• Journal of Welding and Joining
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• v.20 no.2
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• pp.90-94
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• 2002

FC-BGA has advantages over other interconnection methods including high I/O counts, better electrical performance, high throughput, and low profile. But, FC-BGA has a lot of reliability issues. The 2nd level solder joint reliability of the FC-BGA with large chip on laminate substrate was studied in this paper. The purpose of this study is to discuss solder joint failures of 2nd level thermal cycling test. This work has been done to understand the influence of the structure of package, the properties of underfill, the properties and thickness of bismaleimide tiazine substrate and the temperature range of thermal cycling on 2nd level solder joint reliability. The increase of bismaleimide tiazine substrate thickness applied to low modulus underfill was improve of solder joint reliability. The resistance of solder ball fatigue was increased solder ball size in the solder joints of FC-BGA.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.35-41
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• 2001

In this paper, several methods to predict the solder joint shape are studied. Although there are various methods to predict the solder joint shape, such as truncated sphere method. force-balanced analytical solution, and energy-based methods like surface evolver developed by Ken Brakke, we calculate solder joint shape of $\mu$BGA by two solder joint shape prediction methods(truncated sphere method and surfaceevolver) and then compare results of each method. The results indicate that two methods can accurately predict the solder Joint shape in an accurate range. After that, we calculate reliability solder joint shape under thermal cycle test by FEA program ANSYS(version 5.62). As a result, it could be found that optimal solder joint shape calculated by solder joint prediction method has best reliability in thermal cycle test.

• Proceedings of the KWS Conference
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• 1995.10a
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• pp.145-148
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• 1995

To provide better understanding of a solder joint design criteria, mathematical models have been developed to calculate the shape of the solder fillets formed between the pad and lead. The effects of parameters such as solder volume and pad dimensions are described with this model. In this study, a systematic way to determine the design criteria of the SMT from the predicted 3D solder joint profile is proposed. The solder joint profile is calculated using the available 3D FEM code which minimizes the system energy due to the surface tension and gravity. The solder joint profiles of gullwing-type lead such as QFP and SOP are calculated for design parameters, and acceptable ranges are obtained. The result shows that the pad length is the most significant factor compared with the pad width and pad area.

• Proceedings of the Korean Reliability Society Conference
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• 2004.07a
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• pp.221-226
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• 2004

The thermal stresses induced by difference in Coefficient of Thermal Expansion between FR-4 board and 63Sn-37Pb solder joint directly affect the reliability of 63Sn-37Pb solder joint. This research, thus, focuses to investigate the crack initiation and propagation behavior around solder joint by imposing a designed Acceleration Life Test Procedure on solder joint by using a newly manufactured Thermal Impact Experimental Apparatus. The fracture mechanism of the solder joint was found to be highly influenced by thermal stresses. The reliability of solder joint was evaluated by using a failure probability model in terms of varying parameters such as frequency and temperature. The relationship between failure probability and safety factor was also studied.

• Journal of Welding and Joining
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• v.17 no.6
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• pp.78-83
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• 1999

Solder joint is the weakest part which connects in mechanically and electronically between package body and PCB(Printed Circuit Board). Recently, the reliability of solder joint become the most critical issue in surface mounted technology. The solder joint interconnection between plastic package and PCB is susceptible to shear stress during thermal storage due to the mismatch in coefficient of thermal expansion between plastic package and PCB. A general computational approach to determine the effect of solder joint shape on the fatigue life presented. The thermal fatigue life was estimated from the engelmaier equation which was obtained from the temperature cycling loading($-65^{\circ}C$ to $150^{\circ}C$). As result of the simulation, TSOP structure has the shortest thermal fatigue life and the same structure Copper lead has 2.5 times as much fatigue life as Alloy 42 lead. In BGA structure, fatigue life time extended 80 times when underfill material exists.

• Proceedings of the KWS Conference
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• 1995.10a
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• pp.110-112
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• 1995

Initial solder joint strengths of various solder pastes, such as Sn-Pb(63-37wt%), Sn-In(52-48wt%), Sn-In-Ag(77.5-20-2.5wt%), and Sn-Ag(96.5-3.5wt%) has been studied. A system that can control the solder joint interface temperature during bonding process was also desined and implemented to improve solder joint integrity.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.31A no.12
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• pp.44-55
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• 1994

This study is to apply the theory of fatigue fracture to solder joints under thermal cyclic loading and predict life of solder joint to failure. A 62Sn-36Pb-2Ag solder was used in this study. Tensile tests were preformed at temperatures of 15.dec. C, 50.dec. C and 85.dec. C in order to find terms of crack length "a". plastic strain range ""${\Delta}{\varepsilon}_p$" and temperature "T". Solder joint under thermal cyclic loading was analyzed by FEM. this FEM analysis together with the crack growth rate will provide the capability of the fatigue life prediction of solder joints and enhance the reliability od solder joint.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2007.04a
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• pp.67-79
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• 2007

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.47-52
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• 2001

Pb-free wave soldering process of AC Adapter was implemented by six sigma method using Sn-Cu-Ni type solder. The solder joint appearance, microstructural change, a lift-off phenomenon and reliability were evaluated through thermal shuck test. $(Cu,Ni)_6/Sn_5$-type intermetallic compound of which thickness is about 5 $\mu\textrm{m}$ was found at solder joint between Sn-Cu-Ni solder and copper land. After applying the thermal shock test of as-soldered product up to 750 cycles, no crack was fecund at the solder joint. The newly developed product was superior to conventional one in terms of productivity and reliability.

• Journal of Welding and Joining
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• v.31 no.3
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• pp.4-10
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• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.