• Proceedings of the KWS Conference
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• 2005.11a
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• pp.219-221
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• 2005

Sn-9Zn solder balls were bonded to Cu, ENIG (Electroless Nickel/Immersion Gold) and electrolytic Au/Ni pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Au/Ni/Cu substrate, an $AuZn_{3}$ IMC layer formed at the interface due to the fast reaction between Au and Zn. In addition, the $AuZn_{3}$ IMC layer became detached from the interface after reflow. When the aging time was extended to 100 h, $Ni_{5}Zn_{21}$ IMC was observed on the Ni substrate.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.05a
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• pp.442-446
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• 1999

Melting behavior and bridge phenomenon of solder paste, which is essential for surface mount technology in packaging, were investigated. solder paste of Sn-37%Pb was printed on Sn-coated Cu-pattern of PCB, and heated over melting point. Melting behavior of the paste was observed using CCD-camera. In order to modelize the melting and agglomeration phenomena of the paste, two solder balls of 0.76mm diameter were used. As experimental results, the paste start to melt from the margin of the printed shape. The hight of the melted paste decreased from 270 $\mu$m to 200 $\mu$m firstly, and finally recovered to 250 $\mu$m. During the melting procedure, pores were evolved from the molten paste. Bridge Phenomenon of the molten Paste depends upon the pitch of the pattern.

• Journal of Institute of Control, Robotics and Systems
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• v.19 no.11
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• pp.960-967
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• 2013

Shape recognition of solder ball bumps in a BGA (Ball Grid Array) is an important issue in flip chip bonding technology. In particular, the semiconductor industry has required faster and more accurate inspection of micron-size solder bumps in flip chip bonding as the density of balls has increased dramatically. The difficulty of this issue comes from specular reflection on the metal ball. Shape recognition of a metal ball is a very realproblem for computer vision systems. Specular reflection of the metal ball appears, disappears, or changes its image abruptly due to tiny movementson behalf of the viewer. This paper presents a practical shape recognition method for three dimensional (3-D) inspection of a BGA using a 5-step ring illumination device. When the ring light illuminates the balls, distinctive specularity images of the balls, which are referred to as "iso-slope contours" in this paper, are shown. By using a mathematical reflectance model, we can drive the 3-D shape information of the ball in aquantitative manner. The experimental results show the usefulness of the method for industrial application in terms of time and accuracy.

• Proceedings of the KWS Conference
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• 2006.05a
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• pp.36-38
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• 2006

We investigated that the metallurgical, mechanical and electrical properties of the Sn-3.SAg/Cu ball grid array (BGA) solder joints at a reflow temperature of $255^{\circ}C$ for different reflow times of 10, 60, 300 and 1800 s. Two different intermetallic compound (IMC) layers, consisting of scallop-shaped $Cu_6Sn_5$ and very thin $Cu_3Sn$, formed at the solder/substrate interface, and their thicknesses increased with increasing reflow time. The shear force peaked after reflow for 60 s, and then significantly decreased with increasing reflow time. The fracture occurred along the solder ball in the initial reflow, but the fraction of the brittle fracture increased with increasing reflow time. The IMC growth and the volume of Cu dissolved in the solder balls affected the electrical property.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.55-58
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• 2002

The possibility of SnCuX Solder as alternative for Pb-free Solder have been investigated in this study. SnCuX Solder balls(500${\mu}{\textrm}{m}$) were placed on Si-wafer which is Al/Ni/Cu(500nm/$4{\mu}{\textrm}{m}$/$4{\mu}{\textrm}{m}$)UBM layer. After reflow soldering at $250^{\circ}C$, shear strength and microstructure were analyzed. The results showed that the shear strength(500gf) of SnCuX was higher than that of SnCuX at $230^{\circ}C$ and $Cu_6Sn_5$ intermetallic compounds were formed between Cu and SnCuX Solder layers

• Journal of the Institute of Electronics Engineers of Korea SC
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• v.47 no.6
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• pp.80-85
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• 2010

BGA 409 chip currently the most as a visual inspection of the exterior inspection is conducted. Human depending on visual inspection of the exterior inspection of the current state of testers, depending on how the test results because the change is difficult to expect reliable results. Therefore, the challenges of visual inspection of BGA solder balls to improve the visual inspection technique was developed. However, BGA solder ball size of the microstructure and the characteristics of the distinction between hard test the accuracy of the fall orientation error has a problem. In this paper BGA solder balls exterior inspection of the accuracy to improve the edge detection algorithm, the complement of features and only the comparison proposed a pattern-matching techniques, based on the characteristics of spatial configuration of the area by improving the standard error of the orientation proposed improvements.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.6
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• pp.575-579
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• 2004

Package reliability test was conducted to investigate the effect of solder paste composition at BGA Package. It was found that the shape and size of the phase form are affected by the processing parameters. The material have used to fill in the via was Sn/36Pb/2Ag and Sn/0.75Cu type solder paste. Sn/36Pb/2Ag and Sn/0.75Cu paste were fabricated on Tape-BGA substrates by screen printing process, and via ball mount data were characterized with variations of dwell time of 85 seconds at reflow peak temperature at 22$0^{\circ}C$ or 24$0^{\circ}C$. The test condition was MRT 30 $^{\circ}C$/60 %RH/96 HR. Failures formed of a ball-off in solder paste process were observed by using a Optical Microscope and SEM(Scanning Electron Microscope). It was concluded that intermetallic layer growth played important roles in increasing solder fatigue strength for addition of Ag composition. The degradation of shear strength of solder composition is discussed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2009.10a
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• pp.207-208
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• 2009

• Proceedings of the KSME Conference
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• 2000.04a
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• pp.873-878
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• 2000

Semiconductor packaging technology is changed rapidly according to the trends of the micro miniaturization of multimedia and information equipment. For I/O limitation and fine pitch limitation, DIP and SOP/QFP are replaced by BGA/CSP. This is one of the surface mount technology(SMT). Solder ball is bumped n the die pad and connected onto mounting board. In ball bump formation, vacuum suction type ball alignment process is widely used, However this type has some problems such as ionization, static electricity and difficulty of fifo(first-input first-out) of solder balls. Seesaw type is reducing these problems and has a structural simplicity and economic efficiency. Ball cartridge velocity and ball aligned plate angle are Important variables to improve the ball alignment Process. In this paper, seesaw-type CSP solder ball loader is developed and the optimal velocity and plate angle are proposed.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.21-28
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• 2010

Creep behaviors of the solder balls in a flip chip package assembly during thermal cycling test is investigated.. A material models used in the finite element analysis are viscoplastic model introduced by Anand and creep model called partitioned model. Experiment of two temperature cycles using moir$\acute{e}$ interferometry is conducted to verify the reliability of material models for the analysis of thermo-mechanical behavior. Bending deformations of the assemblies and average strains of the solder balls due to temperature change and dwell time are investigated. The results show that time-dependent shear strain of solder by the partitioned model is in excellent agreement with those by moir$\acute{e}$ interferometry, while there is considerable difference between results by Anand model and experiment. In this paper, the partitioned model is employed for the time-dependent creep analysis of the FC-PBGA package. It is also shown that the thermo-mechanical stress becomes relaxed by creep behavior at high temperature during temperature cycles.