• 한국공작기계학회논문집
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• 제10권4호
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• pp.118-122
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• 2001

In this study, the variation of surface roughness was tested in surface grinding for the three working materials SM45C, heat-treated SM45C, and gray cat iron. IT was performed for the various grinding wheels with two grain size #60, #100, and three grade I, O, R and various grinding depths and feeds, The fractural grinding depths which were obtained when the grinding wheels were destructed in surface grinding works, were examined and compared with the calculated value sug-gested in this study, The results showed that the surface roughness was decreased by decreasing grinding depth, and feed, and increasing grain size and grades. The fracture grinding depths were increased by increasing grain size, grade and feed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.285-288
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• 2000

This paper deals with the theoretical estimation and its experimental verification of grinding wheel wear in surface grinding process. A theoretical formulation is provided to predict the grinding wheel wear in surface grinding. The associated surface roughness and grinding force are also investigated both theoretically and experimentally. Through a series of simulations and experiments, it is shown that the predictions are in good agreement with the experimental results.

• 한국공작기계학회논문집
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• 제11권5호
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• pp.58-64
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• 2002

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some finding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametrical silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpieces are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipment with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6 nm in Ra.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.946-949
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• 2001

Mirror surface finish of Si-wafers has been achieved by rotary in-feed machining with cup-type wheels in ELID grinding. But the diameter of the workpiece is limited with the diameter of the grinding wheel in the in-feed machining method. In this study, some grinding experiments by the rotary surface grinding machine with straight type wheels were conducted, by which the possible grinding area of the workpiece is independent of the diameter of the wheels. For the purpose of investigating the grinding characteristics of large scale diametral silicon wafer, grinding conditions such as rotation speed of grinding wheels and revolution of workpiece are varied, and grinding machine used in this experiment is rotary type surface grinding m/c equipped with an ELID unit. The surface ground using the SD8000 wheels showed that mirror like surface roughness can be attained near 2~6nm in Ra.

• 대한기계학회논문집A
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• 제29권4호
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• pp.614-623
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• 2005

This study aims to perform the characteristic evaluation of surface grinding for the STD11 material with experimental and analytic techniques based on the response surface model. The grinding force acting on the workpiece and the ground surface roughness were measured according to the change of grain size, table speed and depth of cut. The effect of spark-out on the grinding force and the surface roughness was also characterized. The frictional coefficient between workpiece and grinding wheel could be determined by the analysis of spark-out effect. From the experimental data, the second-order response surface models were developed to predict the grinding force and the surface roughness. Validation of the developed model was examined.

• 대한기계학회논문집A
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• 제20권9호
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• pp.2866-2874
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• 1996

In the grinding of difficult-to-materials, the major problmes of conventional grinding are grinding burn, wheel wear, grinding surface crack, loading and glazing, When a conventioanl grinding wheel is used, wheel wear and grinding surface crack easily occur in low heat conductive material and annealed steel. Intermittent grinding is suitable for diffcult-to-matrical such as stainless steel, titanium alloy, aluminum alloy and copper alloy. The purpose of this paper is to develop a new type intermittent wheel of the grinding system for improving the problem of stainless steel grinding, to observe the effect of intermittent grinding on surface quality and grinding characteristics of stainless steel grinding using intermittent grinding wheel. The characteristics of intermittent grinding system improve surface quality, low grinding temperature and low loading.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.1257-1260
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• 2005

Grinding process has unique characteristics compared with other machining processes. The cutting edges of the grinding wheel don't have uniformity and act differently on the workpiece at each grinding. The response surface analysis is one of various methods for optimizing and evaluating the process parameters to achieve the desired output. In this study, the effect of the grinding parameters on outcomes of the surface grinding was analyzed experimently. To predict the grinding outcomes and to select the grinding conditions before grinding, the second-order response surface models for the grinding force and the surface roughness were developed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.862-865
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• 2000

The surface grinding of STD-11 was attempted on the machining center. Grinding experiments were performed at the various grinding conditions and the grinding force, machining error, grinding ratio, and surface roughness were measured. The experimental results indicate that the grinding ratio decreases as the table speed and depth of cut increase. The surface roughness of ground surface was not affected by the change of depth of cut. The surface roughness values obtained on the experiments were 0.02 ～ 0.03${\mu}{\textrm}{m}$ which are fairy good and acceptable for ground surface.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1997년도 추계학술대회 논문집
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• pp.219-224
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• 1997

In surface grinding, the contact between the grinding wheel and the workpiece introduces heat and resistance, which restrict the self-dressing of the grits and result in burrs and cracks on the workpiece. Therefore, before or during th grinding wheel for more accurate performance. In order to determine the dressing time monitoring method of grinding wheel in surface grinding, a three-dimensional computer simulation of the grinding operation has been attempted based on the contact mechanism and surface-shaping system between the grinding wheel and the workpiece. The optimal dressing time is determined based on the amount of the grain wear and work surface roughness.

• 한국기계가공학회지
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• 제1권1호
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• pp.101-108
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• 2002

In the grinding process, the degree of the sharpness in wheel gram affects the surface roughness and the dimensional accuracy. If a wheel with dull grains is used, the grinding force will be increased and the surface roughness deteriorated. To produce a precision component, the magnitude of parameters related to the wear amount of a grinding wheel has to be limited. In this study, a variation of the grinding force and the surface roughness were measured to seek the machining characteristics of the W A and CBN wheels. From the wear amount of the grinding wheel and the removal rate of workpiece, the grinding ratio was calculated. And also the wheel life was determined at a rapid decreasing point of the grinding ratio. The difference between the surface of wheel-workpiece before grinding and after wheel life was clearly verified with a microscopic photo.