• 제목/요약/키워드: Stress dependence

검색결과 426건 처리시간 0.023초

COVID-19 팬데믹이 BTC 변동성과 거래량의 관계구조에 미친 영향 분석: CRQ 접근법 (The Impact of COVID-19 Pandemic on the Relationship Structure between Volatility and Trading Volume in the BTC Market: A CRQ approach)

  • 박범조
    • 경제분석
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    • 제27권1호
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    • pp.67-90
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    • 2021
  • 본 연구는 투자자의 거래행태를 민감하게 반영하는 비트코인(BTC) 시장 자료를 이용한 실증분석을 통해 COVID-19 팬데믹이 발생하기 전과 후에 변동성과 거래량의 비선형 관계가 바뀌었다는 흥미로운 사실을 발견하였다. 즉, COVID-19 팬데믹 이전의 안정적 시장 상태에서는 정보 유입 패러다임에 근거한 이론처럼 두 변수의 관계가 양(+)으로 나타났지만 COVID-19 팬데믹 기간에 발생한 극단적 시장 스트레스 상태에서는 두 변수의 의존관계 구조가 달라지고 심지어 음(-)의 관계가 나타났다. 이는 행태경제학적 관점에서 COVID-19 팬데믹 기간의 시장 스트레스 증가가 투자자의 거래 행태(behavior)를 변화시켜 자산시장에 구조변화를 일으켰으며, 변동성과 거래량의 비선형 의존관계(특히, 극단적 분위수(quantiles)의 의존성)에 중대한 영향을 미친 결과라고 추론해 볼 수 있다. 따라서 정보 유입 외에 시장 스트레스로 인한 행태적 편의나 군집행동(herding)과 같은 심리현상이 두 변수의 의존관계 구조를 변화시키는 주요인이 될 수 있다는 전제하에 이를 검정해보았다. 본 연구는 실증분석을 위해 Ross (2015)의 구조변화 탐지 검정을 수행하였으며, 독립적이고 동일하게 분포하는(i.i.d.) 임의변수 가정 없이 비선형 관계구조와 분포 꼬리 부분의 비대칭적 의존관계를 면밀히 파악할 수 있는 Copula 회귀분위수(CRQ) 접근법을 제안하였다.

Dependence of Stress-Induced Leakage Current on Low Temperature Polycrystalline Silicon TFTs

  • Chen, Chih-Chiang;Chang, Jiun-Jye;Chuang, Ching-Sang;Wu, Yung-Fu;Sheu, Chai-Yuan
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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    • pp.622-625
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    • 2003
  • The dependence of stress-induced leakage current on LTPS TFTs was characterized in this study. The impacts of poly-Si crystallization, gate insulator, impurity activation, hydrogenation process and electrostatic discharge damage were investigated. It was observed more TFTs instable characteristic under those process-assisted processes. According to the LTPS roadmap, smaller geometric and low temperature process were the future trend and the stress-induced leakage current should be worthy of remark.

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이종마찰압접 계면근방에서의 피로균열의 전파거동 및 해석 (Analysis and Propagation Behavior of Dissimilar Friction Welded Materials for Fatigue Crack in around Interface)

  • 오환섭
    • 한국공작기계학회:학술대회논문집
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    • 한국공작기계학회 1998년도 추계학술대회 논문집
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    • pp.140-145
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    • 1998
  • In this study, analysis for fatigue crack propagation behavior of interface and aroud interface under rotary bending stress. Though K values are nearly the same in around interface by BEM 2-D, fatigue crack propagated H.A.Z. Around Interface crack propagation speed is m=0.678 in H.A.Z by Paris' law. In this case(friction welded materials: STS304, SM15C), fatigue crack growth is considered SM15C metal microstructure and elastic flow from this result. Result is more metal microstructute dependence than stress dependence by analysis (BEM 3-D, BEM 2-D) and fatigue crack propagation

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NO기반 게이트절연막 NMOS의 AC Hot Carrier 특성 (Characteristics of AC Hot-carrier-induced Degradation in nMOS with NO-based Gate Dielectrics)

  • 장성근;김윤장
    • 한국전기전자재료학회논문지
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    • 제17권6호
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    • pp.586-591
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    • 2004
  • We studied the dependence of hot-tarrier-induced degradation characteristics on nitrogen concentration in NO(Nitrided-Oxide) gate of nMOS, under ac and dc stresses. The $\Delta$V$_{t}$ and $\Delta$G$_{m}$ dependence of nitrogen concentration were observed, We observed that device degradation was suppressed significantly when the nitrogen concentration in the gate was increased. Compared to $N_2$O oxynitride, NO oxynitride gate devices show a smaller sensitivity to ac stress frequency. Results suggest that the improved at-hot carrier immunity of the device with NO gate may be due to the significantly suppressed interface state generation and neutral trap generation during stress.ess.

사파이어($\alpha$-Al$_2$O$_3$) 단결성에 있어 prism plane slip 전위속도의 온도 및 응력의존성 (Temperature and stress dependence of prism plane slip dislocation velocity in sapphire ($\alpha$-Al$_2$O$_3$) single crystals)

  • 윤석영;이종영
    • 한국결정성장학회지
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    • 제10권4호
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    • pp.337-343
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    • 2000
  • 사파이어 ($\alpha$-Al$_2$O$_3$) 단결정에 있어 prism plane slip {11$\bar{2}$0}1/3{$\bar{1}$120} 전위속도를 에치-피트 방법으로 측정하였다. 전위속도 측정시 온도범위는 $1150^{\circ}C$에서 $1400^{\circ}C$까지 였으며, 응력범위는 140 MPa에서 250 MPa까지였다. 얻어진 전위속도의 온도 및 응력 의존성에 대해 검토하였다. 전위속도의 온도의존성을 이용하여 prism plane slip 전위속도를 위한 활성화에너지를 구하였으며, 그 값은 대략 4.2$\pm$0.4 eV이었다. 또한, 전위속도의 응력의존성을 나타내는 응력지수 m은 4.5$\pm$0.8이었다. 한편, 전위속도 측정을 통해 사파이어 단결정에서 basal 면이 3-fold 대칭을 가진다는 사실을 재확인하였다.

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Revisiting exponential stress corrosion model

  • Elishakoff, Isaac;Miglis, Yohann
    • Ocean Systems Engineering
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    • 제1권2호
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    • pp.121-130
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    • 2011
  • One of the prevailing models that describe the stress corrosion is represented by an exponential dependence between rate of corrosion and stress, suggested by Gutman, Zainullin and Zuripov. This study revisits the exponential model and derives analytical expressions for the structures' durability which is postulated as the time for stress level to reach its yield value. Comparison is conducted with other possible models, namely with linear, quadratic or cubic cases.

고온상태에서의 크리이프 파단거동에 관한 연구 (A Study on the Creep-Fracture Behavior under High Temperature)

  • 강대민;구양;백남주
    • 한국안전학회지
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    • 제1권1호
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    • pp.41-49
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    • 1986
  • Modern technological progress demands the use of materials at high temperature and high pressure. One of the most critical factors in considering such applications-perhaps the most critical one-is creep behavior. In this study the activation energy for the creep rupture (Qf) and the stress dependence of rupture time (n') have been determined during creep of Al 7075 alloy eve, the temporature range of $200^{\circ}C to 500^{\circ}C$ and stress range of 0.64 kgf/$\textrm{mm}^2$ to 9.55 kgf/$\textrm{mm}^2$, respectively, in order to investigate the creep-rupture property. Constant load creep tests were carried out in the enperiment At around the temperature $210^{\circ}C~390^{\circ}C$ and the stress level 1.53~9.55(kgf/$\textrm{mm}^2$), the stress dependence of rupture time(n') had the value of 6.6~6.78 but at 50$0^{\circ}C$, the value of 1.3. Besides at around the temperature of $200^{\circ}C~500^{\circ}C$ and under the stress level of 0.89~8.51 (kgf/$\textrm{mm}^2$), the activation energy for the creepprupture (Qf) was nearly equal to that of the volume self diffusion of pure aluminum (34Kca1/mo1e)

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한국 성인의 음주 유형에 대한 영향요인 (Factors associated with the Patterns of Alcohol Use in Korean Adults)

  • 정성석;정경화
    • 성인간호학회지
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    • 제24권5호
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    • pp.441-453
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    • 2012
  • Purpose: This secondary data analysis study was aimed at identifying the factors related to the patterns of alcohol use (normal alcohol use, hazardous alcohol use, and alcohol dependence) in the Korean adult. Methods: This study analyzed the cross-sectional data from 230,715 Korean adults aged 19 year and older who participated in the 2009 Korean Community Health Survey. Multinomial logistic regression was used to uncover associations between demographic, health related factors and the patterns of alcohol use. Results: The patterns of alcohol use was differentiated from the sociodemographic variables (residential area, gender, age, marital status, educational level, monthly income, and occupation) and with health related factors (smoking status, hours of sleep, body mass index, pain or discomfort, subjective health, stress level, liver disease, cardio/cerebro vascular disease, and depression). Hazardous alcohol use was lower in rural areas and lower among women, but higher among people who smoke, reported severe stress, and/or depression. Similarly, alcohol dependence was lower among women and among those in rural areas, and was more likely associated with those who smoke, have severe stress and depression. Conclusion: A number of factors are associated with patterns of drinking. Smoking, severe stress and depression seems to confound the problems of alcohol use. Additional research is needed to isolate those factors that are the most important influencing the use of alcohol.

합금속의 수소취성과 응력부식균열 고찰 (Review on Delayed Hydride Cracking and Stress Corrosion Cracking of Metals)

  • 김영석;정용무;임경수
    • 한국수소및신에너지학회논문집
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    • 제15권4호
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    • pp.266-273
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    • 2004
  • The objective of this study is an understanding of stress corrosion cracking of metals that is recognized to mostly limit the lifetime of the structural materials by comparing the features of delayed hydride cracking of zirconium alloys with those of stress corrosion cracking (SCC) of Ni-based alloys and hydrogen cracking of stainless steels. To this end, we investigated a dependence of delayed hydride cracking (DHC) velocity on the applied stress intensity factor and yield strength, and correlated a temperature dependence of the striation spacing and the DHC velocity. We reviewed a similarity of the features between the DHC of zirconium alloys, the SCC of Ni-based alloys and turbine rotor steels, and the hydrogen cracking of stainless steels and discussed the SCC phenomenon in metals with our DHC mode.

Stress Dependence of Thermal Stability of Nickel Silicide for Nano MOSFETs

  • Zhang, Ying-Ying;Lee, Won-Jae;Zhong, Zhun;Li, Shi-Guang;Jung, Soon-Yen;Lee, Ga-Won;Wang, Jin-Suk;Lee, Hi-Deok;Lim, Sung-Kyu
    • Transactions on Electrical and Electronic Materials
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    • 제8권3호
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    • pp.110-114
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    • 2007
  • Dependence of the thermal stability of nickel silicide on the film stress of inter layer dielectric (ILD) layer has been investigated in this study and silicon nitride $(Si_3N_4)$ layer is used as an ILD layer. Nickel silicide was formed with a one-step rapid thermal process at $500^{\circ}C$ for 30 sec. $2000{\AA}$ thick $Si_3N_4$ layer was deposited using plasma enhanced chemical vapor deposition after the formation of Ni silicide and its stress was split from compressive stress to tensile stress by controlling the power of power sources. Stress level of each stress type was also split for thorough analysis. It is found that the thermal stability of nickel silicide strongly depends on the stress type as well as the stress level induced by the $Si_3N_4$ layer. In the case of high compressive stress, silicide agglomeration and its phase transformation from the low-resistivity nickel mono-silicide to the high-resistivity nickel di-silicide are retarded, and hence the thermal stability is obviously improved a lot. However, in the case of high tensile stress, the thermal stability shows the worst case among the stressed cases.