• Proceedings of the Korea Air Pollution Research Association Conference
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• 2005.11a
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• pp.175-176
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• 2005

• Proceedings of the Korean Society for Agricultural Machinery Conference
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• 1993.10a
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• pp.696-703
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• 1993

• 대한방사선방어학회:학술대회논문집
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• 2011.11a
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• pp.274-275
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• 2011

• Proceedings of the Korean Environmental Health Society Conference
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• 2004.12a
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• pp.71-71
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• 2004

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.26 no.2
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• pp.158-165
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• 2017

This study investigated spraying factors applicable to stripper usage. Cyclodextrine, as environment-friendly material, was included in the stripper composition. An efficient spray technology was applied for the Photoresist strip. For industrial applications, stripping requires a temperature below $50^{\circ}C$, a strip time within 50 s, and chemically stable activation. Spraying factors were organized considering many conditions-orifice diameter, working pressure (inlet speed), spray distance, and spray angle. For commercial practicability, the flow rate was limited to 3 L/min. The nozzle parameters were nozzle orifice diameter of 1.8-2.2 mm, spray distance of 40-60 mm, and injection speed of 0.7-1.2 m/s. Through the thermal spray movement of the fluid, the thermal boundary layer for a chemical reaction just above the ITO-glass surface and momentum region for sufficient agitation (above 4 m/s) was achieved.

• Resources Recycling
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• v.23 no.3
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• pp.37-43
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• 2014

A study has been made on the recovery of tin and copper from waste solder stripper by oxalate precipitation. With the increasing of the oxalic acid addition, tin was precipitated effectively and removed above 99.5% of tin when the oxalic acid, in an amount 1.0-1.5 times the stoichometric requirement, was added. But, in this case, only 2.0% of copper was precipitated and lead, iron were not precipitated. So, tin was selectively removed from the waste solution. With the increasing of the reaction temperature, the removal percentage of tin was increased and maximum value at arounf $60^{\circ}C$ and decreased with increase in the temperature any more. After filtering the precipitate and drying in oven, $SnO_2$ was obtained from the precipitate. After removal of tin in stripping solution, above 91% of copper was selectively removed by Cu-oxalate by addition of oxalic acid.

• Journal of the Korean Vacuum Society
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• v.18 no.2
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• pp.97-101
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• 2009

In the modem semiconductor industry, the progress that consumes the most capital and labor is cleansing process. Cleansing process is to remove impurities that can affect the operation of the device and deteriorate its function. Especially, Photoresist (PR) progress that etches the device always requires cleansing at the end of the progress. Also, HDI-PR (High-Dose Ion-implanted Photoresist) created from PR progress is difficult to remove. Thus, in modem IC cleansing, many steps of cleansing are used, including dry and wet cleansing. In this paper, we suggested to combine existing dry-cleansing and wet-cleansing, each represented by plasma cleansing and stripper solution, as Plasma Liquid-Vapor Activation (PLVA). This PLVA method enhances the effect of existing cleansing solution, and decreases the amount of solution and time required to strip. We stripped HDI-PR by activated solution and measured surface hardness and Young's modulus by Nano-indenter. Nano-indenter is the equipment that determines the hardness and the modulus of elasticity by indenting nano-sized tip with specific shape into the surface and measuring weight and z-axis displacement. We measured the change of surface hardness and Young's modulus before and after the cleansing. As a result, we found out that the surface hardness of the sample sharply decreased after the cleansing by plasma-activated PR stripper solution. It can be considered that if physical surface-cleansing process is inserted after this, more effective elimination of HDI-PR is possible.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2013.05a
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• pp.1373-1374
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• 2013

• Proceedings of the KIEE Conference
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• 2008.04a
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• pp.189-190
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• 2008

원자력발전소의 탈기기 계통(Gas Stripper System)은 약 $25^{\circ}C$의 순수를 1.2기압, $105^{\circ}C$ 상태를 거쳐서 가스가 없는 상태(탈기)로 만들어 주는 계통이다. 탈기 상태를 유지하면서 지속적으로 순수를 만들기 위해서 본 계통에는 수위와 압력 제어루프가 있다. 탈기 상태에서는 탈기기 탱크내의 유체 상태가 이상(Two Phase)이기 차가운 급수를 사용한 수위와 압력 제어가 어렵다. 본 논문에서는 모델 기반으로 제어 최적화를 하기 위하여 제어 구성 요소들에 대한 제어 모델링 및 검증 과정을 기술한다. 제어모델링은 일반적으로 Parameter Identification 기법을 적용하지만, 유체역학 수식 모델, 운전 데이터, 탱크와 배관의 설계 자료 등을 이용한 경험적 방법을 적용하였으며 운전 데이터를 사용하여 검증하였다.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.25 no.1
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• pp.14-20
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• 2016

This paper describes a green stripping process to effectively strip the remaining DFR layer on a non-alkali-based ITO glass surface after an etching process. A stripper, water-soluble amine compound, is used to investigate the characteristics of stripping ability and to suggest a valid method for the green process. Increasing the composition (5-30% concentration) of the ethanol amine-based stripper was found to greatly reduce the stripping time applied in the dipping method. The composition (30%) achieved an excellent stripping effect and free-residue impurities. Additionally, it was possible to obtain the effect of stripping in a way to sustain the release before generating DFR sludge from the ITO glass surface by using dipping condition (stripping time) in the composition. An Additional stripping process (buffering) out of dipping can realize productivity improvement and cost reduction because of the higher proportion of re-use of the stripping solution used in the DFR removal step.