• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 춘계학술대회 논문집
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• pp.918-921
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• 2002

Some investigators who have tried to achieve the highly smooth surface finish using electrochemical processes have reported that high current density produced lustrous surfaces while the opposite conditions produced a passive layer and had a tendency to produce a black surface. However, processing at a low current density may produce a non-lustrous surface but the improvement of dimensional accuracy of the surface is significant. The surface with pulse process was a bit more lustrous than with continuous current but the black passive layer still could be found at grooved surface. There are two ways to achieve highly smooth surface finish. One is brushing it with a brush the other is electrochemical machining (ECM) with high current. The former method is the most common polishing practice, but not only may the surface obtained differ from operator to operator, but precision smooth surface on micro grooves are difficult to obtain. The latter one recently has been used to produce a highly smooth surface after EDM process. However, the material removal rate in ECM with high current is relatively high. Hence the original shape of the micro grooves, which was formed by electrochemical micro-machining (EMM) process, may be destroyed. In this study, an electrochemical polishing process using pulse current is adopted as a possible alternative process when micro grooves formed by EMM process should be polished. Mirror-like micro grooves with lustrous and smooth surface can be produced electrochemically with pulse current because the voltage and current used can be lower than the case of continuous current. This study will discuss the accurate control of physical and electrical conditions so as to achieve mirror-like micro grooves with lustrous and smooth surface without destroying the original shape of micro grooves.

• 한국표면공학회지
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• 제31권6호
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• pp.359-370
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• 1998

TiAl-based intermetallic compounds were electro-bornizel in the mixture of $Na_2B_4O_7$, KCL and LiCl in the termetature rage between 850 and $1000^{\circ}C$for various times (1-5 hours)under the fixed current density of 0.5 A/$cm^2$. The optimized composition of electrolyte in this work was decided to be 76.9 wt% $Na_2B_4O_7$-19.2 wt.%(0.7KCl-0.3LiCl) -3.9 wt.% al. The samples with boronized layer were investigated by SEM, XRD and EDS. The surface micro-hardness of boronized TiAl was also evaluated using Micro Vickers Hardness Tester. The sample, boronized at $900^{\circ}C$ for 4 hours in the above composition of electrolyte under the current density of 0.5 A/$\textrm{cm}^2$, has about 36$\mu\textrm{m}$ think layer on the surface, and its surface micro-hardness was measured to be 1263 Hv. From the results of SEM, XRD and EDS, the layer consisted of $TiB_2$ sublayer and Al-oxide sub layer. Al-depleted layer below the Al-oxide sudlayer was also detected. The activation energy for formation of boronized layer in this study was calculated as 178 Kcal/moleK.

• 대한지리학회지
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• 제38권2호
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• pp.145-155
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• 2003

본 연구에서는 온대호의 성층기 표수층의 호류형성에 영향을 미치는 요인을 분석하고 그 성인을 밝히기 위해 호소 수온의 일변화와 호류의 관계, 그리고 기상.기후 요소에 대한 관측을 실시하였다. 그 결과, 성층기에 발생하는 표수층의 호류는 태양고도와 일사량의 차이에 따라 부분적인 수온차가 발생하고, 이에 기인한 열적교환이 주요 에너지원으로 판명되었으며, 2차적으로 탁월풍에 의한 취송류가 작용하는 것으로 간주된다 한편, 수면이 냉각된 심야에는 수평적 환류보다는 연직대류가 발달하는 것으로 간주된다. 그리고 가열된 낮에는 부분적인 온도 경도차에 의해 호심을 중심으로 시계반대방향과 시계방향으로 각각 환류하는 수괴가 존재하고, 탁월풍은 수괴의 이동방향과 이동속도에 다소 영향을 미치지만, 전체적인 흐름방향에는 큰 영향을 미치지 못한 것으로 판단된다.

• 한국광학회:학술대회논문집
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• 한국광학회 2008년도 동계학술발표회 논문집
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• pp.93-94
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• 2008

In order to suppress the current crowding in light emitting diodes (LEDs) grown on sapphire substrate, the effect of nonuniform contact resistivity between TME layer and p-GaN layer on the LED surface was theoretically investigated. The analysis results showed that current crowding occurring around p-electrode could be considerably improved, which in turn would be helpful to improve the electrostatic discharge (ESD) characteristic.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2012년도 제42회 동계 정기 학술대회 초록집
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• pp.108-108
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• 2012

High-performance GaN-based light emitting diodes (LEDs) with high efficiency and excellent reliability have been of technological importance forapplications in full color display, automotive lighting, and solid state lighting. To realize high-performance and excellent-reliability LEDs, various technologies such as surface texturing, transparent conducting oxide, surface Plasmon, highly p-conduction layer, current blocking layer, photon-enhanced layer, and nanostructures have been extensively investigated. Among them, advanced core technologies based on how to suppress surface leakage and current crowding, how to enhance current injection efficiency and output power, and how to resist electrostatic damage will be displayed and discussed using our reported and preliminary results. New approaches like integrated LEDs will be also introduced and discussed.

• International Journal of Precision Engineering and Manufacturing
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• 제2권1호
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• pp.18-25
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• 2001

Electrolytic polishing is the anodic dissolution process in the transpassive state. It removes non-metallic inclusion and improves mechanical and corrosion resistance of stainless steel. If there is a Bailby layer, it will be removed and the true structure of the surface will be restored. Electrolytic polishing is normally used to remove a very thin layer of material from the surface of metal object. A new electrolyte composed of phosphoric, sulfuric and distilled water has been developed in this study. Two current density, high & low current density regions, have been applied in this study. In this study, In the region of high current density, there is no plateau region but excellent electrolytic polishing effect can be accomplished in short machining time because material removel process and leveling process occur simultaneously. In the low current density region, there can be found plateau region. The material removal process and leveling process occur successively. The aim of this work is to determine electrolytic polishing for stainless steel in terms of high & low current density and workpiece surface roughness.

• 한국표면공학회지
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• 제20권2호
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• pp.49-59
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• 1987

The properties of $Cr_2O_3-Al_2O_3-SiO_2$ composite oxide coatings on steel surface were investigated. The results obtained were as follows: The microhardness of oxide coating layer increased with increasing heat-treatment temperature and $Cr_2O_3$ content in coating layer. The hardness showed the highest value (850Hv) treated at 700$^{\circ}C$ for $SiO_2:Al_2O_3:Cr_2O_3$=1:1:4. Increasing heat-treatment temperature, corrosion current density became lower and coating layer became denser. The corrosion current density showed the lowest value $(6.5{\times}10^{-5}\;Acm^2)$ treated at 750$^{\circ}C\;for\;SiO_2:Al_2O_3:Cr_2O_3$=1:1:3. These results were explained by protective layer which was formed during heat-treatment. The bonding between matrix and coating layer is expected to be made mechanically and chemically by the inter diffusion of Ni and Fe. The composite oxide coating was formed by softening of the binder with increasing heat-treatment temperature. The strengthening of coating layer is to be resulted from the dispersion of major oxide particles.

• 한국표면공학회지
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• 제53권4호
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• pp.190-199
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• 2020

Copper pyrophosphate baths were employed in order to study the dependencies of current efficiency, residual stress, surface morphology and microstructure of electrodeposited Cu thin layers on applied current density. The current efficiency was obtained to be more than about 90 %, independent of the applied current density. Residual stress of Cu electrodeposits was measured to be in the range of -30 MPa and 25 MPa with the increase of applied current density from 0.5 to 15 mA/㎠. Relatively smooth surface morphologies of the electodeposited Cu layers were obtained at an intermediate current range between 3 and 4 mA/㎠. The Cu electrodeposits showed FCC(111), FCC(200), and FCC(220) peaks and any preferred orientation was not observed in this study. The average crystalline size of Cu thin layers was measured to be in the range of 44~69 nm.

• Journal of Electrical Engineering and Technology
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• 제6권6호
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• pp.824-828
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• 2011

Transmission line analysis of the surface a cumulation layer in injection-enhanced gate transistor (IEGT) is presented for the first time, based on per-unit-length resistance and conductance of the surface layer beneath the gate of IEGT. Lateral electric field on the accumulation layer surface, as well as the electron current injected into the accumulation layer, is governed by the well-known wave equation, and decreases as an exponential function of the lateral distance from the cathode. Unit-length resistance and conductance of the layer are expressed in terms of the device parameters and the applied gate voltage. Results obtained from the experiments are consistent with the numerical simulations.

• 전기학회논문지
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• 제58권8호
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• pp.1559-1565
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• 2009

Resistivity changes and intermetallic growth after thermal aging of Matter tin-plated copper sheet for current collector in fuel cell were investigated to survey the diffusion of Cu into Sn in interface and surface. The results show that the intermetallic growth and resistivity depended on thermal aging temperature and dwell time. In Sn plate on a Cu substrate, Cu6Sn5(${\mu}$) and Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface. Cu6Sn5(${\mu}$) intermetallics layer gradually changed Cu3Sn(${\varepsilon}$). Moreover Cu get through Sn layer and it was diffused in the surface at $200^{\circ}C$. On the other hand, only Cu3Sn(${\varepsilon}$) intermetallics layer were formed at plate/substrate interface at $300^{\circ}C$. Consequently, the intermetallics formation, thermal condition and oxidation of surface, causes increase in the resistivity of Tin-plated copper sheet.