• 제목/요약/키워드: System in package

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객체지향형 제어 시스템 디자인 패키지의 개발 (Development of object oriented computer aided control systems design package)

  • 양광웅;박재현
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1996년도 한국자동제어학술회의논문집(국내학술편); 포항공과대학교, 포항; 24-26 Oct. 1996
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    • pp.441-444
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    • 1996
  • Object-oriented programming goes on increasing in many areas, as its advantages of flexibility and ease of maintenance have been recognized. As in usual programmings, the productivity and flexibility of CACSD package can be improved by adopting object-oriented programmin. This paper describes our efforts to implement an OO-CACSD(Object Oriented CACSD) package for control system design and simulation. Since the proposed OO-CACSD is based on the modularity, portability, reuseability, and matrix-oriented data structure, a control system can be not only modeled and simulated but also maintained easily.

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경쟁적 전력시장의 윈도우 기반 부하관리 시스템 패키지 개발 (A Development Of The Window-Based Load Management System Package In A Competitive Electricity Market)

  • 정구형;김진호;김발호
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2002년도 하계학술대회 논문집 A
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    • pp.441-443
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    • 2002
  • This paper presents a window-based load management system (LMS) package developed as a decision-making tool in the competitive electricity market. The presented LMS package can help the users to monitor system load patterns, analyze their past energy consumption and schedule the future energy consumption. The LMS package can also provide the effective information on real-time energy/cost monitoring, consumed energy/cost analysis, demand schedule and cost-savings. The developed LMS package can be used to establish the optimal demand schedule and consumption strategy.

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Development of a fully integrated simulation package for industrial robot

  • Lee, Min-Ki;Lee, Gwang-Nam;Lim, Kye-Young
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1988년도 한국자동제어학술회의논문집(국제학술편); 한국전력공사연수원, 서울; 21-22 Oct. 1988
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    • pp.1028-1032
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    • 1988
  • The purpose of this paper is the development of a fully integrated simulation package for industrial robot. The simulation package consists of kinematics, dynamics, and control. The kinematics contains trajectory plans and inverse kinematics. The dynamics combines manipulator dynamics and actuator dynamics including the effect of payloads and viscous frictions. The control is a hardware oriented scheme which contains position controller, velocity controller, current controller, and PWM generator. Thus, the simulation package can be used not only for theoretical purposes but also for development purposes in industry. Using this package, the characteristics and performances of the SCARA robot, which has been developed in GSIS, are investigated.

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PC를 이용한 자동제어시스템 개발 (Development of a process control package using PC)

  • 구영재;이준서;이인범;장근수
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 1991년도 한국자동제어학술회의논문집(국내학술편); KOEX, Seoul; 22-24 Oct. 1991
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    • pp.322-326
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    • 1991
  • A real time process control package was developed in an INTEL 80386 based PC and MS OS/2 environment using MS-C and MS-FORTRAN. RTACS(Real Time Advanced Control System), process control computer software for distributed or centralized architectures, is a package which meets functional requirements specified for typical continuous process applications like chemical processes. The package consists of 5 parts, which are DB(data base), OCF(Operator Console Functions), CL (Control logic Library), MSM(Multitasking and Scheduling, Manager) and UAI(User Applications Interface), based upon a table and function block architecture to improve the system performance.

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A Recommendation System for Health Screening Hospitals based on Client Preferences

  • Kim, Namyun;Kim, Sung-Dong
    • International journal of advanced smart convergence
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    • 제9권3호
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    • pp.145-152
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    • 2020
  • When conducting a health screening, it is important to select the most appropriate hospitals for the screening items. There are various packages in the screening hospitals, and the screening items and price are very different for each package. In this paper, we provide a method of recommending the screening packages in consideration of the customer's preferences such as screening items and minimum matching ratio. First, after collecting package information of hospitals, information such as basic items and optional items in the package are extracted. Then, we determine whether the client's screening items exist in the basic item or optional item of the package and calculate the matching rate of the package. Finally, we recommend screening packages with the lowest price while meeting the minimum matching rate suggested by the client. For performance analysis, we implement a prototype for recommending screening packages and provide the experimental results. The performance analysis shows that the proposed approach provides a real-time response time and recommends appropriate packages.

작업환경개선을 위한 목재포장공정에 있어서의 양끝절단포장적재장치 개발 (The package loading equipment development cutting both ends in the process of packaging lumber for improving the working environments)

  • 강지호;홍동표
    • 산업경영시스템학회지
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    • 제29권1호
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    • pp.135-142
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    • 2006
  • The package loading process of tile lumbering industry is an operation that after a pair of workers binds three or six lumber into a unit and cut the both ends of the lumber, carry and pack and load the weight cargo of 30-50kg. The package loading process causes lots of noise and wood dust when the lumber are cut and brings about the main cause of the musculoskeletal disorder when workers carry the heavy goods. Therefore, we developed the monolithic package loading equipment cutting both ends that is enable to improve the working method and environments of the existing package loading process. The noise and wood dust were reduced by developing the device and the main cause of shirking duties on working place was solved by preventing the musculoskeletal disorder and improving the working environments as excluding the work of carrying heavy goods.

근중 분포에 의한 포장된 백삼의 품질평가 (Quality Evaluation by Root Weight Distribution in White Ginseng Package)

  • 밝훈;김영희;양차범
    • Journal of Ginseng Research
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    • 제17권3호
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    • pp.219-223
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    • 1993
  • Assessment of root weight grade system for the numeral definition in Korea ginseng was tried by investigation of 13 boxes of the 15-root-grade of 4-year-old white ginseng as a model. In this case satisfaction to theoretical value was 58% in root weight and 50% in root number. The coefficient of variation (CV) was high (35%) for individual root weight in package. The CV of tap root weight 1 among package is low (7.1%) even though there was no significant correlation between tap root weight : and lateral root weight among roots. The mean percentage of tap root to root weight in each package ranged 61 to 74% with CV range of 16.5 to 33.2%. The CV was not much different between 1st and 2nd lateral root weight and the means was above 60%. Strict practice of numeral definition of root weight grade system will be prerequisite for chemical standardization of Korea ginseng.

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무아레 간섭계 초정밀 변위 측정장치의 설계 및 PBGA 패키지 열변형 측정에의 응용 (Submicro-displacement Measuring System with Moire Interferometer and Application to the Themal Deformation of PBGA Package)

  • 오기환;주진원
    • 대한기계학회논문집A
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    • 제28권11호
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    • pp.1646-1655
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    • 2004
  • A description of the basic principles of moire interferometry leads to the design of a eight-mirror four-beam interferometer for obtaining fringe patterns representing contour-maps of in-Plane displacements. The technique is implemented by the optical system using an environmental chamber for submicro-displacement mesurement. In order to estimate the reliability and applicabili쇼 of the system developed, the measurement of coefficient of thermal expansion (CTE) for a aluminium block is performed. Consequently, the system is applied to the measurement of thermal deformation of a WB-PBGA package assembly. Temperature dependent analyses of global and local deformations are presented to study the effect of the mismatch of CTE between materials composed of the package assemblies. Bending displacements of the packages and average strains of solder balls are documented. Thermal induced displacements calculated by FEM agree quantitatively with experimental results.

TFT/LCD 시스템 패키지 전기적 특성 분석 및 설계도구의 구현 (Development of a Tool for the Electrical Analysis and Design of TFT/LCD System Package)

  • 임호남;지용
    • 전자공학회논문지A
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    • 제32A권12호
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    • pp.149-158
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    • 1995
  • This paper describes the development of a software tool LCD FRAME that may guide the analyzing process for the electrical characteristics and the design procedure for constructing the thin film transistor liquid crystal display(TFT/LCD) packages. LCD FRAME can analyze its electrical characteristics from the TFT/LCD system package configuration, and provide the design variables to meet the user's requirements. These analysis and design procedure can be done in real time according to the model at simplified package level of TFT/LCD. LCD_FRAME is an object-oriented expert system which considers package elements as objects. With this LCD_FRAME software tool, we analyzed the I-V characteristics of a-Si TFT and its signal distortion which has maximum 1.58 $\mu$s delay along the panel scan line of the package containing 480 ${\times}$ 240 pixels. We designed the package structure of maximum 6.35 $\mu$s signal delays and 3360 ${\times}$ 780 pixels, and as a result we showed that the proper structure of 20 $\mu$m scan line width, 60$\mu$m panel TFT gate width and 8 $\mu$m gate length. This LCD_FRAME software tool provides results of the analysis and the design in the form of input files of the SPICE program, text data files, and graphic charts.

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COH형 LED 패키지를 이용한 가로등 생산공정에 관한 연구 (A Study on Manufacturing Processes of Street-lighting System using COH LED Package)

  • 이종항;양근주
    • 한국정밀공학회지
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    • 제30권3호
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    • pp.349-355
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    • 2013
  • Recent high oil price results in the development of energy saving technology such as LED lighting system. Street-lighting system using COH LED package can save energy because the heat dissipation through cupper base is better than conventional technology. Studies on manufacturing processes of lighting system are insufficient even though LED package design and its heat analysis have been studied. This study focuses on the problem and solution of manufacturing processes such as LED packaging process, optimized emission angle, and LED bar dimension for mechanical assembly. As a result, we established better manufacturing alternatives of LED packaging and street-lighting system with higher lighting efficiency of 84 lm/W, as well as good illumination intensity of 39.7 lux at 6 m from lighting source.