• Title/Summary/Keyword: Squeegee

Search Result 13, Processing Time 0.022 seconds

The Effect of Squeezing Parameters on the Fabrication Behavior of Phosphor Films (스퀴징 공정변수에 따른 형광체막 성형 거동에 관한 연구)

  • Park, J.Y.;Lee, J.W.;Yoon, G.S.
    • Transactions of Materials Processing
    • /
    • v.24 no.2
    • /
    • pp.95-100
    • /
    • 2015
  • It was confirmed that when phosphor slurry is formed in the cavity of an elastic mold, the pressure distribution of the phosphor slurry varies as a function of the major squeegee parameters (squeegee angle, squeegee velocity, and the viscosity of the phosphor slurry). The higher the slurry viscosity, the faster the squeegee velocity, and the smaller the squeegee angle, the higher the filling completeness of the phosphor slurry. The optimum conditions for complete filling of the phosphor slurry were found when the squeegee angle was between 30 to 45 degrees, squeegee velocity at 40 to 70mm/sec, and the viscosity of the phosphor slurry composite was at 6,556 cps (i.e. phosphor content around 50 wt. %).

A Method of Squeegee pressure Optimization for Mass Production Thick Film Heaters Using SPC and Neural Network

  • Luckchonlatee, Chayut;Chaisawat, Ake
    • Proceedings of the IEEK Conference
    • /
    • 2002.07a
    • /
    • pp.22-25
    • /
    • 2002
  • The Mass production of ceramic heater has encountered with the estimation for the proper parameters of the printing conditions. This paper presents a method to estimate the squeegee pressure. It uses resistance distribution from the trial run with approximate squeegee pressure which comes from statistical process control (SPC). Then, the resistance distribution and its total resistance are input to the backpropagation neural networks that can recognize resistance's distribution patterns. The value of output network derived from the input value can identify to the appropriate squeegee pressure. The experimental results are demonstrated In ensure the efficiency and the reliability of this method with the accuracy 96.75 percent. Indeed, embedded on this method will aid us to reduce the loss from the normal mass production.

  • PDF

Improvement of Filling Characteristics of Micro-Bumps in the Stencil Printing Process (스텐실 프린팅 공정에서 미세범프의 성형성 향상을 위한 연구)

  • Seo, W.S.;Min, B.W.;Park, K.;Lee, H.J.;Kim, J.B.
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.21 no.1
    • /
    • pp.26-32
    • /
    • 2012
  • In the present study, the stencil printing process using solder paste are numerically analyzed. The key design parameters in the stencil printing process are the printing conditions, stencil design, and solder paste properties. Among these parameters, the effects of printing conditions including the squeegee angle and squeegee pressure are investigated through finite element (FE) analysis. However, the FE analysis for the stencil printing process requires tremendous computational loads and time because this process carries micro-filling through thousands of micro-apertures in stencil. To overcome this difficulty in simulation, the present study proposes a two-step approach to sequentially perform the global domain analysis and the local domain analysis. That is, the pressure development under the squeegee are firstly calculated in the full analysis domain through the global analysis. The filling stage of the solder paste into a micro-aperture is then analyzed in the local analysis domain based on the results of the preceding global analysis.

Effects of Process Conditions on Electrode Patterning by Screen Printing Method (스크린 인쇄법의 공정 조건이 전극 패턴 균일성에 미치는 영향)

  • Lee, Na-Young;Kim, Dong-Chul;Yeo, Dong-Hun;Lee, Joo-Sung;Yoon, Sang Ok;Shin, Hyo-Soon;Lee, Joon-Hyung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.33 no.5
    • /
    • pp.355-359
    • /
    • 2020
  • In this study, image analysis and surface roughness measurements using an optical microscope are presented as a method to quantitatively evaluate the results of screen printing. Using this method, the squeegee speed, which is the printing process condition, and the printability of the electrode according to the screen mesh were evaluated. Increasing the squeegee speed in the printing process acts as a process element that increases the line width precision of the printed electrode and lowers the surface roughness of the printed surface. Furthermore, the edge roughness, which indicates the clarity of printing, was not significantly affected by the speed of the squeegee during printing. The print thickness increases in proportion to the squeegee speed, but is largely dependent on the screen thickness.

Evaluation of Solder Printing Efficiency with the Variation of Stencil Aperture Size (스텐실 개구홀 크기 변화에 따른 솔더프린팅 인쇄효율 평가)

  • Kwon, Sang-Hyun;Kim, Jeong-Han;Lee, Chang-Woo;Yoo, Se-Hoon
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.18 no.4
    • /
    • pp.71-77
    • /
    • 2011
  • Main parameters of the screen printing were determined and the printing parameters were optimized for 0402, 0603, and 1005 chips in this study. The solder pastes used in this study were Sn-3.0Ag-0.5Cu and Sn-0.7Cu. The process parameters were stencil thickness, squeegee angle, printing speed, stencil separating speed and gap between stencil and PCB. The printing pressure was fixed at 2 $kgf/cm^2$. From ANOVA results, the stencil thickness and the squeegee angle were determined to be main parameters for the printing efficiency. The printing efficiency was optimized with varying two main parameters, the stencil thickness and the squeegee angle. The printing efficiency increased as the squeegee angle was lowered under 45o for all chips. For the 0402 and the 0603 chips, the printing efficiency increased as the stencil thickness decreased. On the other hand, for the 1005 chip, the printing efficiency increased as the stencil thickness increased.

The Arrangement Process Optimization of Vacuum Glazing Pillar using the Design of Experiments (실험계획법을 이용한 진공유리 Pillar의 배치공정 최적화)

  • Kim, Jae Kyung;Jeon, Euy Seik
    • Journal of the Semiconductor & Display Technology
    • /
    • v.11 no.1
    • /
    • pp.73-78
    • /
    • 2012
  • In this study, the optimal process condition was induced about the pillar arrangement process of applying the screen printing method in the manufacture process of vacuum glazing panel. The high precision screen printing is technology which pushes out the paste and spreads it by using the squeegee on the stainless steel plate in which the pattern is formed. The screen printing method is much used in the flat panel display field including the LCD, PDP, FED, organic EL, and etc for forming the high precision micro-pattern. Also a number of studies of screen printing method have been conducted as the method for the cost down through the improvement of productivity. The screen printing method has many parameters. So we used Taguchi method in order to decrease test frequencies and optimize this parameters efficiently. In this study, experiments of pillar arrangement were performed by using Taguchi experimental design. We analyzed experimental results and obtained optimal conditions which are 4 m/s of squeegee speed, $40^{\circ}$ of squeegee angle and distance between metal mask and glass.

Analysis of the Effect of Screen Printing Variables on Thick Film Thickness (스크린인쇄조건에 따른 후막인쇄물의 잉크층 두께에 관한 분석)

  • Lim, Kyu-Jin;Yi, Arm;Shin, Jong-Soon
    • Journal of the Korean Graphic Arts Communication Society
    • /
    • v.20 no.2
    • /
    • pp.19-30
    • /
    • 2002
  • Four screen mesh counts of 100, 150, 200, and 305 threads per inch are chosen and a designed test figure is exposed on them for printing experiment to measure the ink deposit thickness. Among a number of variables, the ink viscosity, the screen gap and the squeegee pressure and speed are estimated with their effected thickness. These variables affect as much as around 50% compared with the theoretical ink volume listed by the mesh manufacturer and each variable has different influence on the thickness. The data and graphs have been analyzed for the thick film production.

  • PDF

Development of Stereolithography system using X-Y robot (X-Y 로봇을 이용한 광조형시스템 개발)

  • 김준안
    • Journal of the Korean Society of Manufacturing Technology Engineers
    • /
    • v.5 no.4
    • /
    • pp.18-25
    • /
    • 1996
  • In this study, we have developed the stereolithography system that supports the development of a products. This paper presents the development of the stereolithography system. The system is composed of hardware, software and control part. The software converts a STL file to NC data and displays the monitoring figure in control part. The hardware part deals with structure of machine. The most important theme in this paper is LG-SLCAM software. This software can generate NC data and scanning condition data from a STL file semiautimatically. On the basis of three diensional shapes, it makes data for support structure from STL file. The effectiveness of using out stereolithography system is confirmed by processes of good development.

  • PDF

A Study of Pressure Control system using Loadcell (로드셀을 이용한 압력 제어 시스템의 연구)

  • Jung, Ho-Seung;Huh, Young-Jung;Cho, Dong-Hee
    • Proceedings of the KAIS Fall Conference
    • /
    • 2007.11a
    • /
    • pp.140-143
    • /
    • 2007
  • 본 연구의 목적은 반도체 후공정 제조 시스템인 Screen Printer시스템에서의 프린팅 공정시 프린팅에 사용되는 Mesh Mask, Urethane Blade의 재질이 사용되는 반복횟수의 증가에 따라 재질의 변화에 의한 문제점과 프린팅 공정 파라미터인 Table 접촉거리, Squeegee 하강위치의 주변환경에 의한 변화를 보상하여 일정하게 프린팅이 될 수 있는 시스템을 구현 하는데 목적이 있으며, 이 논문은 서보모터를 구동하는 위치제어 시스템에 로드셀(Loadcell)을 이용하는 압력제어시스템을 연구하고 구현하고자 하였다.

  • PDF

The Analysis on the Effect of Improving Aspect Ratio and Electrode Spacing of the Crystalline Silicon Solar Cell (결정질 실리콘 태양전지의 전극 종횡비 개선과 전극 간 간격이 효율에 미치는 영향 분석)

  • Kim, Min Young;Park, Ju-Eok;Cho, Hae Sung;Kim, Dae Sung;Byeo, Seong Kyun;Lim, Donggun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
    • /
    • v.27 no.4
    • /
    • pp.209-216
    • /
    • 2014
  • The screen printed technique is one of the electrode forming technologies for crystalline silicon solar cell. It has the advantage that can raise the production efficiency due to simple process. The electrode technology is the core process because the electrode feature is given a substantial factor (for solar cell efficiency). In this paper, we tried to change conditions such as squeegee angle $55{\sim}75^{\circ}$, snap off 0.5~1.75 mm, printing pressure 0.6~0.3 MPa and 1.6~2.0 mm finger spacing. As a result, the screen printing process showed an improved performance with an increased height higher finger height. Optimization of fabrication process has achieved 17.48% efficiency at screen mesh of 1.6 mm finger spacing.