• 한국정보디스플레이학회:학술대회논문집
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• 2005.07a
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• pp.381-384
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• 2005

Driver IC is one of the key components on the LCD monitor and LCD/TV. The function of the driver IC is to transfer and forward the input signals to LCD panel module. Inside driver IC, there are several operating units which process the input signals and generate the appropriate size and resolution to the LCD panel module. LCD panel module will display these input signals. However, there are some difficulties which driver IC designer, LCD monitor and LCD/TV maker will face. Thus, this article addresses the function and difficulties on driver IC.

• Journal of Biomedical Engineering Research
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• v.24 no.6 s.81
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• pp.533-541
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• 2003

In the paper. the health card system to integrate several cards into one card for protecting patient's privacy and security problems is proposed. Firstly, it is defined the minimal data set for integrating several patient cards into one card using IC card, and developed the issuing system to issue the integrated patient IC card. In order to secure and certificate a patient's personal information. the integrated patient IC card has applied 3-DES and the PKI certificate authority based Windows 2000 is established. The receipt and reservation system for taking care of a healthcare has developed to cooperate with the existing hospital computer system. The integrating patient IC card system proposed in this paper is implemented to 11 hospitals and used for 1.000 patients. On the result of the simulation. the proposed system can receive or reserve for a patient to take care of healthcare in the simulated hospitals and also establish the basis of the mechanism to share a medical information.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.233-238
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• 1999

극 미세 기술과 이에 수반되는 고가 장비와 시설에 대한 대량 투자, 그리고 고속, 저전력, 멀티미디어로 대변되는 칩의 다기능화라는 반도체 기술의 기술적 측면과 산업적 측면을 조망한다. 이러한 환경 내에서 산업화 이전 핵심기술을 산·학·연이 공동 개발함으로써, 연구개발 위험도를 줄이고 국가적으로 핵심기술을 위한 인프라를 구축하고자 1998년부터 시작된 시스템집적반도체기반 기술개발사업 (System IC 2010 : A Collaborative Project for Excellence in Basic System IC Technology)의 내용과 방향을 제시하고자 한다.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.09a
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• pp.93-100
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• 2003

The continuing scaling trend in microelectronic circuit technology has a significant impact on the different IC interconnection and packaging technologies. These latter technologies have not kept pace with the IC scaling trends, resulting in a so-called“interconnect technology gap”. Multilayer thin film technology is proposed as a“bridge”- technology between the very high density IC technology and the coarse standard PCB technology. It is also a key enabling technology for the realisation of true“System-in-a-Package”(SIP) solutions, combining multiple“System-on-a-Chip”(SOC) IC's with other components and also integrating passive components in its layers. A further step is to use this technology to realise new functionalities on top of active wafers. These additional“above-IC”processed layers may e.g. be used for low loss, high speed on chip interconnects, clock distribution circuits, efficient power/ground distribution and to realize high Q inductors on chip.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.1-6
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• 2013

3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1236-1239
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• 2009

Each LCD TFT panel requires a power supply IC on the panel board. The IC provides the power rails for the timing controller, source and gated driver IC and others. The industry trend moves towards higher integrated devices. The challenge for the panel manufacturer is the development and implementation of such an IC in cooperation with the semiconductor supplier. If not done carefully the solution will not reduce the overall solution cost or can't provide the expected performance and reliability. This paper discusses the key considerations to successfully develop and integrate a highly integrated LCD bias IC into the system.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.27 no.2A
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• pp.124-129
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• 2002

We propose a wireless positioning system using IC-IPDL method that exploits the modified-IPDL method and the interference cancellation techniques to improve hearability. In the proposed system, IPDL method is modified to maintain the transmission of CPICH for stability of CDMA network Simultaneously in mobile CPICH is cancelled out using the interference cancellation techniques for improving hearability. The simulation results showed that the proposed location system has a compatible performance to the standard IPDL method though CPICH exists during idle period.

• Proceedings of the IEEK Conference
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• 1999.06a
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• pp.389-392
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• 1999

It is essential to estimate an effective inductance in a ground plane of muliti-layer IC package system in order to determine the simultaneous switching noise of the package. A new method to estimate the effective ground inductance in multi-layer IC package is presented. With the estimated ground plane inductance values, maximum switching noise variations according to the number of simultaneously switching drivers are investigated by developing a new SSN model. These results are verified by performing HSPICE simulation with the 0.35${\mu}{\textrm}{m}$ CMOS technology.

• International Journal of Quality Innovation
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• v.6 no.3
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• pp.70-94
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• 2005

The IC packaging industry heavily relies on shop floor information, necessitating the development of a model to flexibly define shop floor information and timely handle manufacturing data. This study presents a novel data model of product manufacturing flow to define shop floor information to effectively respond to accelerated developments in IC package industry. The proposed data model consists of four modules: operation template setup, general process setup, enhanced bill of manufacture (EBOMfr) setup, and work-order process setup. The data model can flexibly define the required shop floor information and decision rules for shop floor product manufacturing flow, allowing one to easily adopt changes of the product and on the shop floor. However, to handle floor dynamics of the IC packaging industry, this work also proposes a WIP (i.e. work-in-process) system for monitoring and controlling the product manufacturing flow on the shop floor. The WIP system integrates the data model with a WIP execution module. Furthermore, an illustrative example, the MIRL WIP System, developed by Mechanical Industrial Research Laboratories of Industrial Technology Research Institute, demonstrates the effectiveness of the proposed model.

• Proceedings of the KIEE Conference
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• 2002.07d
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• pp.2577-2579
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• 2002

In this paper, we describe a CMOS DC-DC converter with a variable output voltage(8-12V @100mA) for a portable battery-operated system applications. The proposed DC-DC converter is used along with a Pulse-Frequency Modulation (PFM) method and consists of a reference circuit, a feedback resistor, a controller, and an internal oscillator. The integrated DC-DC converter with two external passive components(L.C) has been designed and fabricated on a 0.6${\mu}m$ 2-poly, 3-metal CMOS process and could be applied to the Personal Digital Assistants(PDA), Cellular Phone, Laptop Computer, etc.