• Journal of Korean Society of Rural Planning
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• v.18 no.1
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• pp.17-28
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• 2012

Functional mismatch and thought and plan-less material use of recently built boundary barriers in rural areas should greatly degrade their amenity value as one of linear villagescapes, but, their present state-of-art basically necessary for problem-solving had never surveyed up to now. From this point of view, this study tried to investigate present stock quantities and qualities of boundary barriers in rural areas by sample studies on 21 case villages(7 types ${\times}$ 3 cases) and comparative analysis between the planned or improved and nots. Wall type was absolutely dominated in the structural terms, of which more than half was used cement block as building material and, therefore, grey-colored. More than half of total barrier length were fully shielded, while relatively partially shielded in the mountainous villages in open space and 'Cultural villages' with closed housing structures. Free standing style of barriers was shown along over two thirds of their total length, although not more than half in planned reclaimed villages. Especially, because of one-sided wall type structure, mismatched over-shieldness and poorer maintenance condition of the boundary barriers in peri-urban villages, there should be provided with very intensive improvement efforts for amenity barriers.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.573-573
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• 2012

High quality $VO_2$ thin films were successfully grown on GaN substrate by optimizing oxygen partial pressure during the growth using RF sputtering technique. The $VO_2$ thin film grown on GaN substrate exhibited an unusual metal insulator transition behavior, which was known to be observed only either in doped sample or under uniaxial stress. Raman spectra also confirmed that metal insulator transition occurred from monoclinic M1 to rutile R phase via monoclinic M2 phase with increasing temperature. We believe that large lattice mismatch between $VO_2$ and GaN substrate may cause M2 phase to be thermodynamically stable. Optical transmittance and its electrical switching behavior were carefully investigated to elucidate the underlying physics of its metal insulator transition behavior. This study may lead to a unique opportunity to better understand the growth mechanism of M2 phase dominant $VO_2$ thin films.

• Journal of Korea Foundry Society
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• v.29 no.4
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• pp.181-186
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• 2009

The interrelationship between new parameter ${\sigma}$ and maximum diameter $D_{max}$ is elaborated and discussed in comparison with four other glass forming ability (GFA) parameters, i.e. (1) super-cooled liquid region ${\Delta}T_x (=T_x - T_g)$, (2) reduced glass transition temperature $T_{rg} (=T_g/T_l)$, (3) K parameter $K (=[T_x-T_g]/[T_l -T_x])$, and (4) gamma parameter ${\gamma}(=[T_x]/[T_l+T_g])$ in Ca-based bulk metallic glass (BMG) systems. The ${\sigma}$ parameter, defined as ${\Delta}T^*{\times}P^'$, has a far better correlation with $D_{max}$ than the GFA parameters suggested so far, clearly indicating that the liquid phase stability and atomic size mismatch dominantly affect the GFA of Ca-based BMGs. Thus, it can be understood that the GFA of BMGs can be properly described by considering structural aspects for glass formation as well as thermodynamic and kinetic aspects for glass formation.

• Proceedings of the KIEE Conference
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• 2000.07c
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• pp.1646-1648
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• 2000

This paper investigated structural and electrical properties of $Y_{2}O_3$ as a buffer layer of sin91r transistor FRAM (ferroelectric RAM). $Y_{2}O_3$ buffer layers were deposited at a low substrate temperature below 400$^{\circ}C$ and then RTA (rapid thermal anneal) treated. Investigated parameters are substrate temperature, $O_2$ partial pressure, post- annealing temperature, and suppression of interfacial $SiO_2$ layer generation. for a well-fabricated sample, we achieved that leakage current density ($J_{leak}$) in the order of $10^{-7}A/cm2$, breakdown electric field ($E_{br}$) about 2 MV/cm for $Y_{2}O_3$ film. Capacitance versus voltage analysis illustrated dielectric constants of 7.47. We successfully achieved an interface state density of $Y_{2}O_3$/Si as low as $8.72{\times}10^{10}cm^{-2}eV^{-1}$. The low interface states were obtained from very low lattice mismatch less than 1.75%.

• Corrosion Science and Technology
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• v.6 no.1
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• pp.29-32
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• 2007

The final goal of this study is to develop the core technologies applicable to the design, operation and maintenance of welds in nuclear structures. This study includes predicting microstructure changes and residual stress for welded parts of nuclear power plant components. Furthermore, researches are performed on evaluating fatigue, corrosion, and hydrogen induced cracking and finally constructs systematically integrated evaluation system for structural integrity of nuclear welded structures. In this study, metallurgical and mechanical approaches have been effectively coordinated considering real welding phenomena in the fields of welds properties such as microstructure, composition and residual stress, and in the fields of damage evaluations such as fatigue, corrosion, fatigue crack propagation, and stress corrosion cracking. Evaluation techniques tried in this study can be much economical and effective in that it uses theoretical/semi-empirical but includes many additional parameters that can be introduced in real phenomena such as phase transformation, strength mismatch and residual stress. It is clear that residual stress makes great contribution to fatigue and stress corrosion cracking. Therefore the mitigation techniques have been approached by reducing the residual stress of selected parts resulting in successful conclusions.

• Structural Engineering and Mechanics
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• v.44 no.6
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• pp.815-837
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• 2012

A plated beam is strengthened by bonding a thin plate to the tension face; it often fails because of premature debonding of the thin plate from the original beam in a brittle manner. A sound understanding of the mechanism of such debonding failure is very important for the effective use of this strengthening technique. This paper presents an improved analytical solution for interfacial stresses that incorporates multiple loading conditions simultaneously, including prestress, mechanical and thermal loads, and the effects of adherend shear deformations and curvature mismatches between the beam and the plate. Simply supported beams bonded with a thin prestressing plate and subjected to both mechanical and thermal loading were considered in the present work. The effects of the curvature mismatch and adherend shear deformations of the beam and plate were investigated and compared. The main mechanisms affecting the distribution of interfacial stresses were analyzed. Both the normal and shear stresses were found to be significantly influenced by the coupled effects of the elastic moduli with the ratios $E_a/E_b$ and $E_a/E_p$.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.39-47
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• 2002

Heat is always the root of stress acting upon the electronic package, regardless of the heat due to the device itself during operation or working under the adverse environment. Due to the significant mismatch in coefficient of thermal expansion (CTE) and the thermal conductivity (K) of the packaging components, on one hand intensive research has been conducted in order to enhance the device reliability by minimizing the mechanical stressing and deformation within the package. On the other hand the effectiveness of different thermal enhancements are pursued to dissipate the heat to avoid the overheating of the device. However, the interactions between the thermal-mechanical loading has not yet been address fully. in articular when the temperature gradient is considered within the package. To address the interactions between the thermal loading upon the mechanical stressing condition. coupled-field analysis is performed to account the interaction between the thermal and mechanical stress distribution. Furthermore, process induced defects are also incorporated into the analysis to determine the effects on thermal conducting path as well as the mechanical stress distribution. It is concluded that it feasible to consider the thermal gradient within the package accompanied with the mechanical analysis, and the subsequent effects of the inherent defects on the overall structural integrity of the package are discussed.

• Journal of the Semiconductor & Display Technology
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• v.7 no.2
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• pp.45-48
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• 2008

An epitaxial $\beta-FeSi_2$ structure on Si (001) substrate was calculated by using density functional theory (DFT). Unit cell of orthorhombic $\beta-FeSi_2$ and $\sqrt{2}\times\sqrt{2}\times2$ supercell were calculated to find the energetically favorable structures first. The $\chi$- and y-direction axes of $\beta-FeSi_2$ were changed into y- and z-direction axes to match its structure with that of Si, to minimize the lattice mismatch between $\beta-FeSi_2$ and Si. Distance between the Si (001) surface and the $\beta-FeSi_2$ surface was varied to find an optimum distance between them, resulting in 0.825 $\AA$.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.140-143
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• 2003

BST thin films have a good thermal-chemical stability, insulating effect and variety of phases. However, BST thin films have problems of the aging effect and mismatch between the BST thin film and electrode. Also, due to the high defect density and surface roughness at grain boundarys and in the grains, which degrades the device performances. In order to overcome these weakness, we first applied the chemical mechanical polishing (CMP) process to the polishing of ferroelectric film in order to obtain a good planarity of electrode/ferroelectric film interface. BST ferroelectric film was fabricated by the sol-gel method. And then, we compared the structural characteristics before and after CMP process of BST films. We expect that our results will be useful promise of global planarization for FRAM application in the near future.

• Journal of Ocean Engineering and Technology
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• v.33 no.2
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• pp.196-202
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• 2019

In this study, the excessive noise and vibration phenomena of a high-speed Ro/Ro passenger ship were analyzed, and a countermeasure was taken based on them. This ship was granted a comfort class notation by the classification society, which was COMFORT-VIBRATION-II and COMFORT-NOISE-CREW-II. However, unfortunately, excessive noise and vibration in the aft part of the ship were delivered from the twin shaft propellers, and therefore the Class Requirement was not satisfied before delivery. In order to obtain the class notation, all of the concerned parties came to an agreement to reduce the noise and vibration level during operation after delivery because a seasonal ferry service was already scheduled and the cabin was fully booked. The root cause of the massive amount of noise and vibration was mainly the propeller-induced excitation pulse and beating that occurred from the mismatch of the rotating speeds of the two shaft lines. A 1st order vibrating force and beating phenomena existed in the propeller. Thus, a reduction of the excitation force, elimination of the beating phenomena, and decrease of the noise level at the aft area cabins and public spaces were required. In addition, structural reinforcements were conducted using pillars and additional girders at the aft part of the decks.