• Journal of Electrical Engineering and Technology
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• v.6 no.3
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• pp.369-374
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• 2011

An induction motor operated with high voltage source generally generates high current in starting mode and has a long transient time after being started. This large and sustaining starting current causes the end windings of the stator to have excessive electromagnetic force. This force is the source of vibration and has a negative and serious influence on the insulation of end windings. Therefore, designing the end winding part with an appropriate support system is needed. To design the support ring enclosing the end windings, we analyze the distribution of electromagnetic force on the end windings by applying the Biot-Savart's law and the 3D finite element method (FEM), and comparing two simulation methods. Finally, we verify the safety of the support structure of the end winding part using stress analysis, which is analyzed with the electromagnetic forces from the 3D FEM simulation.

• Proceedings of the Korean Society For Composite Materials Conference
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• 1999.04a
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• pp.29-33
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• 1999

this paper concerned with the stress analysis of a diaphragm-type air spring which consists of rubber linings nylon reinforced rubber composite. The analysis is carried out with a finite element method developed to consider the orthotropic properties geometric non-linearity and contact between an air bag and a bead ring The material properties are evaluated with the Halpio-Tsai equations and the rule of mixture. The analysis results demonstrate the variation of the outer diameter the fold height and the vertical force with different models to the design a proper diaphragm air springs.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.713-716
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• 2002

The dimensional accuracy of the cold forged products is strongly dependent on the elastic behavior of the die. The elastic deformation of the die is continuously changed during the process. Therefore, it is needed to measure the deformation of die. Strain gauges are used to measure the elastic strains in the die during cold backward extrusion process. The strain gauges are attached on the die surface and embedded at the interface between the die insert and the stress ring. In order to compare the results with the FE-analysis, the rigid-plastic FE-analysis of cold backward extrusion process using DEFORM-3D has been performed, and the analysis of elastic deformation of the die has been done by using ANSYS with non-linear contact.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05b
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• pp.31-34
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• 2003

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing(CMP) process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum 89 arcses. The surfaces of sapphire wafers were mechanically affected by residual stress and surface default. Sapphire wafers's waveness has higher abrasion rate in the edge of the wafer than its center due to Newton's Ring interference.

• Smart Structures and Systems
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• v.6 no.8
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• pp.975-989
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• 2010

Based on the theory of piezo-elasticity, the paper obtains the exact solutions of functionally graded piezoelectric hollow cylinders with different piezoelectric parameter $g_{31}$. Two kinds of piezoelectric hollow cylinders are considered herein. One is a multi-layered cylinder with different parameter $g_{31}$ in different layers; the other is a continuously graded cylinder with arbitrarily variable $g_{31}$. By using the Airy stress function method with plane strain assumptions, the exact solutions of the mechanic and electrical components of both cylinders are obtained when they are subjected to external voltage (actuator) and pressure (sensor), simultaneously. Furthermore, good agreement is achieved between the theoretical and numerical results, and useful conclusions are given.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.1
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• pp.85-91
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• 2004

The sapphire wafers for blue light emitting devices were manufactured by the implementation of the surface machining technology based on micro-tribology. This process has been performed by chemical and mechanical polishing process. The sapphire crystalline wafers were characterized by double crystal X-ray diffraction. The sample quality of sapphire crystalline wafer at surfaces has a full width at half maximum of 89 arcsec. The surfaces of sapphire wafer were mechanically affected by residual stress during the polishing process. The wave pattern of optical interference of sapphire wafer implies higher abrasion rate in the edge of the wafer than its center from the Newton's ring.

• Molecules and Cells
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• v.43 no.11
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• pp.935-944
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• 2020

Aryl hydrocarbon receptor nuclear translocator (ARNT) plays an essential role in maintaining cellular homeostasis in response to environmental stress. Under conditions of hypoxia or xenobiotic exposure, ARNT regulates the subset of genes involved in adaptive responses, by forming heterodimers with hypoxia-inducible transcription factors (HIF1α and HIF2α) or aryl hydrocarbon receptor (AhR). Here, we have shown that ARNT interacts with DDB1 and CUL4-associated factor 15 (DCAF15), and the aryl sulfonamides, indisulam and E7820, induce its proteasomal degradation through Cullin-RING finger ligase 4 containing DCAF15 (CRL4^DCAF15) E3 ligase. Moreover, the two known neo-substrates of aryl sulfonamide, RNA-binding motif protein 39 (RBM39) and RNA-binding motif protein 23 (RBM23), are not required for ARNT degradation. In line with this finding, aryl sulfonamides inhibited the transcriptional activities of HIFs and AhR associated with ARNT. Our results collectively support novel regulatory roles of aryl sulfonamides in both hypoxic and xenobiotic responses.

• Korean Journal of Environment and Ecology
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• v.16 no.1
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• pp.1-9
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• 2002

This study was carried out to examine the tree-ring growth characteristics of Pinus thunbergii Parl. after replanting on the reclaimed land from the sea in Kwangyang bay, The factors, mostly affecting the growths of Pinus thunbergii Parl. , were the replanting stress and drought. The growth reduction due to replanting occurred in the replanting year and following year, but that due to drought after 2-3 years of replanting. The growth recovery after replanting differed with soil condition. The sites showing fast recovery were the covered ground of improve soil, the ground of medium mounding, the top and the slope ground of big mounding sites. The filled ground of improve soil and the lower ground of big mounding sites showed retarded growths. The mean sensitivity(year-to-year variation) and the coefficient of variation(tree-to-tree variation in a certain year) in tree rings of Pinus thunbergii Parl. were higher in the poor soil sites than in the favourable soil ones. The physical characteristics of the soil, especially soil hardness, were the most crucial. The mean sensitivity and the coefficient of variation were also low in the salty soil environment.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.2
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• pp.101-105
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• 2010

Silicon electrode and ring in a plasma etcher those are in contact with harsh plasma suffer from periodic heating and cooling during their lifetime. This causes the silicon components failure due to thermal stress remaining the persistent slip bands (PSBs) on their surfaces. The factors that determine the lifetime of silicon electrode and ring were discussed with respect to silicon ingot. The impurity level and the average defect concentration measured with glow discharge mass spectrometer (GDMS) and microwave photo-conductance decay (${\mu}$-PCD) were compared with the grade of silicon ingots those are divided to slip-free and slip-allowed ingot. Some silp-allowed samples showed planar defects along <110> direction on {001} surface. The role of these defects was suggested from the viewpoint of the lifetime of silicon components.

• Journal of the Korea Concrete Institute
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• v.21 no.4
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• pp.523-530
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• 2009

For designing concrete structures, engineers are provided data from unidirectional flexure test in most cases. But real structural components such as pavements and deck panel are subjected to multiaxial stress throughout their body. Therefore, biaxial flexure test for concrete may be considered as a gage of the performance of concrete in service. In this paper, we propose the optimum biaixial flexture test (BFT) to measure the biaxial flexural strength of concrete. This method are an improved version of the ring-on-ring test which have been used extensively in the fields of ceramics and biomaterials. The optimum geometry of the test specimen was determined by using a three-dimensional finite element analysis. A series of test data obtained from the proposed test method is provided to show that the proposed optimum biaxial flexure test method can be used to identify the biaxial tensile strength of concrete.