• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.25 no.8
• /
• pp.1302-1307
• /
• 2001

This study identifies the major coupling path by examining the variation of the coupled acoustic modal frequencies and modes. A 1/2-size acryl compartment model is designed and manufactured for the measurement and analysis of coupled acoustic modes. Due to acoustic coupling, a new acoustic mode appears in a low frequency range. This coupling affects only longitudinal acoustic modes of compartment. Experimental result shows that the package tray holes contribute to the coupling much more than the back seat and hole size is an important design factor to control low frequency acoustic modes in the coupled system.

• The Journal of Society for e-Business Studies
• /
• v.7 no.1
• /
• pp.129-140
• /
• 2002

To succeed in ERP construction, the purpose of ERP setup must be completed. To accomplish this end, it is required to analysis business process completely and make a plan in detail. For ERP providers', they must support a characterized ERP construction methodology and lower the construction cost by improving an ERP package by making it easy to customize. But, because imported EHP products that are supplied currently are designed for the standard and the rationality, they have a limit to support custom processes of domestic companies. On the contrary, ERP products by domestic companies are unable to support a consistent methodology of constructing ERP system. This is a main reason why much time and costs are consumed than that of an original plan. For solving the problems, ERP packages should provide a consistent process modeling methodology and a modeling tool which can support this methodology. Furthermore, customizing cost must be lowered by implementing reusable components from the process models. This Paper describes a component-based ERP Package system which has peculiar modeling tools and development tools. We describe the modeling methodology and the business component definition of the ERP system. Finally, we describe its customizing process based on these process designs and business components.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.17 no.6
• /
• pp.1509-1517
• /
• 1993

The purpose of this study is to develop a program for the automatic derivation of the symbolic equations necessary for the kinematic and dynamic analyses of the spatial mechanism. For this purpose, a symbolic manipulation package called MCSYMA is used. Every symbolic equation is formulated using relative joint coordinate to obtain the numerically efficient system equations. These equations are produced in FORTRAN statements and linked to a FORTRAN program for numerical analysis. Several examples are taken for comparison with the commercial package called DADS which is using Cartesian coordinate approach. Also, this symbolic formulation approach is compared with a conventional numerical approach for an example. The results show that this symbolic approach with relative joint coordinate system is most efficient in computational time among three and is recommended for the derivation of macro elements frequently used.

• The Journal of the Convergence on Culture Technology
• /
• v.8 no.2
• /
• pp.355-360
• /
• 2022

In this paper, we present design and developing method for EMS(environment monitoring system) of micro data center. This developing EMS monitors operating environment of micro data center and analyze sensing data through IoT(Internet of things) sensors in real time. Firstly we present configuration method of IoT sensing package and design method EMS hardware platform. Secondly we design data collector software for data collection of IoT sensor with different protocol and develop monitoring software of EMS. The data collector software consists of sensor collector module and collector manager module. Also we design EMS software which has micro service architecture structural style and component based business logic.

• Journal of KIISE:Computer Systems and Theory
• /
• v.32 no.2
• /
• pp.75-84
• /
• 2005

This research is to design a high performance NAND-type flash memory package with a smart buffer cache that enhances the exploitation of spatial and temporal locality. The proposed buffer structure in a NAND flash memory package, called as a smart buffer cache, consists of three parts, i.e., a fully-associative victim buffer with a small block size, a fully-associative spatial buffer with a large block size, and a dynamic fetching unit. This new NAND-type flash memory package can achieve dramatically high performance and low power consumption comparing with any conventional NAND-type flash memory. Our results show that the NAND flash memory package with a smart buffer cache can reduce the miss ratio by around 70% and the average memory access time by around 67%, over the conventional NAND flash memory configuration. Also, the average miss ratio and average memory access time of the package module with smart buffer for a given buffer space (e.g., 3KB) can achieve better performance than package modules with a conventional direct-mapped buffer with eight times(e.g., 32KB) as much space and a fully-associative configuration with twice as much space(e.g., 8KB)

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.15 no.5
• /
• pp.577-584
• /
• 2015

A photovoltaic (PV) system generates electricity by installing a solar energy array; therefore, the photovoltaic system can be easily exposed to external factors, which include environmental factors such as temperature, humidity, and radiation. These factors-as well as shading, in particular-lead to power degradation. When there is an output loss in the solar cell of a PV module package, the output loss is partly controlled by the bypass diode. As solar cells become highly efficient, the characteristics of series resistance and parallel resistance improve, and the characteristics of reverse voltage change. A bypass diode is connected in parallel to the string that is connected in series to the PV module. Ideally, the bypass diode operates when the voltage is -0.6[V] around. This study examines the bypass diode operating time for different types of crystalline solar cells. It compares the reverse voltage characteristics between the single solar cell and polycrystalline solar cell. Special modules were produced for the experiment. The shading rate of the solar cell in the specially made solar energy module was raised by 5% each time to confirm that the bypass diode was operating. The operation of the bypass diode is affected not only by the reverse voltage but also by the forward bias. This tendency was verified as the number of strings increased.

• Journal of the Semiconductor & Display Technology
• /
• v.21 no.2
• /
• pp.57-67
• /
• 2022

The curing characteristics of naphthalene type epoxy resin systems according to the change of curing agent were investigated to develop a new next-generation EMC(Epoxy Molding Compound) with excellent warpage characteristics, low thermal expansion, and excellent fluidity for WLP(Wafer Level Package). As epoxy resins, DGEBA, which are representative bisphenol type epoxy resins, NE-16, which are the base resins of naphthalene type epoxy resins, and NET-OH, NET-MA, and NET-Epoxy resins newly synthesized based on NE-16 were used. As a curing agent, DDM (Diamino Diphenyl Methane) and CBN resin with naphthalene moiety were used. The curing reaction characteristics of these epoxy resin systems with curing agents were analyzed through thermal analysis experiments. In terms of curing reaction mechanism, DGEBA and NET-OH resin systems follow the nth curing reaction mechanism, and NE-16, NET-MA and NET-Epoxy resin systems follow the autocatalytic curing reaction mechanism in the case of epoxy resin systems using DDM as curing agent. On the other hand, it was found that all of them showed the nth curing reaction mechanism in the case of epoxy resin systems using CBN as the curing agent. Comparing the curing reaction rate, the epoxy resin systems using CBN as the curing agent showed a faster curing reaction rate than them with DDM as a hardener in the case of DGEBA and NET-OH epoxy resin systems following the same nth curing reaction mechanism, and the epoxy resin systems with a different curing mechanism using CBN as a curing agent showed a faster curing reaction rate than DDM hardener systems except for the NE-16 epoxy resin system. These reasons were comparatively explained using the reaction rate parameters obtained through thermal analysis experiments. Based on these results, low thermal expansion, warpage reduction, and curing reaction rate in the epoxy resin systems can be improved by using CBN curing agent with a naphthalene moiety.

• Journal of Sensor Science and Technology
• /
• v.16 no.5
• /
• pp.325-330
• /
• 2007

For the application to optic devices, wafer level package including spacer with particular thickness according to optical design could be required. In these cases, the uniformity of spacer thickness is important for bonding strength and optical performance. Packaging process has to be performed at low temperature in order to prevent damage to devices fabricated before packaging. And if photosensitive material is used as spacer layer, size and shape of pattern and thickness of spacer can be easily controlled. This paper presents polymer bonding using thick, uniform and patterned spacing layer of SU-8 2100 photoresist for wafer level package. SU-8, negative photoresist, can be coated uniformly by spin coater and it is cured at $95^{\circ}C$ and bonded well near the temperature. It can be bonded to silicon well, patterned with high aspect ratio and easy to form thick layer due to its high viscosity. It is also mechanically strong, chemically resistive and thermally stable. But adhesion of SU-8 to glass is poor, and in the case of forming thick layer, SU-8 layer leans from the perpendicular due to imbalance to gravity. To solve leaning problem, the wafer rotating system was introduced. Imbalance to gravity of thick layer was cancelled out through rotating wafer during curing time. And depositing additional layer of gold onto glass could improve adhesion strength of SU-8 to glass. Conclusively, we established the coating condition for forming patterned SU-8 layer with $400{\mu}m$ of thickness and 3.25 % of uniformity through single coating. Also we improved tensile strength from hundreds kPa to maximum 9.43 MPa through depositing gold layer onto glass substrate.

• The Transactions of the Korean Institute of Electrical Engineers
• /
• v.37 no.12
• /
• pp.903-913
• /
• 1988

Induced voltage causing disturbances on the communication lines of electric train is dealt with when the AT power supply system is employed. Induction interference is of three types, namely, normal state induced voltage, unusual induced voltage in case of power faults, and noise-induced voltage. Calculation of induced voltages occurring in the AT system is more complicated and extensive than in the BT system. In this paper we obtain an algorithm to calculate the induced voltages on the communication lines in the AT system and an algorithm for the induced current in case of the accident that the line falls to the ground. These algorithms are developed to a package of computer programs and their validity was checked on a simulated system. We supply the measures to protect the communication lines suitable for the AT system and we can also evaluate the protection capabilities. Because of the ability to evaluate the protection measures, this package is expected to be very useful when electric train system is constructed on communication lines near the railroad.

• The KIPS Transactions:PartB
• /
• v.9B no.2
• /
• pp.245-254
• /
• 2002

IC package marking inspection system using machine vision locates and identifies the target elements from input image, and decides the quality of marking by comparing the extracted target elements with the standard patterns. This paper proposes an adaptive multi-level thresholding (AMLT) method which is suitable for a series of operations such as locating the target IC package, extracting the characters, and detecting the Pinl dimple. It also proposes a dynamic matching unit selection (DMUS) method which is robust to noises as well as effective to catch out the local marking errors. The main idea of the AMLT method is to restrict the inputs of Otsu's thresholding algorithm within a specified area and a partial range of gray values. Doing so, it can adapt to the specific domain. The DMUS method dynamically selects the matching unit according to the result of character extraction and layout analysis. Therefore, in spite of the various erroneous situation occurred in the process of character extraction and layout analysis, it can select minimal matching unit in any environment. In an experiment with 280 IC package images of eight types, the correct extracting rate of IC package and Pinl dimple was 100% and the correct decision rate of marking quality was 98.8%. This result shows that the proposed methods are effective to IC package marking inspection.