2
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    • pp.79-91
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    • 1993
  • Strategic decisions related to the design of a physical distribution system can be classified into three basic components : facility location, transportation, inventory decisions. In this research the interdependence of those decisions are expressed in a mathematical model such that the total relevant cost of the system is minimized. We suggested a heuristic technique for solving the model. In broad terms, our solution technique combines a heuristic method for determining which candidate DCs to open and an exact method for minimizing costs given a set of open DCs. And we also developed a decision supporting package for the design of a physical distribution system.

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Quality Changes of Frozen Scallop[Patinopecten yessonensis(Jay)] Stored in theDomestic Refriogerator (가정용 냉장고에서 동결저장 중의 가리비의 품질 변화)

  • 김상무
    • Journal of the Korean Society of Food Science and Nutrition
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    • v.26 no.3
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    • pp.450-455
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    • 1997
  • Scallop, Patinopecten yessonensis(Jay), cultivated in the cold east coast of Kwangwon region, Korea, is expected to be producted to about 50,000 tones in 2000 year. Freezing is one of the most effective methods applied for soraging seafoods. But, the domestic refrigerator with an automatic defrost system shows the temperature fluctuation during defrosting, thus might result in the deterioration of the frozen foods. In this study, the domestic refrigerator with an automatic defrost system, temperature fluctuation from -18 to -5$\pm$1$^{\circ}C$ and fluctuation intervals from 16 to 20 hr, was used for storing scallop. pH was decreased rapidly after 3 month storage, while the content of amino nitrogen was increased continuously. The TMA content of open state was increased very rapidly on 3 month storage and then increased slowly, whereas that of vinyl package increased slowly. The VBN content was increased almost constantly with no significant differences between storage methods. The TBA content was increased up to 3 month storage with the higher value in open state than vinyl package in the beginning periods of storage, and then decreased very rapidly. The number of total viable cell was increased continuously during storage with higher number in open state than vinyl package. The estimated shelf-lives of frozen scallop with open state and vinyl package stored at -18$^{\circ}C$ in the domestic refrigerator with an automatic defrost system were 3.55 and 3.78 months, respectively.

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An Practical Study on the Effect of ERP System Introduction Type on the Enterprise's IT·SW Utilization (ERP 시스템 도입유형이 기업의 IT·SW 활용에 미치는 영향에 관한 실증연구)

  • Yang, Heejung;Sung, Wookjoon
    • Journal of Information Technology Services
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    • v.20 no.2
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    • pp.57-76
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    • 2021
  • Today's ERP system has become a core system of IT·SW that not only supports and manages enterprise resources efficiently, but also encompasses major business tasks. In other words, the ERP system is an essential strategic element for the survival of a company as a powerful means to innovate the management of an organization. This study analyzed the impact on the utilization of IT·SW from the perspective of the entire organization's process without limiting the performance evaluation of the ERP system itself, which is a core system of a company. The measurement data for evaluating the performance of the ERP system was the 2018 domestic company IT·SW utilization survey result report (subject to survey : 3,017 domestic companies with 10 or more employees). Based on this data, this study analyzed the impact of the ERP system on the entire enterprise's IT·SW utilization. In particular, attention was paid to whether there would be a difference in the use of IT·SW if the type of ERP system introduction was changed through the improvement of the business process of the company. Multiple regression analysis was performed using the statistical package SPSS 25. As a result, among the ERP system introduction types, the greatest degree of (+)influence on the company's IT·SW utilization is when the ERP package SW or ASP service is used as it is. Although the difference is insignificant, the second case was to build an ERP system through self-development or outsourcing, followed by customizing the package SW or system through self-development or outsourcing. Through the results of this study, it is expected that the organization will improve the business process and use the standard ERP package SW as it is without modification, thereby effectively enhancing the use of IT·SW of the company and leading to management performance.

A System Development for Management of On-the-spot Using the Event Management Theory (EVENT 관리기법을 응용한 건설현장관리시스템에 관한 연구)

  • Yoon, In;Jeong, Chang-Won;Choi, Young-Sik;Yoon, Min
    • Journal of the Korean Society of Industry Convergence
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    • v.2 no.1
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    • pp.113-119
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    • 1999
  • In order to accomplish either information system with future estimate or scientic management, application package of integrated detail management is required for Construction Company. The application package of integrated detail management is based on management of estimation, management of account. management of tax bill, management of on the spot, management of equipment and management of labor. This research focuses on the basic survey for this system such as circumstance of information system for construction company, a barrier of progress, development dirction, development article.

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Cost-effective Power Module Package using Leadframe and Ceramic substrate

  • Jeon, O-S;Jeun, G-Y;Park, S-Y;Lee, K-H;Kim, B-G
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2001.04a
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    • pp.9-25
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    • 2001
  • Fairchild has been developing a new class IPM called SPM consisting of dramatic Packaging technology to achieve the lowest cost rind better performance for low power home appliances and industrial AC drive applications. The first Fairchild SPM development with IGBT 600V/15A for washing machine application started in 1999 and was completed successfully. Fairchild SPMs are going to be the best solution for low power inverter-driven AC drive system after 2001. The new SPM Packages like SPM ∥ and SPIM for the next generation IPM with the highest competitiveness (cost & performance) shall be continuouslly developed.

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A Study on Influence of Corporate Factor and ITO Range Factor on Outsourcing Performance -Moderating Effect of Supplier Suitability

  • YI, Seon-Gyu
    • Journal of the Korea Society of Computer and Information
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    • v.22 no.2
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    • pp.111-117
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    • 2017
  • This study analyzes the relative importance of the introducing factors for the critical success factors in the implementation stage of the lifecycle of ERP system using Delphi technique and Analytic Hierarchy Process(AHP). In the 1st layer of the hierarchy, technical factor is evaluated as the most important factor among organizational, technical, and supplier factors. In the 2nd layer, choosing a proper ERP package is evaluated as the most important factor within 15 factors followed by process-oriented approach, technical suitability, minimized customization, integration and association of system with trading parter, association with legacy systems, and support and involvement of top management. As a result of this analysis enterprise should choose an ERP package that is suitable to its business environment, and make the best use of(take full advantage of) best practice that ERP package provides to optimize the existing business procedure or process(to approach the existing business procedure or process). This study also shows the range of customization of the features provided by the ERP package should be minimized.

A System-in-Package (SiP) Integration of a 62GHz Transmitter for MM-wave Communication Terminals Applications

  • Lee, Young-Chul;Park, Chul-Soon
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.3
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    • pp.182-188
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    • 2004
  • We demonstrate a $2.1\;{\times}\;1.0\;{\times}\;0.1cm^3$ sized compact transmitter using LTCC System-in-Package (SiP) technology for 60GHz-band wireless communication applications. For low-attenuation characteristics and resonance suppression of the SiP, we have proposed and demonstrated a coplanar double wire-bond transition and novel CPW-to-stripline transition integrating air-cavities as well as novel air-cavities embedded CPW line. The fabricated transmitter achieves an output of 13dBm at a RF frequency of 62GHz, an IF frequency of 2.4GHz, and a LO frequency of 59.6GHz. The up-conversion gain is 11dB, while the LO signal is suppressed with the image rejection mixer below -21.4dBc, and the image and spurious signals are also suppressed below -31dBc.