• Journal of Welding and Joining
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• v.16 no.5
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• pp.100-107
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• 1998

This paper describes fluxless soldering of reflow soldering process using solder foil instead of solder pastes. There is an increasing demand for the reliable solder connection in the recent high density microelectronic components technologies. And also, it is problem fracture of an Ozone layer due to freon as which is used to removal of remained flux on the substrate. This paper discussed joining phenomena, boudability and joining processes of microelectronics devices, such as between outer lead of VLSI package and copper pad on a substrate without flux. The shear strength of joints is 8 to 13 N using Sn/Pb (63/37 wt.%) solder foil with optimum joining conditions, meanwhile, in case of using Sn/In (52/48 wt.%) solder foil, it is possible to bond with low heating temperature of 550 K, and accomplish to high bonding strength of 25N in condition heating temperature of 650K. Finally, this paper experimentally shows fluxless soldering using solder foil, and accomplishes key technology of microsoldering processes.

• Journal of Welding and Joining
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• v.21 no.5
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• pp.534-539
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• 2003

An efficient soldering process using the longitudinal ultrasonic vibration is introduced in this work for electronic packaging. The effects of the process parameters such as the ultrasonic frequency, amplitude, dimension of the metal bump and solder are analyzed through a viscoelastic lumped model. The viscoelastic properties of the eutectic solder were measured for calculation and evaluation of heat generation capability of the solder. Experiments were conducted to verify the possibility of the proposed ultrasonic soldering method by inserting the Cu and Au bumps into the solder block. Localized heating due to ultrasonic vibration melts the solder near the metal bump, which demonstrates the applicability of the ultrasonic soldering method to the high-density electronic packaging.

• Journal of Welding and Joining
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• v.21 no.6
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• pp.46-54
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• 2003

The thermal response of electronic assemblies during forced convection-infrared reflow soldering is studied. Soldering for attaching electronic components to printed circuit boards is performed in a process oven that is equipped with porous panel heaters, through which air is injected in order to dampen temperature fluctuations in the oven which can be established by thermal buoyancy forces. Forced convection-infrared reflow soldering process with air injection is simulated using a 2-dimensional numerical model. The multimode heat transfer within the reflow oven as well as within the electronic assembly is simulated. Parametric study is also performed to study the effects of various conditions such as conveyor speed, blowing velocity, and electronic assembly emissivity on the thermal response of electronic assemblies. The results of this study can be used in the process oven design and selecting the oven operating conditions to ensure proper solder melting and solidification.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.661-662
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• 2006

This research is on a laser soldering using the micro solder-balls used in flip chip packaging process. A laser source used in laser soldering is Nd:YAG laser(250W and 60W). Solder-balls of 100, 300, $500{\mu}m$ size are used in experiments. The laser head to deliver a laser beam and the nozzle to transfer solder-balls are manufactured to bump solder-balls. After soldering solder-balls the shear test is carried out to determine the wetting at the interface between the surface and a solder-balls With the results of solder bumping tests a laminated molding is accomplished for manufacturing the three dimensional molding.

• The Journal of Korean Academy of Prosthodontics
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• v.50 no.1
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• pp.53-60
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• 2012

Purpose: The purpose of this study was to compare Ni-Cr alloy property of gas-oxygen torch soldering and infrared welding using optical microscope and Electron Probe Micro Analyzer (EPMA). Materials and methods: Ni-Cr alloys were casted for specimens. Specimens had 3.0 mm diameter, 30.0 mm length and were divided into two groups. Each group had 4 specimens. One group was for gas-oxygen torch soldering and the other was infrared welding. Specimens were cut with low-speed disc and soldered each other with gas-oxygen torch and infrared machine. After soldering and polishing, specimens were observed at 3 points (soldering point, 5 mm distance point, 10 mm distance point) with optical microscope and analyzed 3 points (soldering point, 5 mm distance point, 10 mm distance point with EPMA. Results: The results of this study were as follows: 1. The observation of gas-oxygen torch soldering at 10 mm distance point under the optical microscope was not founded any specific surface properties, but some crack lines were observed at 5 mm distance and soldering point. 2. There were no crack lines were founded at the observation of infrared welding at 10 mm distance and 5 mm distance points under the optical microscope. However, at the 5 mm distance, the surface was not smooth enough compared with at 10 mm distance point. Some crack lines were observed at the welding point as well. 3. In the EPMA analysis of the gas-oxygen torch soldering, the component of Ni was increased by 4.5%, Cr was increased by 7.5% than that of the Ni-Cr alloy at the 10.0 mm distance. At the 5 mm distance, the component of Ni was decreased by 6.1%, Mo was increased by 9.0% than that of the Ni-Cr alloy but Cr was equally shown at the 5.0 mm distance. Only Ni was shown at the soldering point. 4. In the EPMA analysis of the infrared welding, the component of Ni was increased by 9.1%, Cr was increased by 0.4% than that of the Ni-Cr alloy but Al was equal at the 10.0 mm distance. At the 5 mm distance, the component of Ni was increased by 4.7%, Cr was increased by 4.7% and Al was increased by 0.1% than that of the Ni-Cr alloy. At the welding point, the component of Ni was increased by 8.8%, Cr was increased by 8.2% than that of the Ni-Cr alloy. Conclusion: From these results, at the 5 mm distance from the soldering point, the surface of the infrared welding was more smoother than that of the gas-oxygen torch soldering. On the EPMA analysis, the component of the specimens with infrared welding was more similar than that of the gas-oxygen torch soldering compared with the component of the Ni-Cr alloy.

• Proceedings of the KWS Conference
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• 1997.05a
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• pp.165-168
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• 1997

• Proceedings of the KWS Conference
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• 1997.05a
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• pp.157-158
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• 1997

• Proceedings of the KWS Conference
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• 2000.10a
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• pp.284-286
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• 2000

• Journal of Korea Foundry Society
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• v.30 no.2
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• pp.76-82
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• 2010

Effect of reaction time and sludge formation on the thickness of die soldering reaction layer has been studied in Al-9Si-0.3Mg casting alloy. Ternary ${\alpha}_{bcc}-Al_8Fe_2Si$ and ${\alpha}_{hcp}-Al_8Fe_2Si$ intermetallic compounds formed at the interface of SKD61 tool steel by interaction diffusion of Al, Fe and Si atoms after 0.5hr and 6hr immersion time, respectively. Binary ${\eta}-Fe_2Al_5$ additionally formed at the interface of SKD61 tool steel after 10hr immersion time. Thickness of soldering reaction layer in die surface increased as immersion time increased from 0.5hr to 24hr. Sludge formation was ascertained in the samples which were immersed in the melts more than 10hr. Reaction of die soldering after sludge formation was more accelerated than that of before sludge formation due to a decrease in Fe content, followed by higher diffusion rate of Al in the melt by sludge formation.

• Journal of Technologic Dentistry
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• v.21 no.1
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• pp.55-65
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• 1999

So far, I Conducted an examination with focus on the type, characteristic, and test methods of impact test. which is a type of mechanical that evaluate materials. As mentioned previously, in testing soldering strength of soldering is the load when the object under experiment is broken down with the result of flexibility test or peel test. In this method, a hevay load is necessary until alloy of parent metal is bended, if the alloy of the parent metal has a large mechanical quality(peel strength or resisting power). Once the alloy of the parent metal is bended, however, it tends to come into pieces abruply form the part where soldered. Therefore, a metal has a high breakdown value if the degree of strength of its parent metal is high even if the result of measurement indicates otherwise. Thus, the result of the test did not correspond to the clinical result. Therefore, this study concludes as the following from a test of strength of soldering by mean of conducting an impact test, which is a type of mechanical evaluation methods : 1. Among various impact tests, a charpy thpe is more appropriate than the izod type in testing strength of soldering. 2. As far as test piece is concerned, to use subsized impact test piece is appropriate in the impact test in that it does not have notch. 3. In the matter of analysis, it is appropriate to measure absorbing energy which results from rupture of test piece.