The Influence of W Addition on Cube Textured Ni Substrates for YBCO Coated Conductor

양축 정렬된 Ni 기판의 특성에 미치는 W 첨가의 효과

  • Kim Kyu Tae (The School of Metallurgical and Materials Eng., Sungkyunkwan University) ;
  • Lim Jun Hyung (The School of Metallurgical and Materials Eng., Sungkyunkwan University) ;
  • Kim Jung Ho (The School of Metallurgical and Materials Eng., Sungkyunkwan University) ;
  • Jang Seok Hern (The School of Metallurgical and Materials Eng., Sungkyunkwan University) ;
  • Kim Ho-Jin (The School of Metallurgical and Materials Eng., Sungkyunkwan University) ;
  • Joo Jinho (The School of Metallurgical and Materials Eng., Sungkyunkwan University) ;
  • Kim Chan-Joong (Nuclear Material Development Team, Korea Atomic Energy Research Institute) ;
  • Song Kyu Jung (Applied Superconductivity Research Group, Korea Electrotechnology Research Institute) ;
  • Shin Hyung Sub (The School of Mechanical Eng., Andong National University)
  • Published : 2004.10.01

Abstract

We fabricated cube-textured Ni and Ni-W alloy substrates for coated conductors and characterized the effects of W addition on microstructure, mechanical strength, and magnetic properties of the substrate. Pure Ni and Ni-(2, 3, 5at.%)W alloys were prepared by plasma arc melting, heavily cold rolled and then annealed at various temperatures of $600-1300^{\circ}C$. The texture was evaluated by pole-figure and orientation distribution function (ODF) analysis. Mechanical properties were investigated by micro Vickers hardness and tension test. Ferromagnetism of the substrate was measured by physical property measurement system (PPMS). It was observed that Ni-W substrates had sharp cube texture, and the full-width at half-maximums (FWHMs) of in-plane texture was $^{\circ}$-5.57$4.42^{\circ}$, which is better than that of pure Ni substrate. In addition cube texture of Ni-W substrates was retained at higher temperature up to $1300^{\circ}C$. Microstructural observation showed that the Ni-W substrates had fine grain size and higher mechanical properties than the pure Ni substrate. These improvements are probably due to strengthening mechanisms such as solid solution hardening and/or grain size strengthening. PPMS analysis showed that addition of W effectively reduced saturation magnetization in applied magnetic field and Curie temperature.

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