• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.12
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• pp.1958-1967
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• 2004

This paper describes the method to rapidly fabricate the large-sized physical model with the envelope model size of more than 600 mm${\times}$ 600 mm${\times}$ 600 mm using two type semi-automatic VLM-ST processes in connection with the reverse engineering technology. The fabrication procedure of the large-sized solid shape is as follows: (1) Generation of STL data from 3D scan data using 3D scanner, (2) generation of shell-type STL data by Boolean operation, (3) division of shell-type STL data into several pieces by solid splitting, (4) generation of USL data for each piece with VLM-Slicer, (5) fabrication of each piece by cutting and stacking according to USL data using VLM-ST apparatus, (6) completion of a shell-type prototype by zigzag stacking and assembly for each piece, (7) completion of a 3D solid shape by foam backing, (8) surface finish of a completed 3D solid shape by coating and sanding. In order to examine the applicability of the proposed method, the miniature of the Mount Rushmore Memorial has been fabricated. The envelope model size of the miniature of the Mount Rushmore Memorial is 1,453 mm${\times}$ 760 mm${\times}$ 853 mm in size. From the result of the fabricated miniature of the Mount Rushmore Memorial, it has been shown that the method to fabricate the large object using two type semi-automatic VLM-ST processes in connection with the reverse engineering technology are very fast and efficient.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 1999.12a
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• pp.155-162
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• 1999

A bare chip packaging technology by an encapsulated flip chip bonding on a build-up printed circuit board has emerged in 1991. Since then, it enabled a high density and low cost semiconductor packaging such as a direct chip bonding on mother board and high density surface mount components, such as BGA and CSP. This technology can respond to various requirements from applications and is considered to take over a main role of semiconductor packaging in the next decade.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.23 no.6
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• pp.553-562
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• 2013

Vehicle vibrations arise from engine and road surface excitations. The engine mount system of a passenger car sustains the engine weight and insulates the excitation force from the engine system. The dynamic properties of viscoelastic material used for the vehicle engine mounts have large variation due to environmental factors such as environmental temperature and humidity etc. The present study aims to investigate the variability of dynamic characteristics in rubber engine mounts considering both environmental temperature change and material model errors/uncertainty. The engine mounts for a passenger car were modeled using finite element method. Then, the dynamic stiffness variability of the engine mounts were estimated using Monte Carlo simulation method. In order to estimate the variations in the storage and loss moduli of the viscoelastic materials, the material properties of the synthetic rubber were expressed as a fractional-derivative model. Next, in order to simulate the uncertainty propagation of the dynamic stiffness for the engine mounts due to the storage and loss moduli variations, the Monte Carlo simulation was used. The Monte Carlo simulation results showed large variation of the engine-mount stiffness along frequency axis.

• Journal of Sensor Science and Technology
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• v.25 no.3
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• pp.173-177
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• 2016

Tape casting ceramics technology has been adopted for the fabrication of solid state electrochemical $CO_2$ sensors and the packaging substrates. The fabricated $CO_2$ sensors exhibit a fast response and a good recovery with the almost theoretical sensitivity of 37 mV/decade, corresponding to a sensor operating temperature of 373 K. The two packaging methods, the wire bonding package and the surface- mounted on the ceramic package, were compared with respect to their power consumption and mass production feasibility. In terms of the ease of fabrication, the surface mount packaging technology is superior to the wire bonding technology but its power consumption is approximately twice that of the wired package.

• The Transactions of the Korean Institute of Power Electronics
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• v.26 no.5
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• pp.325-333
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• 2021

A 3 kW grid-tied PV inverter with Gallium nitride high-electron mobility transistor (GaN HEMT) for domestic commercialization was developed using boost converter and full-bridge inverter with LCL filter topology. Recently, many GaN HEMTs are manufactured as surface mount packages because of their lower parasitic inductance characteristic than standard TO (transistor outline) packages. A surface mount packaged GaN HEMT releases heat through either top or bottom cooling method. IGOT60R070D1 is selected as a key power semiconductor because it has a top cooling method and fairly low thermal resistances from junction to ambient. Its characteristics allow the design of a 3 kW inverter without forced convection, thereby providing great advantages in terms of easy maintenance and high reliability. 1EDF5673K is selected as a gate driver because its driving current and negative voltage output characteristics are highly optimized for IGOT60R070D1. An LCL filter with passive damping resistor is applied to attenuate the switching frequency harmonics to the grid-tied operation. The designed LCL filter parameters are validated with PSIM simulation. A prototype of 3 kW PV inverter with GaN HEMT is constructed to verify the performance of the power conversion system. It achieved high power density of 614 W/L and peak power efficiency of 99% for the boost converter and inverter.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.9 no.4
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• pp.34-47
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• 2000

Since carbon fiber epoxy composite materials have excellent properties for structures due to their high specific strength, high specific modulus, high damping and low thermal expansion, the hollow shafts made of carbon fiber epoxy composites have been widely used for power transmission shafts for motor vehicles , spindles of machine tools, motor base, bearing mount for tool up and manufacturing. The molded composite machine elements are not usually accurate enough for mechanical machine elements, which require turning drilling , cutting and grinding. The experiment are surface grinding wheel GC60 to the carbon fiber epoxy composite specimen with respect to staking angle [0]nT , [45]nT, [90]nT on the CNC grinding machine. In this paper, the surface grinding characteristics of composite plate, which are surveyed experimentally and analytically with respect to the grinding force, surface roughness and wheel loading according to the variable depth of cut, wheel velocity and table feed rate are investigated.

• The Bulletin of The Korean Astronomical Society
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• v.43 no.2
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• pp.55.4-56
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• 2018

Linear Astigmatism Free - Three Mirror System (LAF-TMS) is the linear astigmatism free off-axis wide field telescope with D = 150 mm, F/3.3, and $FOV=5.51^{\circ}{\times}4.13^{\circ}$. We report the design and analysis results of its mirrors and optomechanical structures. Tolerance allowance has been analyzed to the minimum mechanical tolerance of ${\pm}0.05mm$ that is reasonable tolerance for fabrication and optical alignment. The aluminum mirrors are designed with mounting flexure features for the strain-free mounting. From Finite Element Analysis (FEA) results of mounting torque and self-weight, we expect 33 - 80 nm RMS mirror surface deformations. Shims and the L-bracket are mounted between mirrors and the mirror mount for optical alignment. The mirror mount is designed with four light-weighted mechanical parts. It can stably and accurately fix mirrors, and it also suppresses some of stray light.

• International Journal of Quality Innovation
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• v.10 no.1
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• pp.1-23
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• 2009

Face the process yield rate improvements of motherboard, although general enterprises finish deployment goal of each functions by overall quality managements, through quality improvement methods, industry engineering methods, plan-do-check-act (PDCA) methods and other improvement solutions, but it is only can be improved partially and unable to enhance the yield rate of product to the target. It only can takes one step ahead to enhance the process yield rate of motherboard with six sigma ($6{\sigma}$) overall DMAIC process and tactics. This research aimed to use six sigma quality improvement tactics by DMAIC systematic procedure and tactics, and find the key factors that effect to the process yield rate of surface mount technology. It also identified the keys input and process and output index to satisfy customer requirements and internal process index. The results showed that the major effective factors by fishbone and process failure modes and effects analysis (PFMEA). If the index of input and output that can be quantified, the optimum parameter can be found through design of experiment to ensure that the process is stable. If the factor of input and output that cannot be quantified, we found out the effective countermeasure by Mind_Mapping, make sure whole processes can be controlled stably, to reach the high product quality and enhance the customer satisfaction.

• Journal of Welding and Joining
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• v.13 no.4
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• pp.30-35
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• 1995

전자기기의 소형화는 앞으로도 계속 진행될 것이므로, 이에 필요한 Fine Pitch 또는 고밀도 실장기술의 개발이 지속적으로 요구될 것으로 생각된다. 앞에서 언급한 3가지 Fine Pitch 표면실장을 위한 Solder 합금의 공급 방법중에서 종래의 Screen Print 방법과 Projected Solder Pre-coat 방법은 0.3mm Pitch가 한계인 것으로 생각되며, Super Solder Pro-coat 방법은 좀 더 Fine Pitch 까지도 사용 가능한 기술 로 생각된다. 이외에도 0.1mm 보다 미세한 Pitch의 표면실장을 위하여, Solder에 의한 접합이 아닌, 이방성 도전 접착제와 같은 도전성 매개체를 통하여 접촉에 의한 표면 실장의 개념도 도입하고 있다.

• Journal of Institute of Control, Robotics and Systems
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• v.10 no.8
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• pp.711-717
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• 2004

We propose a path planning method to improve the productivity of SMT (surface mount technology) inspection machines with an area camera. A unified method is newly proposed to determine the FOV clusters and camera sequence simultaneously. The proposed method is implemented by a hybrid genetic algorithm to increase the convergence speed. Comparative simulation results are then presented to verify the usefulness of the proposed algorithm.