• Journal of Bio-Environment Control
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• v.4 no.2
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• pp.159-166
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• 1995

This experiment was aimed to investigate the growth and yield responses of hydroponically grown cucumber as affected by cultural containers and substrates using perlite and mixtures with perlite. Containers used in this experiment were bed and box made of styrofoam, PE film and Wagner pot and substrates used were perlite, peatmoss, rice hull and carbonized rice hull. The results obtained were as follows : Based on the growth and yield responses determined from the leaf area and total fruit weight, bed and box made of styrofoam was considered the best containers among tested for cucumber hydroponics. Recommendable substrates for hydroponically grown cucumber using perlite were evaluated in the order of perlite, perlite with rice hull and perlite with carbonized rice hull in styrofoam bed and box. Increase in marketable yield and decrease in abnormal fruits was observed in the mixed substrates with rice hull or carbonized rice hull when compared to perlite single media.

• Korean Journal of Soil Science and Fertilizer
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• v.37 no.3
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• pp.143-148
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• 2004

Organic and inorganic substrates commonly used in Korea include peat moss, coir, bark, rice hull, saw dust, perlite, vermiculite, rockwool granulate, clay ball, and so on. The objective of this study was to get analytical results about the physical and chemical properties of these substrates by European standard methods. Organic substrates showed different properties depending on the type, origin and manufacturing processes. Inorganic substrates showed different properties depending on the type and particle size. Further study on physical and chemical properties for more raw materials and commercially available growing media analyzed by European standard method and comparison of the results with those by Korean standard method is needed.

• Korean Journal of Medicinal Crop Science
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• v.19 no.6
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• pp.441-445
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• 2011

This research was conducted to investigate the influence of variouis organic substrates on growth and yield of organically grown ginseng seedlings in a shaded plastic house. In the investigation of optimal substrate, the eight substrate were formulated by adjusting blending rate of peatmoss, perlite, coir dust(coco peat), and vermiculite. Then, the changes in physico chemical properties of root substrates as well as their influences on the growth characteristics and yield were determined at six months after sowing. The elevation of the blending rate of peatmoss from 50% to 70% with decrease in the rate of inorganic component (mixture of perlite and vermiculite) from 50 to 30% resulted in the increase in container capacities and decrease in total porosities and air-filled capacities. The concentrations of $NH_4-N$, $P_2O_5$ and K increased as the incorporation rate of castor seed meal, phosphate ore, and langbenite, respectively, were elevated during the root medium formulations. The PPV-1 and PPV-4 substrates produced high stem length, stem diameter, shoot fresh weight, leaf area and root length among eight substrate. Root fresh weight was heaviest in PPV-4 compound nursery media. The results of this experiment will be utilized in the new substrate application for ginseng organic culture in shaded vinyl house.

• Journal of Microbiology and Biotechnology
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• v.19 no.9
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• pp.911-917
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• 2009

The apoptotic caspases have been classified in accordance with their substrate specificities, as the optimal tetrapeptide recognition motifs for a variety of caspases have been determined via positional scanning substrate combinatorial library technology. Here, we focused on two proteolytic recognition motifs, DEVD and IETD, owing to their extensive use in cell death assay. Although DEVE and IETD have been generally considered to be selective for caspase-3 and -8, respectively, the proteolytic cleavage of these substrates does not display absolute specificity for a particular caspase. Thus, we attempted to monitor the cleavage preference for caspase-3, particularly using the recombinant protein substrates. For this aim, the chimeric GST:DEVD:EGFP and GST:IETD:EGFP proteins were genetically constructed by linking GST and EGFP with the linkers harboring DEVD and IETD. To our best knowledge, this work constitutes the first application for the monitoring of cleavage preference employing the recombinant protein substrates that simultaneously allow for mass and fluorescence analyses. Consequently, GST:IETD:EGFP was cleaved partially in response to caspase-3, whereas GST:DEVD:EGFP was completely proteolyzed, indicating that GST:DEVD:EGFP is a better substrate than GST:IETD:EGFP for caspase-3. Collectively, using these chimeric protein substrates, we have successfully evaluated the feasibility of the recombinant protein substrate for applicability to the monitoring of cleavage preference for caspase-3.

• Progress in Superconductivity
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• v.6 no.1
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• pp.64-68
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• 2004

We fabricated cube-textured Ni and Ni-W alloy substrates for coated conductors and characterized the effects of W addition on microstructure, mechanical strength, and magnetic properties of the substrate. Pure Ni and Ni-(2, 3, 5at.%)W alloys were prepared by plasma arc melting, heavily cold rolled and then annealed at various temperatures of $600-1300^{\circ}C$. The texture was evaluated by pole-figure and orientation distribution function (ODF) analysis. Mechanical properties were investigated by micro Vickers hardness and tension test. Ferromagnetism of the substrate was measured by physical property measurement system (PPMS). It was observed that Ni-W substrates had sharp cube texture, and the full-width at half-maximums (FWHMs) of in-plane texture was $^{\circ}$-5.57$4.42^{\circ}$, which is better than that of pure Ni substrate. In addition cube texture of Ni-W substrates was retained at higher temperature up to $1300^{\circ}C$. Microstructural observation showed that the Ni-W substrates had fine grain size and higher mechanical properties than the pure Ni substrate. These improvements are probably due to strengthening mechanisms such as solid solution hardening and/or grain size strengthening. PPMS analysis showed that addition of W effectively reduced saturation magnetization in applied magnetic field and Curie temperature.

• The Korean Journal of Mycology
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• v.9 no.2
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• pp.67-72
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• 1981

This study was performed to examine the cultivation of Pleurotus florida that forms pinhead between 5 and $25^{\circ}C$, on rice straw substrates in Korea. The highest yield of P. florida sporophores was obtained from the fermented rice straw substrates added 5% rice bran to the rice straw by dry weight basis at the starting of fermentation. The pile turning of materials for uniform fermenting was made three times when the temperature of the pile reached $60^{\circ}C$ during out door composting. The $60^{\circ}C$ row steam was treated 6 hrs for pasterization of the substrates in the cultivating house. The quantity of spawn affected the mycelial growth and the yield of P. florida. The optimum amount of spawn was 10% to the rice straw by dry weight basis mixed with the substrates. P. florida produced normal sphorophores from September to middle of July of the following year.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.61-67
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• 2020

In this paper, we calculated the warpage of bare substrates and chip attached substrates by using FEM (Finite Element Method), and compared and analyzed the effect of the chips' attachment on warpage. Also, the effects of layer thickness of substrates for reducing warpage were analyzed and the conditions of layer thickness were analyzed by signal-to-noise ratio of Taguchi method. According to the analysis results, the direction of warpage pattern in substrates can change when chips are attached. Also, the warpage decreases as the difference in the CTE (coefficient of thermal expansion) between the top and bottom of the package decreases and the stiffness of the package increases after chips are loaded. In addition, according to the impact analysis of design parameters on substrates where chips are not attached, in order to reduce warpage, the inner layers of the circuit layer Cu1 and Cu4 has be controlled first, and then concentrated on the thickness of the solder resist on the bottom side and the thickness of the prepreg layer between Cu1 and Cu2.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.3
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• pp.14-19
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• 2000

Free-standing GaN single crystal substrates have been obtained by growing thick GaN epitaxial layers on (0001) sapphire substrates using hydride vapor phase epitaxy (HVPE) method. After growing the GaN thick film of 200 ${\mu}{\textrm}{m}$, a free-standing GaN with a size of 10 mm $\times$10 mm were obtained by mechanical polishing process to remove sapphire substrate. Crack-free GaN substrates have been obtained by GaCl pre-treatment prior to the growth of GaN epitaxial layers. Properties of free-standing GaN substrates have been compared with those of lateral epitaxial overgrowth (LEO) GaN films by double-crystal x-ray diffraction (DC-XRD), cathodoluminescence (CL) and photoluminescence (PL) measurements.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.9-15
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt. %). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyzer (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in tile content of filler brought about the increase of Tg$^{DSC}$ and Tg$^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significant affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.ers.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.1
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.