• 제목/요약/키워드: Standard Module

검색결과 819건 처리시간 0.033초

산업용 EMS를 고려한 누설전류 센싱 컨트롤러의 개발 (Development of Leakage Current Sensing Controller in Consideration of Industrial EMS)

  • 박성원;노인배;김상동;박지호;김동완
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2009년도 춘계학술대회 논문집 전기설비전문위원
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    • pp.70-71
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    • 2009
  • In recent years, a importance of EMS(Electromagnetic Susceptibility) is increased with the spread of a communication device significantly. The compatibility of EMS is evaluated by conduction and radiation of EMI(Electromagnetic Interference). In this paper, a leakage current sensing controller which is considered of industrial EMS is developed. The developed system is consisted of power module, sensing module of leakage current, processer module, display module and communication module. The developed system is evaluated the compatibility of EMS by conduction and radiation of EMI. In evaluation results, the developed system is compatible to the standard of industrial EMS.

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전원 고조파 방지 회로를 내장한 low-cost 인버터 통합 모듈 개발에 관한 연구 (A Study on the Development of a Low Cost Inverter Integration Module with a Protection Circuit of Source Harmonics)

  • 김태규;최현의;안호균;윤태성
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2008년도 제39회 하계학술대회
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    • pp.930-931
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    • 2008
  • This study is on the development of a low cost inverter module with Power Factor Correction(PFC) circuit which satisfies the international harmonic current standard such as IEC61000-3-2. In this study, the performances of the PFC circuit applying a new control method are simulated and verified by Matlab/Simulink. Also, the inverter module with the designed PFC circuit is implemented and the experimental results for the module are presented. Finally, through an analysis for the results of the simulation and the experiment, the merits obtainable by applying the PFC circuit when designing an inverter module are discussed and presented.

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차량 네트워크 시스템의 결함 허용을 위한 IEEE 1451 기반 중복 CAN 모듈의 구현 (Implementation of IEEE 1451 based Dual CAN Module for Fault Tolerance of In-Vehicle Networking System)

  • 이종갑;김만호;박지훈;이석;이경창
    • 제어로봇시스템학회논문지
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    • 제15권7호
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    • pp.753-759
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    • 2009
  • As many systems depend on electronics in an intelligent vehicle, concern for fault tolerance is growing rapidly. For example, a car with its braking controlled by electronics and no mechanical linkage from brake pedal to calipers of front tires(brake-by-wire system) should be fault tolerant because a failure can come without any warning and its effect is devastating. In general, fault tolerance is usually designed by placing redundant components that duplicate the functions of the original module. In this way a fault can be isolated, and safe operation is guaranteed by replacing the faulty module with its redundant and normal module within a predefined interval. In order to make in-vehicle network fault tolerant, this paper presents the concept and design methodology of an IEEE 1451 based dual CAN module. In addition, feasibility of the dual CAN network was evaluated by implementing the dual CAN module.

실리콘 광벤치 및 자동 광섬유/필터 정렬시스템을 이용한 극소형 광통신용 Add/Drop 모듈의 설계 제작 및 실험 (Design, Fabrication and Test of the Micro Optical Add/Drop Module Using Silicon Optical Bench and Automatic Optical Fiber/Filter Alignment System)

  • 최두선;박한수;서영호;김성곤;제태진;황경현
    • 소성∙가공
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    • 제13권3호
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    • pp.211-215
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    • 2004
  • Recently, one of remarkable tends in the development of optical communication industry is the miniaturization and integration of products. The alignment system of micro optical module is a key apparatus for the miniaturization of optical module and the development of optical communication parts with high functionality. In this research, we have developed a system capable of automatic alignment of a $30\mu\textrm{m}$-thick film filter and a lensed fiber in order to improve the speed and losses in the optical fiber-to-filter alignment of optical modules. Using the developed automatic alignment system and silicon optical bench, we have measured optical loss and characteristics of the assembled optical add/drop module before packaging $1{\times}1$ OADM optical module. Whole size of add/drop module was less than $5mm{\times}5mm{\times}1mm$. The measured maximum insertion loss was 0.294㏈ that is below 0.3㏈ which is a standard loss of optical module.

고수준 필드버스 기반의 클러스터 툴 모듈 통신 (Cluster Tool Module Communication Based on a High-level Fieldbus)

  • 이진환;이태억;박정현
    • 한국경영과학회:학술대회논문집
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    • 대한산업공학회/한국경영과학회 2002년도 춘계공동학술대회
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    • pp.285-292
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    • 2002
  • A cluster tool for semiconductor manufacturing is an integrated device that consists of several single wafer processing modules and a wafer transport module based on a robot. The distributed module controllers are integrated by an inter-module communication network and coordinated by a centralized controller, called a cluster tool controller (CTC). Since the CTC monitors and coordinates the distributed complex module controllers for advanced process control, complex commuication messaging and services between the CTC and the module controllers are required. A SEMI standard, CTMC(Cluster Tool Module Communication), specifies application-level communication service requirements for inter-module communication. We propose the use of high-level fieldbuses, for instance. PROFIBUS-FMS, for implementing CTMC since the high-level fieldbuses are well suited for complex real-time distributed manufacturing control applications. We present a way of implementing CTMC using PROFIBUS-FMS as the communication enabler. We first propose improvements of a key object of CTMC for material transfer and the part transfer protocol to meet the functional requirements of modem advanced cluster tools. We also discuss mapping objects and services of CTMC to PROFIBUS-FMS communication objects and services. Finally, we explain how to implement the mappings.

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고출력 슁글드 태양광 모듈의 온도 저감에 따른 출력 특성 분석 (Analysis of Output Characteristics of High-Power Shingled Photovoltaic Module due to Temperature Reduction)

  • 배재성;유장원;지홍섭;이재형
    • 한국전기전자재료학회논문지
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    • 제33권6호
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    • pp.439-444
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    • 2020
  • An increase in the temperature of photovoltaic (PV) modules causes reduced power output and shorter lifetime. Because of these characteristics, demands for the heat dissipation of PV modules are increasing. In this study, we attached a heat dissipation sheet to the back sheet of a shingled PV module and observed the temperature changes. The PV shingled module was tested under Standard Test Conditions (STCs; irradiance: 1,000 W/㎡, temperature: 25℃, air mass: 1.5) using a solar radiation tester, wherein the temperature of the PV module was measured by irradiating light for a certain duration. As a result, the temperature of the PV module with the heat dissipation sheet decreased by 3℃ compared to that without a heat dissipation sheet. This indicated that the power loss was caused by a temperature increase of the PV module. In addition, it was confirmed that the primary parameter contributing to the reduced PV module output power was the open circuit voltage (Voc).

고속기록기의 제어운용 소프트웨어 분석 및 개발에 관한 연구 (A Study on Development and Analysis of Control Operation Software of High-Speed Recorder)

  • 황철준;오세진
    • 융합신호처리학회논문지
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    • 제10권4호
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    • pp.280-288
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    • 2009
  • 본 논문에서는 한국우주전파관측망(Korean VLBI Network; KVN)을 통하여 천체의 미약한 우주전파를 고속으로 기록하는 Mark5B 고속기록기 시스템의 제어운용 소프트웨어를 분석하고 VSI(VLBI Standard Interface) 형식의 시각정보를 기록할 수 있는 소프트웨어를 개발하였다. 고속기록기 시스템의 제어운용 소프트웨어는 대용량 하드디스크를 제어할 수 있는 RAID 보드를 구동하는 소프트웨어와 네트워크를 통한 제어운용을 할 수 있다. 핵심 제어 소프트웨어가 시스템에서 구동하고 있으면 네트워크로 입력된 명령을 해석하고 실행 후 결과를 다시 네트워크를 통해 출력하도록 구성되어 있다. 이러한 소프트웨어 분석을 통하여 기록된 관측데이터를 상관처리하기 위해 필요한 시각정보를 함께 기록할 수 있는 소프트웨어를 본 논문에서 개발하였다. 개발된 소프트웨어는 데이터를 기록할 때 입력되는 1PPS 신호의 인터럽트를 확인한 후 데이터 기록과 함께 기록시각정보도 함께 데이터 기록시간동안 기록한다. 개발한 소프트웨어의 정상동작을 확인하기 위해 실제 관측을 수행하였으며, 기록한 데이터의 분석을 통하여 그 유효성을 확인하였다.

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Analysis of Cell to Module Loss Factor for Shingled PV Module

  • Chowdhury, Sanchari;Cho, Eun-Chel;Cho, Younghyun;Kim, Youngkuk;Yi, Junsin
    • 신재생에너지
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    • 제16권3호
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    • pp.1-12
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    • 2020
  • Shingled technology is the latest cell interconnection technology developed in the photovoltaic (PV) industry due to its reduced resistance loss, low-cost, and innovative electrically conductive adhesive (ECA). There are several advantages associated with shingled technology to develop cell to module (CTM) such as the module area enlargement, low processing temperature, and interconnection; these advantages further improves the energy yield capacity. This review paper provides valuable insight into CTM loss when cells are interconnected by shingled technology to form modules. The fill factor (FF) had improved, further reducing electrical power loss compared to the conventional module interconnection technology. The commercial PV module technology was mainly focused on different performance parameters; the module maximum power point (Pmpp), and module efficiency. The module was then subjected to anti-reflection (AR) coating and encapsulant material to absorb infrared (IR) and ultraviolet (UV) light, which can increase the overall efficiency of the shingled module by up to 24.4%. Module fabrication by shingled interconnection technology uses EGaIn paste; this enables further increases in output power under standard test conditions. Previous research has demonstrated that a total module output power of approximately 400 Wp may be achieved using shingled technology and CTM loss may be reduced to 0.03%, alongside the low cost of fabrication.

암호모듈 검증 정책에 관한 연구 (A Study on the Policy of Cryptographic Module Verification Program)

  • 최명길;정재훈
    • 한국산학기술학회논문지
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    • 제12권1호
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    • pp.255-262
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    • 2011
  • 정보통신분야의 발전은 해킹 등의 역기능을 발생에 따라 정보보호를 위한 암호모듈의 한 수요가 급증한다. 국내 암호모듈 평가 기준의 불명확성과 모듈 선정의 어려움은 모듈 및 제품 상호간의 운용 및 호환성 확보를 어렵게 한다. 본 연구는 국외 암호모듈 평가 프로그램인 CMVP(Cryptographic Module Verification Program)를 분석하여 국내 암호모듈 암호 모듈 검증 기준 및 평가 절차, 검증 정책 발전 방향을 제안한다. 본 연구는 국내 암호모듈 발전정책을 제안하여 암호모듈 국제 표준화, 국제 암호모듈 제도에 대한 공조를 기반을 제공한다.

국제물류환경과의 정합성 유지를 위한 국가표준포장모듈 연구 (Studies on the National Standard Packaging Modules to improve Dimensional Integrity on the International Distribution Environment)

  • 이명훈;이유석;김종경
    • 한국포장학회지
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    • 제15권1호
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    • pp.7-16
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    • 2009
  • The purpose of this study was to evaluate current packaging modules and design the most acceptable packaging module for domestic and international distribution systems. An optimum packaging module can reduce package costs as well as total distribution costs such as transport, materials handling and warehouse costs. Three different sizes of packaging modules, namely U-type($600{\times}500\;mm$), K -ype($550{\times}366\;mm$) and I-type($600{\times}400\;mm$), were evaluated in terms of the area efficiency and MOEs(measures of effectiveness) for the T-11($1100{\times}1100mm$) and T-12($1,200{\times}1,000\;mm$) pallets. The results showed that the U-type module could fit very well for both pallets and the area efficiency of each module was more than 99 percents. Area efficiency of K-and I-type modules was greatly affected by the pallet footprint dimensions. U-type module also performed better result from MOEs evaluation. Twenty sub-multiple sizes derived from the U-type module were suggested for the future development of the Korean and ISO standards on dimension of transport packages.

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