• The KSFM Journal of Fluid Machinery
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• v.14 no.2
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• pp.25-28
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• 2011

The control rod assemblies do freely fall into the reactor core by the gravity from the control rod drive mechanism. In order to achieve a rapid shutdown and control the reactor power, it is required to insert control rod assemblies as soon as possible. In this paper, we evaluated the drop time and flow characteristics caused around guide tube for SMART(System-integrated modular advanced reactor) control rod assembly. Numerical analyses are carried out with FLUENT program of computational fluid dynamics. This study results show that the drop time of the control rod assembly in the operating condition of SMART is more 20 percent rapidly than the drop time of the room temperature and ambient atmosphere condition.

• Journal of the Korean Society for Precision Engineering
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• v.24 no.10
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• pp.99-108
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• 2007

As the structure of a mobile phone becomes thin to catch up with a slim product trend, the reliability of a LCD module is on the rise as a big issue for a product design. A drop test is the most basic and important verification method for a mechanical quality control but it requires much time and cost during a product development process. Thus many manufacturers have considered design guide lines using CAE and simulation for more effective usage of limited resources on the market. In this paper, the Maximum Principle Stress of a LCD glass panel is calculated on the basis of explicit FE Analyses method and input conditions are determined according to the general test standard. The design guideline for reliability improvements are suggested on the basis of the results of FE Analysis.

• Transactions of the KSME C: Technology and Education
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• v.3 no.1
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• pp.37-44
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• 2015

In this paper dynamic deformation of lower hinge of refrigerator is simulated using dynamic finite element analysis while refrigerator is being dropped. The flow stress curves considering velocity dependency of hinge and lower packing material are determined through bending test and compression test at several dropping speeds. The determined material properties and flow stress from reverse engineering were used as input data for refrigerator's drop test using a dynamic finite element analysis software LS-DYNA. Additionally the result between CAE and 3D deformation measurement from real refrigerator drop test are compared and the result shows that the proposed analysis model is very useful to design lower hinge and lower packing endurable to the impulsive drop impact.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.250-255
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• 2008

This study utilized a high speed lap-shear test to evaluate the mechanical behavior of Sn-37Pb/Cu and Sn-37Pb/Electroless Nickel immersion Gold under bump metallization solder joints under high speed loading and hence the drop reliability. The samples were aged for 120 h at different temperatures ($120^{\circ}C,\;150^{\circ}C,\;170^{\circ}C$) and afterward tested at different displacement rates (0.01 mm/s to 500 mm/s) to examine the effects of aging on the drop life reliability. The combination of the stress-strain graphs captured from the shear tests and identifying a fracture mode dominant in the samples for different strain rates leads us to conclude that the drop reliability of solder joints degrades as the aging temperature increases, possibly due to the role of the IMC layer. This study successfully demonstrates that the analysis based on a high speed lap-shear test could be critically used to evaluate the drop reliability of solder joints.

• Geomechanics and Engineering
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• v.10 no.1
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• pp.109-124
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• 2016

In this paper, process of dynamic powder compaction is investigated experimentally using impact of drop hammer and die tube. A series of test is performed using aluminum powder with different grain size. The energy of compaction of powder is determined by measuring height of hammer and the results presented in term of compact density and rupture stress. This paper also presents a mathematical modeling using experimental data and neural network. The purpose of this modeling is to display how the variations of the significant parameters changes with the compact density and rupture stress. The closed-form obtained model shows very good agreement with experimental results and it provides a way of studying and understanding the mechanics of dynamic powder compaction process. In the considered energy level (from 733 to 3580 J), the relative density is varied from 63.89% to 87.41%, 63.93% to 91.52%, 64.15% to 95.11% for powder A, B and C respectively. Also, the maximum rupture stress are obtained for different types of powder and the results shown that the rupture stress increases with increasing energy level and grain size.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.5
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• pp.559-563
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• 2011

Drop impact reliability assessment of solder joints on the flip chip is one of the critical issues for micro system packaging. Our previous researches have been showing that new solder ball compositions of Sn-3.0Ag-0.5Cu has better mechanical reliability than Sn-1.0Ag-0.5Cu. In this paper, dynamic reliability analysis using Finite Element Analysis (FEA) is carried out to assess the factors affecting flip chip in drop simulation. The design parameters are size and thickness of chip, and size, pitch and array of solder ball with composition of Sn1.0Ag0.5Cu. The board systems by JEDEC standard including 15 chips, solder balls and PCB are modeled with various design parameter combinations, and through these simulations, maximum yield stress and strain at each chip are shown at the solder balls. It is found that larger chip size, smaller chip array, smaller ball diameter, larger pitch, and larger chip thickness have bad effect on maximum yield stress and strain at solder ball of each chip.

• Transactions of Materials Processing
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• v.18 no.1
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• pp.20-25
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• 2009

A finite element analysis was carried out for a 4:1 planar contraction die for polymer melts using the viscoelastic constitutive equation of Leonov. Viscoelastic fluids showed significant differences in pressure drop and birefringence in contraction and expansion flows. The pressure drop was higher and the birefringence smaller in expansion than in contraction flow. The difference increased with increasing flow rate. The nonlinear Leonov model was shown to describe the viscoelastic effects observed in experiments.

• Proceedings of the Earthquake Engineering Society of Korea Conference
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• 2000.04a
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• pp.28-35
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• 2000

The quality factor and the seismic source parameters such as the $\chi$ corner frequency and the stress drop were estimated from the small-to-medium instrumental earthquake data in south Korea. The Q facter with 95% confidence level ranges from 1519 to 2158. The regression equation of $\chi$in terms of epicentral distance R, is obtained as $\chi$=0.006717+0.00015R. And the stress drop is estimated as 50 bar which is similar to the previous results carried out by independent researchers. Artificial ground motions were simulated using the estimated earthquake parameter values and compared with real earthquake, The simulated response spectrum is very similar to real one.

• Journal of the Korean Society of Industry Convergence
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• v.6 no.4
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• pp.367-371
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• 2003

In order to determine the effective way of measuring the Mode I stress intensity factor for a material containing a two-dimensional surface crack by means of the alternating current potential drop(ACPD) technique, the change in magnetic flux density between crack surfaces and above the specimen surface due to load was studied theoretically. The magnetic flux density in the air between crack surfaces is uniform and above the specimen surface is not changed by increasing the load in the material. Therefore, the change in potential drop due to load in a measuring system which was designed to induce a large amount of electro-motive force was caused by the change in internal inductance of material, the change in the mutual inductance between internal inductance of material and measuring system and the change in the mutual inductance between internal inductance of material and power supply line.

• Journal of the Korean Society of Industry Convergence
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• v.7 no.1
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• pp.129-132
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• 2004

In order to determine the effective way of measuring the Mode I stress intensity factor, $K_I$, by means of the alternating current potential drop(ACPD) technique for a material containing a two-dimensional surface crack, the change in magnetic flux density above the cracked specimen surface was studied experimentally. The change in magnetic flux in the air above the cracked specimen made of aluminum alloy is measured by changing the load by four-point bending. The magnetic flux in the air is almost not changed by increasing the load in teh specimen. The change in potential drop due to load is not caused by the change in electro-motive force induced in the coiled measuring system. This experimental result agree to the result of theoretical analysis in reference 7).