• Proceedings of the KIEE Conference
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• 2009.04a
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• pp.70-71
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• 2009

In recent years, a importance of EMS(Electromagnetic Susceptibility) is increased with the spread of a communication device significantly. The compatibility of EMS is evaluated by conduction and radiation of EMI(Electromagnetic Interference). In this paper, a leakage current sensing controller which is considered of industrial EMS is developed. The developed system is consisted of power module, sensing module of leakage current, processer module, display module and communication module. The developed system is evaluated the compatibility of EMS by conduction and radiation of EMI. In evaluation results, the developed system is compatible to the standard of industrial EMS.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.930-931
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• 2008

This study is on the development of a low cost inverter module with Power Factor Correction(PFC) circuit which satisfies the international harmonic current standard such as IEC61000-3-2. In this study, the performances of the PFC circuit applying a new control method are simulated and verified by Matlab/Simulink. Also, the inverter module with the designed PFC circuit is implemented and the experimental results for the module are presented. Finally, through an analysis for the results of the simulation and the experiment, the merits obtainable by applying the PFC circuit when designing an inverter module are discussed and presented.

• Journal of Institute of Control, Robotics and Systems
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• v.15 no.7
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• pp.753-759
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• 2009

As many systems depend on electronics in an intelligent vehicle, concern for fault tolerance is growing rapidly. For example, a car with its braking controlled by electronics and no mechanical linkage from brake pedal to calipers of front tires(brake-by-wire system) should be fault tolerant because a failure can come without any warning and its effect is devastating. In general, fault tolerance is usually designed by placing redundant components that duplicate the functions of the original module. In this way a fault can be isolated, and safe operation is guaranteed by replacing the faulty module with its redundant and normal module within a predefined interval. In order to make in-vehicle network fault tolerant, this paper presents the concept and design methodology of an IEEE 1451 based dual CAN module. In addition, feasibility of the dual CAN network was evaluated by implementing the dual CAN module.

• Transactions of Materials Processing
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• v.13 no.3
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• pp.211-215
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• 2004

Recently, one of remarkable tends in the development of optical communication industry is the miniaturization and integration of products. The alignment system of micro optical module is a key apparatus for the miniaturization of optical module and the development of optical communication parts with high functionality. In this research, we have developed a system capable of automatic alignment of a $30\mu\textrm{m}$-thick film filter and a lensed fiber in order to improve the speed and losses in the optical fiber-to-filter alignment of optical modules. Using the developed automatic alignment system and silicon optical bench, we have measured optical loss and characteristics of the assembled optical add/drop module before packaging $1{\times}1$ OADM optical module. Whole size of add/drop module was less than $5mm{\times}5mm{\times}1mm$. The measured maximum insertion loss was 0.294㏈ that is below 0.3㏈ which is a standard loss of optical module.

• Proceedings of the Korean Operations and Management Science Society Conference
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• 2002.05a
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• pp.285-292
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• 2002

A cluster tool for semiconductor manufacturing is an integrated device that consists of several single wafer processing modules and a wafer transport module based on a robot. The distributed module controllers are integrated by an inter-module communication network and coordinated by a centralized controller, called a cluster tool controller (CTC). Since the CTC monitors and coordinates the distributed complex module controllers for advanced process control, complex commuication messaging and services between the CTC and the module controllers are required. A SEMI standard, CTMC(Cluster Tool Module Communication), specifies application-level communication service requirements for inter-module communication. We propose the use of high-level fieldbuses, for instance. PROFIBUS-FMS, for implementing CTMC since the high-level fieldbuses are well suited for complex real-time distributed manufacturing control applications. We present a way of implementing CTMC using PROFIBUS-FMS as the communication enabler. We first propose improvements of a key object of CTMC for material transfer and the part transfer protocol to meet the functional requirements of modem advanced cluster tools. We also discuss mapping objects and services of CTMC to PROFIBUS-FMS communication objects and services. Finally, we explain how to implement the mappings.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.6
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• pp.439-444
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• 2020

An increase in the temperature of photovoltaic (PV) modules causes reduced power output and shorter lifetime. Because of these characteristics, demands for the heat dissipation of PV modules are increasing. In this study, we attached a heat dissipation sheet to the back sheet of a shingled PV module and observed the temperature changes. The PV shingled module was tested under Standard Test Conditions (STCs; irradiance: 1,000 W/㎡, temperature: 25℃, air mass: 1.5) using a solar radiation tester, wherein the temperature of the PV module was measured by irradiating light for a certain duration. As a result, the temperature of the PV module with the heat dissipation sheet decreased by 3℃ compared to that without a heat dissipation sheet. This indicated that the power loss was caused by a temperature increase of the PV module. In addition, it was confirmed that the primary parameter contributing to the reduced PV module output power was the open circuit voltage (Voc).

• Journal of the Institute of Convergence Signal Processing
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• v.10 no.4
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• pp.280-288
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• 2009

In this paper, we developed new time information recording module of VSI (VLBI Standard Interface) format by analyzing the Mark5B recorder control and operation software with 1Gbps speed, which is able to record the weak signal of space radio source, through the Korean VLBI Network (KVN). The control and operation software of high-speed recorder consists of 2 kinds of software, which is that it can operate RAID control board by controlling large capacity HDD drive and the network control and operation. Especially, core software in high-speed recorder is able to output the results after performing and analyzing the input command. Through the analysis of control and operation software, new time information recording module, which is needed to process the observed data for correlation, is developed. New developed time information recording module can record the time information together after checking the interrupt of 1PPS(Pulse Per Second) input signal when the observed data will be recorded. To verify the normal operation of the developed time information recording module, we performed the real observation test and confirmed the effectiveness of developed software through analyzing the recorded observation data.

• New & Renewable Energy
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• v.16 no.3
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• pp.1-12
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• 2020

Shingled technology is the latest cell interconnection technology developed in the photovoltaic (PV) industry due to its reduced resistance loss, low-cost, and innovative electrically conductive adhesive (ECA). There are several advantages associated with shingled technology to develop cell to module (CTM) such as the module area enlargement, low processing temperature, and interconnection; these advantages further improves the energy yield capacity. This review paper provides valuable insight into CTM loss when cells are interconnected by shingled technology to form modules. The fill factor (FF) had improved, further reducing electrical power loss compared to the conventional module interconnection technology. The commercial PV module technology was mainly focused on different performance parameters; the module maximum power point (Pmpp), and module efficiency. The module was then subjected to anti-reflection (AR) coating and encapsulant material to absorb infrared (IR) and ultraviolet (UV) light, which can increase the overall efficiency of the shingled module by up to 24.4%. Module fabrication by shingled interconnection technology uses EGaIn paste; this enables further increases in output power under standard test conditions. Previous research has demonstrated that a total module output power of approximately 400 Wp may be achieved using shingled technology and CTM loss may be reduced to 0.03%, alongside the low cost of fabrication.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.1
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• pp.255-262
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• 2011

The advancement of information and communication technology has caused a few dysfunction such as hacking. To keep an organization from a harmful hacking, demands for cryptographic modules have been increased. However, the evaluation criteria of cryptographic modules in Korea have been less firmly established. It is difficult for the consumers of cryptographic module to choose an appropriate cryptographic module, and to establish interoperability between applications and cryptographic modules. This study analyzes evaluation criteria, evaluation processes and evaluation policy of CMVP(Cryptographic Module Verification Program) in the advanced countries. The paper suggests a policy for Korea CMVP, in resulting a provision of foundations for international standard and cooperations for international cryptographic policies and systems.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.15 no.1
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• pp.7-16
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• 2009

The purpose of this study was to evaluate current packaging modules and design the most acceptable packaging module for domestic and international distribution systems. An optimum packaging module can reduce package costs as well as total distribution costs such as transport, materials handling and warehouse costs. Three different sizes of packaging modules, namely U-type($600{\times}500\;mm$), K -ype($550{\times}366\;mm$) and I-type($600{\times}400\;mm$), were evaluated in terms of the area efficiency and MOEs(measures of effectiveness) for the T-11($1100{\times}1100mm$) and T-12($1,200{\times}1,000\;mm$) pallets. The results showed that the U-type module could fit very well for both pallets and the area efficiency of each module was more than 99 percents. Area efficiency of K-and I-type modules was greatly affected by the pallet footprint dimensions. U-type module also performed better result from MOEs evaluation. Twenty sub-multiple sizes derived from the U-type module were suggested for the future development of the Korean and ISO standards on dimension of transport packages.