Proceedings of the International Microelectronics And Packaging Society Conference (한국마이크로전자및패키징학회:학술대회논문집)
- 2007.04a
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- Pages.67-79
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- 2007
Solder Joint Reliability With Variations Of Solder Ball Land Design
Solder Ball Land Type에 따른 SJR (Solder Joint Reliability)
- Jeong, Yeong-Hui (Package R&D Center product Development Division Hynix Semiconductor Co.)
- 정영희 (하이닉스)
- Published : 2007.04.04
Abstract
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