• Title/Summary/Keyword: Symmetric layer

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The Study for an Impulsive Spin-Up Flow in a Shallow Rectangular Container (얕은 사각용기에서의 순간 회전가속 유동에 관한 연구)

  • Im, Gwang-Ok;Gwon, Tae-Jong
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.25 no.3
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    • pp.339-346
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    • 2001
  • The impulsive spin-up flow in a shallow rectangular container is analyzed numerically by quasi 3-D unsteady laminar flow. In the non-inertia coordinates, the flow is generated by the virtual forces as Coriolis force, etc.. After the boundary layers grow up near sidewalls, primary vortexes separate from the sidewalls. As the Reynolds number increases, the subsidiary vortexes take place in the boundary layer. The rigid body rotation is started from the inner region and propagated to the outer region, finally all the fluid reaches the rigid body rotation. According to the Reynolds number and the aspect ratio, the development of vortex pattern is symmetric or asymmetric.

Enhanced impact echo frequency peak by time domain summation of signals with different source receiver spacing

  • Ryden, Nils
    • Smart Structures and Systems
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    • v.17 no.1
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    • pp.59-72
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    • 2016
  • The Impact Echo method can be used to measure the thickness of concrete plate like structures. Measurements are based on the identification of a clear thickness resonance frequency which can be difficult in very thick or highly attenuative plates. In this study the detectability of the measured resonant frequency is enhanced by time domain summation of signals with different source receiver spacing. The proposed method is based on the spatial and temporal properties of the first higher symmetric zero group velocity Lamb mode (S1-ZGV) which are described in detail. No application dependent tuning or filtering is needed which makes the method robust and suitable for implementation in automatic IE thickness measurements. The proposed technique is exemplified with numerical data and field data from a thick concrete wall and a highly attenuative asphalt concrete layer.

A Numerical Simulation of Horizontal Convection in Mesoscale (중규모에서의 수평대류에 관한 수치모의)

  • 정우식;이화운
    • Journal of Environmental Science International
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    • v.7 no.2
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    • pp.233-241
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    • 1998
  • This study Is concerned with properties of a thermal convection in a stably stratified Boussinesq fluid caused by partial heating at the lower boundary. For thins purpose, two-dimensional, nonrotating system was employed. U the heating is very strong, convection takes the form of a turbulent plume. Othenuse, remains laminar. If the partial heating at the bottom boundary Is symmetric. the convection takes the form of a trubuient plume. Otherwise remains but beating form Is not so signiacant as to alter the vergence in the lower layer at the center of the partial heating area. The temperature perturbation is characterized by the temperature 'Cross-Over' over the partial heating area. These features are cleared ac- cording to the Increase of temperature difference between the center and side part of the bottom boundary.

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Design of Metamaterial-Inspired Wideband Absorber at X-Band Adopting Trumpet Structures

  • Kim, Beom-Kyu;Lee, Bomson
    • Journal of electromagnetic engineering and science
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    • v.14 no.3
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    • pp.314-316
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    • 2014
  • This letter presents two types of metamaterial-inspired absorbers adopting resistive trumpet structures at the X band. The unit cell of the first type is composed of a trumpet-shaped resonator loading a chip resistor, a metallic back plane, and a FR4 (${\varepsilon}_r=4.4-j0.02$) substrate between them (single-layer). The absorption rate is 99.5% at 13.3 GHz. The full width at half maximum (FWHM) is 95 % at 11.2 GHz (from 5.9 to 16.5 GHz). The size of unit cell is $5.6{\times}5.6{\times}2.4mm^3$. The second type has been optimized with a $7{\Omega}$/square uniform resistive coating, removing the chip resistors but leading to results comparable to the first type. The proposed absorbers are almost insensitive to polarizations of incident waves due to symmetric geometry.

Characteristics for the Lift of Wing by 3-D Panel Method (3차원 패널법에 의한 WING의 양력계산에 관한 연구)

  • 김진석;이승건;김진안
    • Journal of Ocean Engineering and Technology
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    • v.8 no.2
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    • pp.31-37
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    • 1994
  • 3-Dimensional panel method is now developed to the level that one can calculate the lift of a three dimensional body with the same accuracy of wind tunnel test and some current codes can consider the boundary layer effects due to the viscosity and unsteady motion in the calculation of lift. This paper is also aimed to develop these kinds of computing programs, and as a beginning, the authors restricted the problems to the steady potential flow cases. The calculation of 3-Dimensional body, wing and tandem wing carried out, using source panel and vortex ring panel. Finally, the interactions between 3-Dimension symmetric body and a wing are also calculated.

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Numerical analysis of the receding contact problem of two bonded layers resting on an elastic half plane

  • Yaylaci, Murat;Terzi, Cemalettin;Avcar, Mehmet
    • Structural Engineering and Mechanics
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    • v.72 no.6
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    • pp.775-783
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    • 2019
  • The present study deals with the numerical analysis of the symmetric contact problem of two bonded layers resting on an elastic half plane compressed with a rigid punch. In this context, Finite Element Method (FEM) based software called ANSYS and ABAQUS are used. It is assumed that the elastic layers have different elastic constants and heights and the external load is applied to the upper elastic layer by means of a rigid stamp. The problem is solved under the assumptions that the contact between two elastic layers, and between the rigid stamp are frictionless, the effect of gravity force is neglected. To validate the constructed model and obtained results a comparison is performed with the analytical results in literature. The numerical results for normal stresses and shear stresses are obtained for various parameters of load, material and geometry and are tabulated and illustrated.

Prioritized Resource Allocation in Wireless Spectrum Pooling

  • Biglieri, Ezio;Lozano, Angel;Alrajeh, Nabil
    • Journal of Communications and Networks
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    • v.14 no.5
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    • pp.495-500
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    • 2012
  • A standard paradigm for the allocation of wireless resources in communication demands symmetry, whereby all users are assumed to be on equal footing and hence get equal shares of communication capabilities. However, there are situations in which "prime users" should be given higher priority, as for example in the transmission of emergency messages. In this paper, we examine a prioritization policy that can be implemented at the physical layer. In particular, we evaluate the performance of a prioritized transmission scheme based on spectrum pooling and on the assignment of higher signal-to-noise ratio channels to higher-priority users. This performance is compared to that of unprioritized (or "symmetric") schemes, and the impact of prioritization on the unprioritized users is discussed.

A Statistical Termodynamic Study of Phase Equilibria in Microemulsions

  • Kyung-Sup Yoo;Hyungsuk Park
    • Bulletin of the Korean Chemical Society
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    • v.12 no.3
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    • pp.334-342
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    • 1991
  • To investigate the phase equilibria and structural properties of microemulsions, we study a simple phenomenological model on the basis of the cubic lattice cell with which the oil- and water-filled cells are connected one another, respectively. The surfactant is assumed to be insoluble in both oil and water, and to be adsorbed at the oil-water interface. The Schulman condition, according to which the lateral pressure of the surfactant layer is compensated by the oil-water interfacial tension, is found to hold to good approximation in the middle-phase microemulsion. Our results show that the oil- and water-filled domains in that microemulsion are about 50-150 $\AA$ across, and depend sensitively on the curvature parameters. The phase diagram is not symmetric in this model. It may be asymmetrized intrinsically by non-equivalency of oil and water. The two- and tree-phase equilibria including critical points and critical endpoints are found.

A novel framework for the construction of cryptographically secure S-boxes

  • Razi Arshad;Mudassir Jalil;Muzamal Hussain;Abdelouahed Tounsi
    • Computers and Concrete
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    • v.34 no.1
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    • pp.79-91
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    • 2024
  • In symmetric cryptography, a cryptographically secure Substitution-Box (S-Box) is a key component of a block cipher. S-Box adds a confusion layer in block ciphers that provide resistance against well-known attacks. The generation of a cryptographically secure S-Box depends upon its generation mechanism. In this paper, we propose a novel framework for the construction of cryptographically secure S-Boxes. This framework uses a combination of linear fractional transformation and permutation functions. S-Boxes security is analyzed against well-known security criteria that include nonlinearity, bijectiveness, strict avalanche and bits independence criteria, linear and differential approximation probability. The S-Boxes can be used in the encryption of any grayscale digital images. The encrypted images are analyzed against well-known image analysis criteria that include pixel changing rates, correlation, entropy, and average change of intensity. The analysis of the encrypted image shows that our image encryption scheme is secure.

Fabrication Method of High-density and High-uniformity Solder Bump without Copper Cross-contamination in Si-LSI Laboratory (실리콘 실험실에 구리 오염을 방지 할 수 있는 고밀도/고균일의 Solder Bump 형성방법)

  • 김성진;주철원;박성수;백규하;이희태;송민규
    • Journal of the Microelectronics and Packaging Society
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    • v.7 no.4
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    • pp.23-29
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    • 2000
  • We demonstrate the fabrication method of high-density and high-quality solder bump solving a copper (Cu) cross-contamination in Si-LSI laboratory. The Cu cross-contamination is solved by separating solder-bump process by two steps. Former is via-formation process excluding Cu/Ti under ball metallurgy (UBM) layer sputtering in Si-LSI laboratory. Latter is electroplating process including Ti-adhesion and Cu-seed layers sputtering out of Si-LSI laboratory. Thick photoresist (PR) is achieved by a multiple coating method. After TiW/Al-electrode sputtering for electroplating and via formation in Si-LSI laboratory, Cu/Ti UBM layer is sputtered on sample. The Cu-seed layer on the PR is etched during Cu-electroplating with low-electroplating rate due to a difference in resistance of UBM layer between via bottom and PR. Therefore Cu-buffer layer can be electroplated selectively at the via bottom. After etching the Ti-adhesion layer on the PR, Sn/Pb solder layer with a composition of 60/40 is electroplated using a tin-lead electroplating bath with a metal stoichiometry of 60/40 (weight percent ratio). Scanning electron microscope image shows that the fabricated solder bump is high-uniformity and high-quality as well as symmetric mushroom shape. The solder bumps with even 40/60 $\mu\textrm{m}$ in diameter/pitch do not touch during electroplating and reflow procedures. The solder-bump process of high-uniformity and high-density with the Cu cross-contamination free in Si-LSI laboratory will be effective for electronic microwave application.

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