• 제목/요약/키워드: Sublimation growth process

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The Diameter Expansion of 6H-SiC Single Crystals by the Modification of Inner Guide Tube (새로운 가이드 튜브를 통한 6H-SiC 단결정의 직경 확장에 관한 연구)

  • Son, Chang-Hyun;Choi, Jung-Woo;Lee, Gi-Sub;Hwang, Hyun-Hee;Choi, Jong-Mun;Ku, Kap-Ryeol;Lee, Won-Jae;Shin, Byoung-Chul
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • 제21권9호
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    • pp.795-800
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    • 2008
  • A sublimation method using the SiC seed crystal and SiC powder as the source material is commonly adopted to grow SiC bulk single crystal. However, it has proved to be difficult to achieve the high quality crystal and the process reliability because SiC single crystal should be grown at very high temperature in closed system. The present research was focused to improve SiC crystal quality grown by PVT method through using the new inner guide tube. The new inner guide tube was designed to prevent the enlargement of polycrystalline region into single crystalline region and to enlarge the diameter of SiC single crystal. The 6H-SiC crystals were grown by conventional PVT process. The seed adhered on seed holder and the high purity SiC source materials are placed on opposite side in sealed graphite crucible surrounded by graphite insulation. The SiC bulk growth was conducted around 2300 $^{\circ}C$ of growth temperature and 50 mbar in an argon atmosphere of growth pressure. The axial thermal gradient across the SiC crystal during the growth was estimated in the range of 15${\sim}$20 $^{\circ}C$/cm.

Epitaxial Layer Growth of p-type 4H-SiC(0001) by the CST Method and Electrical Properties of MESFET Devices with Epitaxially Grown Layers (CST 승화법을 이용한 p-type 4H-SiC(0001) 에픽텍셜층 성장과 이를 이용한 MESFET 소자의 전기적 특성)

  • Lee, Gi-Sub;Park, Chi-Kwon;Lee, Won-Jae;Shin, Byoung-Chul;Nishino, Shigehiro
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • 제20권12호
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    • pp.1056-1061
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    • 2007
  • A sublimation epitaxial method, referred to as the Closed Space Technique (CST) was adopted to produce thick SiC epitaxial layers for power device applications. In this study, we aimed to systematically investigate surface morphologies and electrical properties of SiC epitaxial layers grown with varying a SiC/Al ratio in a SiC source powder during the sublimation growth using the CST method. The surface morphology was dramatically changed with varying the SiC/Al ratio. When the SiC/Al ratio of 90/1 was used, the step bunching was not observed in this magnification and the ratio of SiC/Al is an optimized range to grow of p-type SiC epitaxial layer. It was confirmed that the acceptor concentration of epitaxial layer was continuously decreased with increasing the SiC/Al ratio. 4H-SiC MESFETs haying a micron-gate length were fabricated using a lithography process and their current-voltage performances were characterized. It was confirmed that the increase of the negative voltage applied on the gate reduced the drain current, showing normal operation of FET device.

A study on the dependance of crucible dimension on AlN single crystal growth (AlN 단결정 성장에 관한 도가니 형태의 의존성에 관한 연구)

  • Yin, Gyong-Phil;Kang, Seung-Min
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • 제25권1호
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    • pp.1-5
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    • 2015
  • For the special usage, the effort of developing AlN single crystals has been very hot in the world. The AlN-base UV LEDs are used on the field of sterilization, purification, curing and analyzing, which can advance human's living and medical processes etc.. AlN single crystals were grown by the PVT (Physical vapor transport) method. On the growing process, carbon crucibles with three different types such as normal size, taller than normal and wider than normal were used for comparison. The processing temperature was in the range of $1900{\sim}2100^{\circ}C$ and ambient pressure was 200~1 Torr. When the taller crucible was used, the sublimation mass was greater than normal dimension one but the best condition of growth changes widely. However the wider one gave much sublimation mass and growing condition was more stable than normal dimension. On limited growing furnace system, the changes of crucible dimension of PVT method provide the change of best condition for growth rate, as-grown crystal quality and growth condition stability.

Electric Property Analysis of SiC Semiconductor Wafer for Power Device Application

  • Kim, Jeong-Gon;An, Jun-Ho;Seo, Jeong-Du;Kim, Jeong-Gyu;Gyeon, Myeong-Ok;Lee, Won-Jae;Kim, Il-Su;Sin, Byeong-Cheol;Gu, Gap-Ryeol
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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    • pp.207-207
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    • 2006
  • We investigated the effects of hydrogen addition to the growth process of SiC single crystal using sublimation physical vapor transport(PVT) techniques. Hydrogen was periodically added to an inert gas for the growth ambient during the SiC bulk growth Grown 2"-SiC single crystals were proven to be the polytype of 6H-SiC and carrier concentration levels of about $10^{17}/cm^3$ was determined from Hall measurements. As compared to the characteristics of SiC crystal grown without using hydrogen addition, the SiC crystal without definitely exhibited lower carrier concentration and lower microplpe density as well as reduced growth rate.

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Experiment of frost growth on the parallel plates in the condition of laminar and low humidity (층류유동 저습도 조건에서의 평행평판형 냉각판 서리성장 실험)

  • 한흥도;노승탁
    • Korean Journal of Air-Conditioning and Refrigeration Engineering
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    • 제11권4호
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    • pp.440-447
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    • 1999
  • The frosting characteristics on the vertical parallel plates with three cooling plates were experimentally investigated. The experimental parameters were the cooling plate temperature, the air humidity, the air temperature, the air Reynolds number, and the location. The frosting conditions were limited to air temperatures from 10 to $15^{\circ}C$ , air Reynolds numbers from 1600 to 2270, air humidity ratios from 0.00275 to 0.0037kgw/kga and cooling plate temperatures from -10 to $-20^{\circ}C$. Frost growth and density toward the front of the plate were more thick and dense than toward the rear. Frost growth increased with decreasing plate temperature and increasing humidity. In the conditions of the laminar flow, dew point below $0^{\circ}C$and non-cyclic frosting period, frost thickness increased with increasing air temperature. The reason of increasing frost thickness with increasing air temperature was sublimation-ablimation process. The average growth thickness along the locations showed little dependence on the Reynolds numbers.

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A study on the etch pits morphology and the defect in as-grown SiC single crystals (SiC 단결정의 etch pit 형상과 결함에 관한 고찰)

  • 강승민
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • 제10권6호
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    • pp.373-377
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    • 2000
  • For 6H-SiC single crystals which was obtained by sublimation growth (modified Lely process), the relation between the defects and the etch pits to be formed at the site of dislocations were discussed. Typical hexagonal etch pits were formed on (0001) basal plane. The similar hexagonal etch pit shapes were formed on the site of micropipe defects and it was realized that internal planar defects was formed with the same matrix crystal structure as grown crystals, through the observation of the etching morphology at those internal defects.

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Diameter Expansion of 6H-SiC Single Crystals by the Modification of Crucible Structure Design (도가니 구조 변경을 통한 6H-SiC 단결정의 직경 확장에 관한 연구)

  • Kim, Jung-Gyu;Kyun, Myung-Ok;Seo, Jung-Doo;An, Joon-Ho;Kim, Jung-Gon;Ku, Kap-Ryeol;Lee, Won-Jae;Kim, Il-Soo;Shin, Byoung-Chul
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • 제19권7호
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    • pp.673-679
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    • 2006
  • A sublimation method using the SiC seed crystal and SiC powder as the source material is commonly adopted to grow SiC bulk single crystal. However, it has proved to be difficult to achieve the high quality crystal and the process reliability because SiC single crystal should be grown at very high temperature in closed system. In this study, SiC crystal boules were prepared with different angles in trapezoid-shaped graphite seed holders using sublimation physical vapor transport technique (PVT) and then their crystal quality was systematically investigated. The temperature distribution in the growth system and the crystal shape were varied with angles in trapezoid-shaped graphite seed holders, which was successfully simulated using 'Virtual Reactor'. The SiC polytype proved to be the n-type 6H-SiC from the typical absorption spectrum of SiC crystal. The micropipe densities of SiC wafers in this study were measured to be < $100/cm^2$. Consequently, SiC single crystal with large diameter was successfully achieved with changing angle in trapezoid-shaped graphite seed holders.

Preparation of particle-size-controlled SiC powder for single-crystal growth

  • Jung, Eunjin;Lee, Myung Hyun;Kwon, Yong Jin;Choi, Doo Jin;Kang, Seung Min;Kim, Younghee
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • 제27권1호
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    • pp.57-63
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    • 2017
  • High-purity ${\beta}-SiC$ powders for SiC single-crystal growth were synthesized by direct carbonization. The use of high-purity raw materials to improve the quality of a SiC single crystal is important. To grow SiC single crystals by the PVT method, both the particle size and the packing density of the SiC powder are crucial factors that determine the sublimation rate. In this study, we tried to produce high-purity ${\beta}-SiC$ powder with large particle sizes and containing low silicon by introducing a milling step during the direct carbonization process. Controlled heating improved the purity of the ${\beta}-SiC$ powders to more than 99 % and increased the particle size to as much as ${\sim}100{\mu}m$. The ${\beta}-SiC$ powders were characterized by SEM, XRD, PSA, and chemical analysis to assess their purity. Then, we conducted single-crystal growth experiments, and the grown 4H-SiC crystals showed high structural perfection with a FWHM of about 25-48 arcsec.

The Quality Investigation of 6H-SiC Crystals Grown by a Conventional PVT Method with Various SiC Powders

  • Yeo, Im-Gyu;Lee, Tae-Woo;Lee, Won-Jae;Shin, Byoung-Chul;Choi, Jung-Woo;Ku, Kap-Ryeol;Kim, Young-Hee
    • Transactions on Electrical and Electronic Materials
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    • 제11권2호
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    • pp.61-64
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    • 2010
  • In this paper, we investigate the quality difference of SiC crystals grown by a conventional physical vapor transport method using various SiC powders. While the growth rate was revealed to be dependent upon the particle size of the SiC powder, the growth rate of SiC bulk crystals grown using SiC powder with a smaller particle size (20 nm) was definitely higher than those using lager particle sizes with $0.1-0.2\;{\mu}m$ and $1-10\;{\mu}m$, respectively. All grown 2 inch SiC single crystals were proven to be the polytype of 6H-SiC and the carrier concentration levels of about $10^{17}\;cm^3$ were determined from Hall measurements. It was revealed that the particle size and process method of SiC powder played an important role in obtaining a good quality, high growth rate, and to reduce growth temperature.

Characteristics of Sticking Coefficient in BSCCO Thin Film

  • Cho, Choon-Nam;Ahn, Joon-Ho;Oh, Jae-Han;Choi, Woon-Shik;Park, Yong-Pil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 한국전기전자재료학회 2000년도 제2회 학술대회 논문집 일렉트렛트 및 응용기술전문연구회
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    • pp.59-63
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    • 2000
  • BSCCO thin films are fabricated via a co-deposition process by an ion beam sputtering with an ultra-low growth rate, and sticking coefficients of the respective elements are evaluated. The sticking coefficient of Bi element exhibits a characteristic temperature dependence : almost a constant value of 0.49 below $730^{\circ}C$ and decreases linearly with temperature over $730^{\circ}C$ This temperature dependence can be elucidated from the evaporation and sublimation rates of bismuth oxide, $Bi_2O_3$, from the film surface. It is considered that the liquid phase of the bismuth oxide plays an important role in the Bi(2212) phase formation in the co-deposition process.

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