• Title/Summary/Keyword: Stamping

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Improvement of the Stamping Formability by BHF Control (블랭크 홀딩력 제어에 의한 스탬핑 가공성 향상 기술)

  • 김영석;임성언;손형성;한수식
    • Transactions of Materials Processing
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    • v.8 no.3
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    • pp.269-275
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    • 1999
  • A variable blank holding force method is proposed to improve deep drawing characteristics of sheet materials. In this method, the blank holding force (BHF) is controlled throughout a drawing process so that the punch load does not exceed a critical value, which is slightly less than the conventional process with the conforming process with the variable BHF is more flexible than the conventional process with the constant BHF and it could be used for improving the product's quality and drawability. In this paper we suggest a method controlling the BHF as a function of punch travel during the forming process. The optimization BHF curves are determined theoretically and experimentally. It is concluded that for the case of optimum BHF control methods the drawn cup height and the drawing formability achieved by this method are increased than those for constant BHF method. Also, as comparing the wall thickness distribution of the cup drawn by the constant BHF and the optimum BHF control, the BHF control reduce the wall thickness variation of the drawn cup at the cup wall and make the cup thickness distribution more uniformly than the constant BHF.

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Rapid Topological Patterning of Poly(dimethylsiloxane) Microstructure (Poly(dimethylsiloxane) 미세 구조물의 신속한 기하학적 패터닝)

  • Kim, Bo-Yeol;Song, Hwan-Moon;Son, Young-A;Lee, Chang-Soo
    • Textile Coloration and Finishing
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    • v.20 no.1
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    • pp.8-15
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    • 2008
  • We presented the modified decal-transfer lithography (DTL) and light stamping lithography (LSL) as new powerful methods to generate patterns of poly(dimethylsiloxane) (PDMS) on the substrate. The microstructures of PDMS fabricated by covalent binding between PDMS and substrate had played as barrier to locally control wettability. The transfer mechanism of PDMS is cohesive mechanical failure (CMF) in DTL method. In the LSL method, the features of patterned PDMS are physically torn and transferred onto a substrate via UV-induced surface reaction that results in bonding between PDMS and substrate. Additionally we have exploited to generate the patterning of rhodamine B and quantum dots (QDs), which was accomplished by hydrophobic interaction between dyes and PDMS micropatterns. The topological analysis of micropatterning of PDMS were performed by atomic force microscopy (AFM), and the patterning of rhodamine B and quantum dots was clearly shown by optical and fluorescence microscope. Furthermore, it could be applied to surface guided flow patterns in microfluidic device because of control of surface wettability. The advantages of these methods are simple process, rapid transfer of PDMS, modulation of surface wettability, and control of various pattern size and shape. It may be applied to the fabrication of chemical sensor, display units, and microfluidic devices.

A Study on the Springback Characteristics and Bracket Formabilities Enhancement of Aluminum Alloy Sheets for Autobody Application (차체용 알루미늄합금 판재의 스프링백 특성과 브래킷 성형성 향상에 관한 연구)

  • 최문일;강성수
    • Transactions of the Korean Society of Automotive Engineers
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    • v.5 no.6
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    • pp.64-76
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    • 1997
  • This paper deals with development of brackets by using aluminum alloy sheets which is indispensable for weight reduction of autobody. The press formability of aluminum alloy sheet is estimated by means of tensile test, V bending test, sample manufacturing test and photograph of microstructure. The results show that the elongation, strength, work hardening exponent, plastic anisotropy coefficient of Al 6***series are better than those of Al 5***series, but for general press formability, Al 5***series are better than Al 6***series due to lower yield strength. Since most of mechanical properties of aluminum sheet are generally inferior to those of cold-rolled steel sheet, shape fixability and press formability of aluminum sheet are very poor. For making components of autobody by use of die for steel sheet application, it is essential that die should be nodified for least bending and stretching. With the modified die for aluminum, it could be possible to make brackets, the component of autobody. Microstructure of Al 5***series has fine grain and small the 2nd phase and that of Al 6***series has relatively coarse grain. Therefore, it seems that fine grain and small the 2nd phase of Al 5***series is one of the factor of lower yield strength, resistance to stamping work, formation of Luder's line.

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Improvement of Temperature Uniformity in a Hot Plate for Thermal Nanoimprint Lithography by Installing Heat Pipes (히트 파이프를 이용한 열경화성 나노임프린트 장비용 열판의 온도 균일도 향상)

  • Park, Gyu Jin;Yang, Jin Oh;Lee, Jae Joong;Kwak, Ho Sang
    • Journal of the Semiconductor & Display Technology
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    • v.15 no.2
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    • pp.74-80
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    • 2016
  • This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.

A Simplified Approach for Predicting Springback in U-Draw Bending of Sheet Metals (용접 판재의 U 드로오 벤딩에서 스프링백 예측을 위한 이론적 단순화)

  • Chang S. H;Seo D. G.
    • Transactions of Materials Processing
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    • v.13 no.8
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    • pp.678-688
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    • 2004
  • The U-draw bending operation is known as a representative test method for springback evaluation of sheet metals since the sheet in U-draw bending operation undergoes stretching, bending and unbending deformations occurred at the stamping process. In this study, a simplified approach was proposed for predicting springback and side-wall curls of tailor-welded blank in U-draw bending operations, using moment-curvature relationships derived for sheets undergoing stretching, bending and unbending deformation. Two different welded strips were adopted to compare the effects of weld-line locations on the springback. One (type A) was welded along the centerline of the strip-width and the other (type B) was welded along the centerline of the strip-length. To investigate the effect of different thickness combination on the springback, the tailor-welded strips were joined by the laser welding process and consisted of three types of thickness combinations of sheets, SCP1 0.8t * SCP1 1.2t, SCP1 0.8t * SCP1 1.6t and SCP1 0.8t * TRIP 1.0t. Some calculated results by the simplified formula were compared with experimental results.

Compensation Design to Reduce Springback in Sheet Metal Forming of 1.2GPa Ultra High Strength Steel (1.2GPa급 강판 판재 성형에서 스프링백 감소를 위한 금형 보상 설계)

  • Kwon, S.H.;Lee, H.S.;Lee, Y.S.;Kim, S.W.;Jung, C.Y.;Hong, S.
    • Transactions of Materials Processing
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    • v.25 no.5
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    • pp.301-305
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    • 2016
  • The manual modification of stamping die has widely been used in order to reduce springback after sheet metal forming. When UHSS (Ultra High Strength Steel) is used in sheet metal forming, the die design considering springback compensation is more difficult because higher strength sheet has more springback. In this study, the optimization method was used in order to design die geometry considering springback compensation after forming of 1.2GPa UHSS. Die geometries were defined as design variables and the springback distance from the die surface was conducted as object function in optimization process. The optimized die geometry considering springback compensation was performed using finite element and optimization analysis. The simulation results such as thickness distribution and springback amount were compared with measured data using 3D optical measurement system (GOM ARGUS, ATOS). And the prediction of springback amount showed a good agreement within test results.

Postmortem Distribution of Methidathion in Human Specimens of a Acute Poisoning (Methidathion 중독사에 의한 사후혈액 및 조직중 분포)

  • 이종숙;이재신;최동기;양희진;이상기;구기서;유영찬
    • YAKHAK HOEJI
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    • v.46 no.2
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    • pp.93-97
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    • 2002
  • Methidathion is one of the organophosphorus pesticides commonly used for stamping out harmful pests in farming areas. This paper presents a fatality due to methidathion intoxication and describes the distribution of methidathion in postmortem blood and tissues obtained at autopsy. Qualitative identification of methidathion was achieved by TLC, GC and GC/MS, and quantitative analysis was performed by GC with thermionic specific detector (TSD). The analytes in postmortem specimens were extracted by liquid-liquid extraction (LLE) with ethylether. After the ethylether layer was evaporated, the residue was partitioned into hexane and acetonitrile, and the acetonitrile layer was used for analysis. Tissue specimens were homogenized with 4% perchloric acid and applied for LLE. After extraction, the extracts were reconstituted 100 $\mu\textrm{g}$ pyraclofos (IS, 100 $\mu\textrm{g}$/ml in methanol) for GC and GC/MS analysis. On analysis of postmortem specimens, methidathion was identified and quantitated. The methidathion concentrations were 2.0 $\mu$l/ml in blood, 24.4 $\mu\textrm{g}$/g in liver, 13.9 $\mu\textrm{g}$/g in lung, 21.8 $\mu\textrm{g}$/g in kidney, respectively.

The Application of Electropolishing for Removing Burrs and Residual Stress of Stamping Leadframe (스탬핑 리드프레임의 버와 잔류응력 제거를 위한 전해연마의 적용)

  • 신영의;김헌희;김경섭;코조후지모토;김종민
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.3
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    • pp.19-24
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    • 2001
  • The lead frame, which is principal material used in semiconductor packaging, is required to be microscopic in leads and pitches to cope with miniaturization, thin film, large scale integrated. In addition, it is indispensable to eliminate residual stress and burrs occurring at manufacturing lead frames This thesis applied electrolytic abrasion in order to remove burrs and residual stress created during the stamp process. Electrolytic abrasion removed the burrs on the surface of lead frame. Removal of residual stress highly depends on the types of electrolyte solution. In case of perchloric system, electrolytic abrasion removed 23% of residual stress. Through removal of burrs and reducing residual stress, the reliability of lead frame was substantially improved.

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Polyelectrolyte Micropatterning Using Agarose Plane Stamp and a Substrate Having Microscale Features on Its Surface

  • Lee, Min-Jung;Lee, Nae-Yoon;Lee, Sang-Kil;Park, Sung-Su;Kim, Youn-Sang
    • Bulletin of the Korean Chemical Society
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    • v.26 no.10
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    • pp.1539-1542
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    • 2005
  • We have introduced polyelectrolyte micro-patterning technique employing agarose plane stamp and a hard substrate having microscale features on its surface. With this method, chemically micropatterned surfaces with both positive and negative functionalities were successfully embedded in well-defined microstructures, and selective impartment of charge functionalities was confirmed by patterning bead bearing surface charge. Furthermore, this technique allows highly sensitive immobilization of protein onto targeted surface simply by endowing functionalities, which extends the potential of its use as a tool for high-throughput protein microarray and proteomics. Because plane agarose stamp is free of structures on its surface, there is no concern for pattern collapse, and the combination of agarose plane stamp with patterned substrate is more suited for selective protein patterning compared with adopting surface-patterned agarose stamp with flat substrate. Our technique using agarose plane stamp and a substrate having microscale features on its surface suggests a range of possible applications, including the micropatterning of biofunctionalized copolymer having polyelectrolyte block, immobilization of micro- and nanoparticle with biofunctionalities such as biotin and streptavidine, and establishing optoelectronic microstructures with micro-beads on various surfaces.

A Study on Construction and Quality in accordance with the Field Application of Hwangto Concrete (황토콘크리트의 현장적용에 따른 시공 및 품질 특성에 관한 연구)

  • Hwang, Hey Zoo;Moon, Je Chun;Kang, Nam Yi
    • KIEAE Journal
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    • v.9 no.1
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    • pp.91-97
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    • 2009
  • In this thesis presents the application to the field of Hwangto-used concrete highlighted as an eco-friendly material and performs an experiment in the aspect of construction and quality on the construction for all parts of buildings, rather than for some parts of buildings as shown from existing application and got the conclusion as followings. 1) It was turned out that Hwangto concrete showed lower hydrated heat and arid contraction comparing to those of cement concrete. And this phenomenon is judged to appear high when applied to mass building and huge span structures. 2) The construction of Hwangto concrete is judged to be possible in applying to constructions since the mechanical construction seems to be possible by using pump car and ready-mixed concrete which are used at the practical sites at the moment. 3) The pockmarks appearing on the exposure surface were about 2% of total area. This has great cohesion by Hwangto concrete but is judged that it will be improved through enough vibration stamping. Through the experiments of quality and construction of Hwangto concrete as environment-friendly construction materials, it is possible to judge modernized application of Hwangto concrete. It is in need of more studies about economical efficiency, structural stability, design application, etc. afterwards.