• Title/Summary/Keyword: Surface wetting test

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Optimization and modification of PVDF dual-layer hollow fiber membrane for direct contact membrane distillation; application of response surface methodology and morphology study

  • Bahrami, Mehdi;Karimi-Sabet, Javad;Hatamnejad, Ali;Dastbaz, Abolfazl;Moosavian, Mohammad Ali
    • Korean Journal of Chemical Engineering
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    • v.35 no.11
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    • pp.2241-2255
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    • 2018
  • RSM methodology was applied to present mathematical models for the fabrication of polyvinylidene fluoride (PVDF) dual-layer hollow fibers in membrane distillation process. The design of experiments was used to investigate three main parameters in terms of polymer concentration in both outer and inner layers and the flow rate of dope solutions by the Box-Behnken method. According to obtained results, the optimization was done to present the proper membrane with desirable properties. The characteristics of the optimized membrane (named HF-O) suggested by the Box-Behnken (at the predicted point) showed that the proposed models are strongly valid. Then, a morphology study was done to modify the fiber by a combination of three types of a structure such as macro-void, sponge-like and sharp finger-like. It also improved the hydrophobicity of outer surface from 87 to $113^{\circ}$ and the mean pore size of the inner surface from 108.12 to 560.14 nm. The DCMD flux of modified fiber (named HF-M) enhanced 62% more than HF-O when it was fabricated by considering both of RSM and morphology study results. Finally, HF-M was conducted for long-term desalination process up to 100 hr and showed stable flux and wetting resistance during the test. These stepwise approaches are proposed to easily predict the main properties of PVDF dual-layer hollow fibers by valid models and to effectively modify its structure.

Characteristics of Landslide Occurrence and Change in the Matric Suction and Volumetric Water Content due to Rainfall Infiltration (강우침투에 의한 산사태 발생 및 모관흡수력과 체적함수비의 변화 특성에 관한 연구)

  • Seo, Won-Gyo;Choi, Junghae;Chae, Byung-Gon;Song, Young-Suk
    • The Journal of Engineering Geology
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    • v.27 no.4
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    • pp.475-487
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    • 2017
  • We performed landslide flume tests to analyze characteristics of landslide occurrence and change in the ground materials due to rainfall infiltration. The test apparatus is composed of flume, rainfall simulator, and measurement sensors and landslides were triggered by heavy rainfall (Intensity=200 mm/hr) sprinkled at the above of an artificial slope. The measurement sensors for matric suction and volumetric water content were installed with 3 sets at shallow (GL-0.2 m), middle (GL-0.4 m), and deep depth (GL-0.6 m) in the slope and the tests were performed with in-situ, loose, and dense condition of each weathered soils of granite, gneiss, and mudstone. The analyses show that surface erosion was dominant in initial time of the test due to heavy rainfall and then landslides occur following locally happened transverse tension cracks. The characteristics of landslide were both shallow failure because of a spread of wetting front induced by the rainfall infiltration and retrogressive failure. While the matric suction was decreased rapidly without any precursor in the soil saturation, the volumetric water content was increased gradually, reached its maximum value, and then decreased rapidly with landslide.

Thermal-Hydro-Mechanical Behaviors in the Engineered Barrier of a HLW Repository: Engineering-scale Validation Test (고준위폐기물처분장 공학적방벽의 열-수리-역학적 거동 연구: 엔지니어링 규모의 실증실험)

  • Lee, Jae-Owan;Cho, Won-Jin
    • Tunnel and Underground Space
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    • v.17 no.6
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    • pp.464-474
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    • 2007
  • An enhancement in the performance and safety of a high-level waste repository requires a validation of its engineered barrier. An engineering-scale test (named "KENTEX") has been conducted to investigate the thermal-hydro-mechanical behaviors in the engineered barrier of the Korean reference disposal system The validation test started on May 31, 2005 and is still under operation. The experimental data obtained allowed a preliminary and qualitative interpretation of the thermal-hydro-mechanical behaviors in the bentonite blocks. The temperature was higher as it became closer to the heater, while it became lower as it was farther away from the heater. The water content had a higher value in the part close to the hydration surface than that in the heater part. The relative humidity data suggested that a hydration of the bentonite blocks might occur by different drying-wetting processes, depending on their position. The total pressure was continuously increased by the evolution of the saturation front in the bentonite blocks and thereby the swelling pressure. Near the heater region, there was also a significant contribution of the thermal expansion of bentonite and the vapor pressure in the pores of the bentonite blocks.

Wettability of SAC305-coated Cu Fabricated by Low Temperature Process Using Ultrafine SAC305 Nanoparticles (초미세 SAC305 나노입자를 사용한 저온 코팅법으로 제조된 SAC305 코팅 Cu의 솔더 젖음성)

  • Shin, Yong Moo;Choi, Tae Jong;Cho, Kyung Jin;Jang, Seok Pil;Lee, Jong-Hyun
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.3
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    • pp.25-30
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    • 2015
  • SAC-coated Cu specimens were fabricated by novel pad finish process using a phenomenon that metal nanoparticles less than 20 nm in diameter melted at a temperature lower than the melting point of bulk metal, and their wettabilities were evaluated. The thickness of SAC305 layer coated at low temperature of $160^{\circ}C$ using SAC305 ink was extremely thin as the level of several nanometers. It was analyzed by Auger electron spectroscopy that $Cu_6Sn_5$ intermetallic layer with a thickness of 10~100 nm and $Cu_3Sn$ intermetallic layer with a thickness of 50~150 nm were sequentially formed under the SAC305 coating layer. The thickness of formed intermetallic layers was thicker in electroplated Cu than rolled Cu, which attributed to improved surface roughness in the electroplated Cu. The improved surface roughness induces the contact, melting, and reaction of a larger number of SAC305 nanoparticles per the unit area of Cu specimen. In the wetting angle test using SAC305 solder balls, the Cu coated with SAC305 through the low temperature process presented evidently low wetting angles than those in non-coated Cu, indicating that only a few nanometer-thick SAC305 coating layer on Cu could also cause the enhancement of wettability.

Effect of Dampening Component on Printed Quality of Textbook in lithography printing (평판인쇄의 축임물 조성이 교과서 인쇄품질에 미치는 영향)

  • Koo, Chul-Whoi;Sim, Woo-Seok;Ha, Young Baeck
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.48 no.1
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    • pp.134-141
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    • 2016
  • Dampening in printing is not only used with plain water but also used with various substances like dampening additive, in order to improve the wetting property by lowering the surface tension and to control material for modifing the ink transfer characteristic with proper emulsification. We have studied the printing quality according to these, looking into interrelationship among the dampening solution's pH, electrical conductivity and IPA content, prescribing the proper usage and minimum usage of fountain solution and dampening additive. In this study, it shows good result when mixing at the 7 wt% dampening with additive solution, which is result from the color density of printed sheets in accordance with the change of dampening solution condition. And the printed density value calculated 1 hour after printing, it shows relatively safe value at the etch liquid 4 wt% and IPA addition 2 wt%. The dry down at this test showed similar results regardless of various dampening conditions on coated paper, but in case of uncoated paper, the dry down showed a quite gap of different due to the fast penetration to the paper.

A Study on Solderability of Sn-Ag-Cu Solder with Plated Layers in ʼn-BGA (ʼn-BGA에서 Sn-Ag-Cu 솔더의 도금층에 따른 솔더링성 연구)

  • 신규식;정석원;정재필
    • Journal of Welding and Joining
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    • v.20 no.6
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    • pp.59-59
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    • 2002
  • Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

A Study on Solderability of Sn-Ag-Cu Solder with Plated Layers in $\mu-BGA$ ($\mu-BGA$에서 Sn-Ag-Cu 솔더의 도금층에 따른 솔더링성 연구)

  • 신규식;정석원;정재필
    • Journal of Welding and Joining
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    • v.20 no.6
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    • pp.783-788
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    • 2002
  • Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp.:$250^{\circ}C$and conveyer speed:0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was $250^{\circ}C$. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn ($5\mu\textrm{m}$), Cu/Ni ($5\mu\textrm{m}$), and Cu/Ni/Au ($5\mu\textrm{m}/500{\AA}$) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.

A Study for Characterization on Shallow Behavior of Soil Slope by Flume Experiments (토조실험 장치를 이용한 토사비탈면 표층거동 특성 연구)

  • Suk, Jae-wook;Park, Sung-Yong;Na, Geon-ha;Kang, Hyo-Sub
    • The Journal of Engineering Geology
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    • v.28 no.3
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    • pp.489-499
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    • 2018
  • A flume experiments was used to study the characteristics of the surface displacements and volumetric water contents (VWC) during torrential rain. The surface displacement and VWC of the granite weathered soil were measured for rainfall intensity (100, 200 mm/hr) and initial ground condition (VWC 7, 14, 26%). The test processes were also recorded by video cameras. According to the test results, The shallow failure is classified into three types: retrogressive failure, progressive failure and defined failure. In the case of retrogressive failure and progressive failure, relatively large damage could occur due to the feature that soil is deposited to the bottom of the slope. the shallow failure occurred when the VWC reached a certain value regardless of the initial soil condition. It was found that the shallow failure can be predicted through the increase patton of the VWC under the condition of the ground dry condition (VWC 7%) and the natural condition (VWC 14%). For high rainfall intensity, progressive failure predominated, and rainfall intensity above a certain level did not affect wetting front transition.

Interfacial Reaction and Joint Strength of the Sn-58Bi Solder Paste with ENIG Surface Finished Substrate (Sn-58Bi 솔더 페이스트와 ENIG 표면 처리된 기판 접합부의 계면 반응 및 접합강도)

  • Shin, Hyun-Pil;Ahn, Byung-Wook;Ahn, Jee-Hyuk;Lee, Jong-Gun;Kim, Kwang-Seok;Kim, Duk-Hyun;Jung, Seung-Boo
    • Journal of Welding and Joining
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    • v.30 no.5
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    • pp.64-69
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    • 2012
  • Sn-Bi eutectic alloy has been widely used as one of the key solder materials for step soldering at low temperature. The Sn-58Bi solder paste containing chloride flux was adopted to compare with that using the chloride-free flux. The paste was applied on the electroless nickel-immersion gold (ENIG) surface finish by stencil printing, and the reflow process was then performed at $170^{\circ}C$ for 10 min. After reflow, the solder joints were aged at $125^{\circ}C$ for 100, 200, 300, 500 and 1000 h in an oven. The interfacial microstructures were obtained by using scanning electron microscopy (SEM), and the composition of intermetallic compounds (IMCs) was analyzed using energy dispersive spectrometer (EDS). Two different IMC layers, consisting of $Ni_3Sn_4$ and relatively very thin Sn-Bi-Ni-Au were formed at the solder/surface finish interface, and their thickness increased with increasing aging time. The wettability of solder joints was investigated by wetting balance test. The mechanical property of each aging solder joint was evaluated by the ball shear test in accordance with JEDEC standard (JESD22-B117A). The results show that the highest shear force was measured when the aging time was 100 h, and the fracture mode changed from ductile fracture to brittle fracture with increasing aging time. On the other hand, the chloride flux in the solder paste did not affect the shear force and fracture mode of the solder joints.

Alkaline induced-cation crosslinking biopolymer soil treatment and field implementation for slope surface protection

  • Minhyeong Lee;Ilhan Chang;Seok-Jun Kang;Dong-Hyuk Lee;Gye-Chun Cho
    • Geomechanics and Engineering
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    • v.33 no.1
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    • pp.29-40
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    • 2023
  • Xanthan gum and starch compound biopolymer (XS), an environmentally friendly soil-binding material produced from natural resources, has been suggested as a slope protection material to enhance soil strength and erosion resistance. Insufficient wet strength and the consequent durability concerns remain, despite XS biopolymer-soil treatment showing high strength and erosion resistance in the dried state, even with a small dosage of soil mass. These concerns need to be solved to improve the field applicability and post-stability of this treatment. This study explored the utilization of an alkaline-based cation crosslinking method using calcium hydroxide and sodium hydroxide to induce non-thermal gelation, resulting in the enhancement of the wet strength and durability of biopolymer-treated soil. Laboratory experiments were conducted to assess the unconfined compressive strength and cyclic wetting-drying durability performance of the treated soil using a selected recipe based on a preliminary gel formation test. The results demonstrated that the uniformity of the gel structure and gelling time varied depending on the ratio of crosslinkers to biopolymer; consequently, the strength of the soil was affected. Subsequently, site soil treated with the recipe, which showed the best performance in indoor assessment, was implemented on the field slope at the bridge abutment via compaction and pressurized spraying methods to assess feasibility in field implementation. Moreover, the variation in surface soil hardness was monitored periodically for one year. Both slopes implemented by the two construction methods showed sufficient stability against detachment and scouring, with a higher soil hardness index than the natural slope for a year.