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A System-in-Package (SiP) Integration of a 62GHz Transmitter for MM-wave Communication Terminals Applications  

Lee, Young-Chul (School of Engineering, Information and Communications University(ICU))
Park, Chul-Soon (School of Engineering, Information and Communications University(ICU))
Publication Information
JSTS:Journal of Semiconductor Technology and Science / v.4, no.3, 2004 , pp. 182-188 More about this Journal
Abstract
We demonstrate a $2.1\;{\times}\;1.0\;{\times}\;0.1cm^3$ sized compact transmitter using LTCC System-in-Package (SiP) technology for 60GHz-band wireless communication applications. For low-attenuation characteristics and resonance suppression of the SiP, we have proposed and demonstrated a coplanar double wire-bond transition and novel CPW-to-stripline transition integrating air-cavities as well as novel air-cavities embedded CPW line. The fabricated transmitter achieves an output of 13dBm at a RF frequency of 62GHz, an IF frequency of 2.4GHz, and a LO frequency of 59.6GHz. The up-conversion gain is 11dB, while the LO signal is suppressed with the image rejection mixer below -21.4dBc, and the image and spurious signals are also suppressed below -31dBc.
Keywords
mm-wave; System-in-Package; SiP; LTCC;
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