• Conservation Science in Museum
• /
• v.27
• /
• pp.147-164
• /
• 2022

Over 200,000 Korean cultural heritage items are currently located abroad. They have made their way to 22 countries under different circumstances and with unique backgrounds. While some of them continue to contribute to promoting Korean culture around the world, others cannot be exhibited due to damage or poor condition. In view of these circumstances, the Overseas Korean Cultural Heritage Foundation (OKCHF) has since 2013 provided museums and art galleries abroad with support for the conservation, restoration, and utilization of the Korean cultural heritage items that they house. As a part of these efforts and on the occasion of the 120th anniversary of the diplomatic relationship between the Republic of Korea and the Kingdom of Belgium in 2021, a gilt-bronze case for acupuncture needles dating to the Goryeo period (918-1392) from the collection of the Royal Museums of Art and History (RMAH), Belgium was brought to Korea for conservation treatment. The primary purpose of this conservation treatment was to restore the original form of the relic and slow to the degree possible the progress of corrosion. The conservation treatment of the gilt-bronze case followed the fundamental order of conservation treatment: removal of corrosive substances, stabilization, and reinforcement. Since this was the first case of restoring metallic cultural properties under the abovementioned support program by the OKCHF, special methodologies distinct from those available in overseas institutions were required. Diverse scientific methods (e.g., X-ray inspection, CT scanning, 3D microscopy) were applied to identify the metalcraft techniques used in the Goryeo period. The analysis found that several designs, including lotus and scrollwork, were exquisitely engraved on the surface of the case by making dots using a round-edged chisel. A bronze plate engraved with designs was rolled into a cylindrical form. The ends were overlapped by 2 to 3 centimeters and then attached to each other by silver soldering. The overlapping ends were welded flat with nearly no gaps. As the final process in the production, the case was lavishly gilt with gold powder using amalgam gilding. The conservation treatment of the gilt-bronze case for acupunctural needles in the RMAH collection restored the original form of the relic and arrested further corrosion. Above all, it revived the historic and academic value of the overseas Korean cultural heritage through scientific analysis.

• The Journal of Korean Academy of Prosthodontics
• /
• v.52 no.4
• /
• pp.331-337
• /
• 2014

In conventional bar- and clip-retained overdentures, all errors during impression making and cast fabrication result in non-passive fit of bars. SFI bar is prefabricated and assembled in the patient's mouth without the use of soldering, laser welding or conventional bonding techniques, thus reducing stress transmission to, bone loss around the implants and leading to fewer errors and lower costs. A clinical case will be presented below to demonstrate the use of the SFI Bar (Stress Free on Implant Bar) to restore an severe atrophy edentulous maxilla. In this case, no lateral stress could be applied to the implants due to the telescopic design of the bar joints. However, periodic recall check is necessary and long-term clinical results are required.

• Journal of Digital Convergence
• /
• v.14 no.5
• /
• pp.317-323
• /
• 2016

This paper suggests a system that can detect malfunctions of the temperature testing equipment, and then notify this information to surroundings using arduino. Precision electronics need a test under extremely high/low temperature using temperature called a chamber. If this chamber have a malfunction situation, the precision electronics under test is damaged and scrapped. Especially when the temperature test is automatically conducted at night with no representative, this system monitors the actual temperature of the tested product in real-time by attaching a temperature sensor to the inside of the test equipment. In case when it is out of the temperature range set up by the tester, the damage to high-priced products can be prevented in the condition of extremely high/low temperature, by turning off the power of the temperature testing equipment, and also notifying this information to the worker at night-time. Regardless of the equipment manufacturers, proposed system in this paper can be applied to all kind of temperature testing equipments, and it can be also produced for low cost.

• Journal of the Microelectronics and Packaging Society
• /
• v.25 no.2
• /
• pp.25-30
• /
• 2018

Sn-Pb solder has been used in automotive electronics for decades. However, recently, due to the environmental and health concerns, some international environmental organizations such as the end-of-life vehicle (ELV) enacted legislation banning of the Pb usage in automotive electronics. For this reason, many studies to develop and promote Pb-free soldering have been significantly reported. Meanwhile, because of flexibility and lightweight, flexible printed circuit boards (FPCBs) have been increasingly used in automotive electronics for lightweight to improve fuel efficiency and space utilization. Although the properties of lead-free solders for automotive electronics have been widely studied, there is a lack of research on the reliability performance of the lead-free solder joint on FPCB under user conditions. This study reported the properties of solder joints between Pb-free solders such as Sn3.0Ag0.5Cu, Sn0.7Cu and Sn0.5Cu0.01Al (Si), and various FPCBs finished with organic solderability preservative (OSP) and electroless nickel immersion gold (ENIG). To evaluate on joint properties and reliabilities with different solder compositions and surface-finishing materials, pull strength test, thermal shock test, and bending cycle test were performed and analyzed. After the bending cycle test of solder joint on OSP-finishing, the fractures were occurred in solder and the lifetime of Sn3.0Ag0.5Cu solder joint was the longest.

• Journal of the Microelectronics and Packaging Society
• /
• v.7 no.4
• /
• pp.7-15
• /
• 2000

The purpose of this work is to evaluate the solderahility and characteristics of solder joints. Bridge defect of solder joint was examined in natural atmosphere and $N_2$ condition. Consequently, wettability was excellent for each of Sn-Pb plated Cu specimen, Sn plated Cu specimen, and Cu polished in $N_2$ condition. The wetting time in $N_2$ condition was shorter than that of natural atmosphere condition, showing the decreasing values of about 0.2~0.45 seconds. The max. wetting force under the $N_2$ condition was more increasing that of natural atmosphere condition, showing the increasing values of about 1.8~2.8 N. With the result of wetting balance test, the wetting time ($t_2$) and wetting farce according to increasing amount of $N_2$ from 10 1/min to 30 1/min, the wetting time ($t_2$) was reduced about 0.25 second and wetting force was increased about 2.3 N. In non-cleaning flux, when $N_2$ gas is applied, it is compensated to decrease of wettability. In the case of using the $N_2$ gas, the wettability was improved. The reason for improving wettability is due to preventing the formation of dross. The generation rate of bridge in $N_2$ condition decreased than that of natural atmosphere, and when the specimen had a fine pitch, the rate of bridge defects was considerably decreased in $N_2$ condition, showing the decreasing rate of 25~75%.

• Explosives and Blasting
• /
• v.22 no.1
• /
• pp.33-43
• /
• 2004

In this study, a comparison was made between the resulting behaviors of scaled model test and particle flow analysis for blasting demolition of a reinforced concrete structure. For the test and analysis, a progressive failure of a five-story structure was considered. The dimension analysis was carried out to properly scale down the real structure into the laboratory size. The test model was made of the mixture of gypsum, sand and water along with soldering lead to analogy reinforcing steel bars. The ratio of mixing components was chosen to best represent the scaled down strength and deformation modulus. The columns and girders of the structure were precasted in the laboratory and assembled right before the blasting test. The numerical analysis of the blasting demolition was carried out using PFC2D (Particle Flow Analysis 2-Dimension by Itasca). The results of the blasting of concrete lahmen structure showed roughly identical demolition behavior between scaled model test and numerical test. For the blasting of the reinforced concrete structure, the results were more identical and closer to the real demolition behavior, since the demolition behavior was better represented in this case due to the increased tensile strength of the component.

• Journal of Korean Society of Occupational and Environmental Hygiene
• /
• v.16 no.4
• /
• pp.398-412
• /
• 2006

The purpose of this study is to investigate the relationship between the acceleration of vibration by the powered hand tools used in the shipbuilding industry, and to develop the prospective prevalence model for the hand-arm vibration syndrome among the shipbuilding workers.The acceleration levels and frequencies of six types of grinder were measured using the ISO5349 method along with the time of exposure to the vibration from the powered hand tools. Medical examination for 114 workers were performed using the cold provocation test. Comparisons were made between the estimated prevalence of hand-arm vibration syndrome from ISO5349 and the observed values from the medical examinations. By multiple regression, we developed the prospective prevalence model of hand-arm vibration syndrome produced by the hand tools used in the shipbuilding industry. 4 hour-energy-equivalent frequency-weighted accelerations were $6.23m/s^2$ in the grinding job done after welding, and $13.39m/s^2$ in the grinding job done before painting. The mean exposure time while holding powered hand tools was 4.64 hours. Prevalence rates of Raynaud's Phenomenon were 12.04% in the grinding after soldering, and 42.9% in the grinding before painting measured using the ISO5349 method. After exposure to vibration for 10.79 years, about a half of the workers in the grinding after welding could developed Raynaud's Phenomenon. For the workers in the grinding before painting, the latency was 5.02 years. The ISO equation for dose response relationship was not significantly correlated with observed recovery rates of finger skin temperatures, blood flows and amplitudes of nerve conduction velocities. A multiple regression model for dose-response relationship was proposed from the results. Recovery rate of the skin temperatures = -0.668+ 0.337 ${\times}$ 4 hour energy equivalent frequency-weighted accelerations + 0.767 ${\times}$ duration of vibration exposure(years) The validity was proved by multiple regression analysis after correlation transformation and regression results based on model-building data and validation data.

• Journal of the Institute of Electronics Engineers of Korea SC
• /
• v.38 no.5
• /
• pp.33-41
• /
• 2001

The digital iron using ${\mu}$ processor is designed and compared experimentally with the conventional analog Iron. Designed digital iron shows two improved temperature control characteristics. First, the reduction of the difference error between the user setting temperature and the real temperature of the iron tip is examined. When the iron temperature is set to $200[^{\circ}C]$, $300[^{\circ}C]$, $400[^{\circ}C]$, $480[^{\circ}C]$ at the environmental temperatures of $-5[^{\circ}C]$ and $25[^{\circ}C]$, it is examined that the tip temperature is very stable and its error is within ${\pm}1.8[^{\circ}C]$. Second, it is conformed that the temperature fluctuation of the iron due to the soldering is reduced manifestly. When the temperature of iron tip is varied from $200[^{\circ}C]$ to $480[^{\circ}C]$ with 1[g] solder, the temperature errors of the analog iron are measured to be from $6[^{\circ}C]$ to $10[^{\circ}C]$. In case of designed digital iron, however, these errors are much smaller and they are from $2[^{\circ}C]$ to $5[^{\circ}C]$.

• Journal of the Microelectronics and Packaging Society
• /
• v.18 no.2
• /
• pp.49-55
• /
• 2011

The failure of electronic instruments is mostly caused by heat and shock. This shock causes the crack initiation at the solder joint interface of PCB component which is closely related with the formation of intermetallic compound(IMC). The Ag content in Pb-free Sn-xAg-0.5Cu solder alloy used in this study was 1.0, 1.2 and 3.0 wt.%, respectively. After soldering with PCB component, isothermal aging was performed to 1000 hrs. The growth of IMC layer was observed during isothermal aging. The drop impact property of solder joint was evaluated by impact bending test method. The solder joint made with the solder containing lower Ag content showed better impact bending property compared with that with higher Ag content. On the contrary to this result, the solder joint made with solder containing higher Ag content showed better impact bending property after aging. It should be caused by the formation of fine $Ag_3Sn$, which relieved the impact. It showed consequently the different effect of fine $Ag_3Sn$ and coarse $Cu_6Sn_5$ particles formed in the IMC layer on the impact bending property.

• Korean Chemical Engineering Research
• /
• v.46 no.2
• /
• pp.402-407
• /
• 2008

Recent popularity in mobile electronics requires higher standard on the mechanical strength of electronic packaging. Thus, the method of soldering between chip and substrate in electronic packaging process is changing from conventional method using intermetallic compound to a new method using organic solderability preservative (OSP) in order to improve the stability and the reliability of final product. Since current organic solder preservatives have several serious problems like thermo-stability during packaging process, however, it is necessary to develop new OSPs having thermo-stability. The main purpose of this study is to investigate the effect of MeOH/IPA (Isopropyl alcohol) ratio on the fluxing of a new OSP, developed in previous research, andto find out an optimum formulation of flux components for the application of the OSP in current packaging process. As a result of this study, it was revealed that higher MeOH/IPA ratio in flux showed better performance of fluxing a new OSP.