• Journal of the Korean Crystal Growth and Crystal Technology
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• v.7 no.4
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• pp.589-598
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• 1997

The effects of PT/PZ ratio variations in a modified PZT system on crystal structure and electrical properties were studied. $0.05Pb(Sn_{0.5}Sb_{0.5})O_3＋xPbTiO_3＋yPbZrO_3$＋0.4Wt% $MnO_2$(＝0.55PSS＋0.11PT＋0.84PZ＋0.4wt%$MnO_2$ ; x＋y=0.95) systems with variations of PT/PZ from 0.50/0.45 to 0.l1/0.84 were sintered at $1250^{\circ}C$ for 2 hr, and then sintering density, crystal structure, dielctric, piezoelectric, pyroelectic and voltage responsity to infrared were investigated. Sintering density was increased from 7.52g/$\textrm {cm}^3$ to 7.82g/$\textrm {cm}^3$ with increasing PZ content. Dielectric constants at 1 KHz were decreased from 1147 to 193 with variation of PT/PZ from 0.50/0.45 to 0.l1/0.84 after poling of $4 KV_{DC}$/mm at $140^{\circ}C$ for 20 minutes. All Dielectric losses at 1 KHz were less than 1 % in all specimens. $K_{p}$ was increased near to 1 of PT/PZ, and maximun value of 48.2 % was .at 0.45/0.50. Pyroelectric coefficient of PT/PZ with 0.l1/0.84 was maximun value, 0.0541 C/$\m^2$K, and voltage responsity to infrared was 1.5 V.

• Journal of the Microelectronics and Packaging Society
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• v.9 no.4
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• pp.1-9
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• 2002

The metallurgical reaction properties between the pad consisted of 0.5 $\mu\textrm{m}$Au/5 $\mu\textrm{m}$Ni/Cu layers on a conventional ball grid array (BGA) substrate and In-15 (wt.%)Pb-5Ag solder ball were characterized during the reflow process and solid aging. During the reflow process of 1 to 5 minutes, it was observed that thin $AuIn_2$ or Ni-In intermetallic layer was formed at the interface of solder/pad. The dissolution rate of the Au layer into the molten solder was about $2\times 10^{-3}$ $\mu\textrm{m}$/sec which is remarkably low in comparison with a eutectic Sn-37Pb solder. After solid aging treatment for 500 hrs at $130^{\circ}C$, the thickness of $Ni_{28}In_{72}$ intermetallic layer was increased to about 3 $\mu\textrm{m}$ in all the conditions nevertheless the initial reflow time was different. These result show that In atoms in the solder alloy were diffused through the $AuIn_2$ phase to react with underlaying Ni layer during solid aging treatment. From the microstructural observation and shear tests, the reaction properties between In-15Pb-5Ag alloy and Au/Ni surface finish were analyzed not to trigger Au-embrittlement in the solder joints unlike Sn-37Pb composition.

• Journal of the Korean Solar Energy Society
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• v.34 no.1
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• pp.98-104
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• 2014

Photovoltaic (PV) cell is considered as one of the finest ways to utilize the solar power. A study of improving solar cell's efficiency is important because the lifetime of solar cell is determined by photovoltaic module technology. Therefore, oxidation (and/or corrosion) of solder materials will be one of the primary yield and long-term reliability risk factor. Recently, the development of lead-free solder alloy has been done actively about lead-free solder alloys of the thermodynamic and mechanical properties. However, the oxidation behavior have rarely been investigated In this study, the oxidations of 60 wt% Sn-40 wt% Pb, 62 wt% Sn-36 wt% Pb -2 wt% Ag, 50wt% Sn-48 wt% Bi-2 wt% Ag alloys for the interconnect ribbon after exposure in atmosphere at $100^{\circ}C$ for several times were investigated. The wettability of 62 wt% Sn-36 wt% Pb-2 wt% Ag and 50 wt% Sn-48 wt% Bi-2 wt% Ag solders was also studied to compare with that of 60 wt% Sn-40 wt% Pb alloy. The results howed that the zero cross time and the wetting time of 50 wt% Sn-48 wt% Bi-2 wt% Ag solder were better than other two samples. The surface of tested samples was analyzed by XPS. The XPS result showed that in all samples, SnO grew first and then the mixture of SnO and $SnO_2$ was detected. $SnO_2$ grew predominantly for the long time aging. Moreover XPS depth profile analysis has found surface enrichment of tin oxide.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.3
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• pp.53-57
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• 2013

Although the lowering of Ag content in Sn-3.0Ag-0.5Cu is known to improve the mechanical shock reliability of the solder joint, it is also known to be detrimental to the solderbility. In this study, the quaternary alloying effect of In and the minor alloying effects of Mn and Pd on the solderability, thermal cycling and mechanical shock reliabilities of the low Ag content Sn-1.2Ag-0.7Cu solder were investigated using board-level BGA packages. The solderability of Sn-1.2Ag-0.7Cu-0.4In was proved to be comparable to that of Sn-3.0Ag-0.5Cu but its thermal cycling reliability was inferior to that of Sn-3.0Ag-0.5Cu. While the 0.03 wt% Pd addition to the Sn-1.2Ag-0.7Cu-0.4In decreased the solderability and reliabilities of solder joint, the 0.1 wt% Mn addition was proved to be beneficial especially for the mechanical shock reliability compared to those of Sn-3.0Ag-0.5Cu and Sn-1.0Ag-0.5Cu compositions. It was considered to be due that the Mn addition decreased the Young's modulus of low Ag content Pb-free solders.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.282-285
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• 2007

Smaller size and higher integration of electronic systems make narrower interconnect pitch not only in chip-level but also in package-level. Moreover electronic systems are required to operate in harsher conditions, that is, higher current / voltage, elevated temperature / humidity, and complex chemical contaminants. Under these severe circumstances, electronic components respond to applied voltages by electrochemically ionization of metals and conducting filament forms between anode and cathode across a nonmetallic medium. This phenomenon is called as the electrochemical migration. Many kinds of metal (Cu, Ag, SnPb, Sn etc) using in electronic packages are failed by ECM. Eutectic SnPb which is used in various electronic packaging structures, that is, printed circuit boards, plastic-encapsulated packages, organic display panels, and tape chip carriers, chip-on-films etc. And the material for soldering (eutectic SnPb) using in electronic package easily makes insulation failure by ECM. In real PCB system, not only metals but also many chemical species are included. And these chemical species act as resources of contamination. Model test systems were developed to characterize the migration phenomena without contamination effect. The serpentine-shape pattern was developed for analyzing relationship of applied voltage bias and failure lifetime by the temperature / humidity biased(THB) test.

• 보존과학연구
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• s.10
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• pp.1-40
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• 1989

Between 1976 and 1984 approximately 26.7 tons of Chinese coins were recovered from a shipwreck which was found at the seabed of the Shin an area in the south-western coast of the Korean peninsula. Elements, Cu, Pb, Sn, Fe, Sb, As, Zn, Ag, Ni, Co and Mn, of 54 pieces of the coins were determined by Inductively Coupled Plasma Atomic Emission Spectroscopy(ICP-AIS). The result shows that Ch, Pb, and Sn were found to be major elements roughly the coins with the ratio of 7 : 2 : 1, respectively. Trace elements were classified into 3 levels according to the avarage concentration : Fe,As and Sb(0.1-0.5%), Ag, Mi, Co and Zn(100-1000ppm) and Mn(10ppm). Some systematic tendencies are observed in the composition change with a function of their minting ages .The Wuzhu coins(오수전) from the Eastern Han dynasty(A.D.25-219 )are much more abundant in Cu than the coins of Tang dynasty(A.D.618-907) and later periods. Major element compositions of the Kai -tong Vuan-Bao(개통원보) coins from the Tang dynasty, were remarkably variable. In general, however, the Tang dynasty coins were much more abundant in Cu than the Song dynasty(A.S.S60-1279) coins. The amount of major elements Cu and Sn decreases while that of Pb in creasesby passage of age from the Bei Song dynasty(A.D.960-1127) to later Nam Song dynasty (A.D.1127-1279 ). It means that the quality of coins mere degraded. The amounts of trace elemends(Fe, As, Co, Hn) increases with the above age. High amounts of trace elements are supposed to be a reflection of immaturity of minting techniques or use of impurity-rich raw materials. The Jin dynasty(A.D.1125-1234) coins are found to be rich in Sn and thus contain Pb as the third component. It is quite different from the coins of the Song dynasty. The Zhi-dai Tong-Bao(지대통보) coins of the Yuan dynasty from A.0.1310 are much more abundant in Cu and Sn than those of the Nam Song dynasty .

• 한국신재생에너지학회:학술대회논문집
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• 2011.05a
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• pp.113.2-113.2
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• 2011

Sn-Ag계 합금은 대표적인 무연 솔더 조성으로 전자제품의 실장 및 접합에 적용되어 왔으며, 태양전지 분야에서도 모듈의 전극과 bus바로 사용되는 등 다양한 분야에서 사용되고 있다. 그러나 최근 Ag 가격의 급격한 상승과 솔더 접합부의 신뢰성을 보다 향상시키고자 Ag의 함량을 줄이고 다원계 합금 조성의 무연 솔더 연구가 활발히 진행되고 있다. 본 실험에서는 기존의 연구 결과를 바탕으로 Sn-1.0Ag-0.5Cu-0.4In 4원계 무연솔더 조성에 Bi를 첨가하여 최적의 융점과 용융구간을 가지는 5원계 Sn-Ag-Cu-In-Bi 계 솔더 합금을 설계하였다. 이 설계된 합금은 기존의 유연 솔더인 Sn-Pb와 대표적인 무연 솔더인 Sn-3.5Ag와 각각의 특성을 비교 분석하였다. 젖음성을 평가하기 위하여 wetting balance tester를 이용하여 실험을 행하였고 Differential Scanning Calorimetry(DSC)를 분석하여 젖음 정도와 조성 분석 및 고상점과 액상점 등의 녹음 거동을 확인하였다. 또한 각각의 조성별 전단응력에 따른 파괴 거동을 분석하였다.

• Journal of Welding and Joining
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• v.30 no.6
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• pp.1-5
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• 2012

• Journal of Welding and Joining
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• v.20 no.5
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• pp.72-77
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• 2002

Flip-chip interconnection that uses solder bump is an essential technology to improve the performance of microelectronics which require higher working speed, higher density, and smaller size. In this paper, the shear strength of Cr/Cr-Cu/Cu UBM structure of the high-melting solder b01p and that of low-melting solder bump after aging is evaluated. Observe intermetallic compound and bump joint condition at the interface between solder and UBM by SEM and TEM. And analyze the shear load concentrated to bump applying finite element analysis. As a result of experiment, the maximum shear strength of Sn-97wt%Pb which was treated 900 hrs aging has been decreased as 25% and Sn-37wt%Pb sample has been decreased as 20%. By the aging process, the growth of $Cu_6Sn_5$ and $Cu_3Sn$ is ascertained. And the tendency of crack path movement that is interior of a solder to intermetallic compound interface is found.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.65-70
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• 2008

The mechanical shear strength of BGA(Ball Grid Array) solder joints under high impact loading was investigated. The Sn-37Pb solder balls with a diameter of $500{\mu}m$ were placed on the pads of FR-4 substrates with ENIG(Electroless Nickel Immersion Gold) surface treatment and reflowed. For the High Temperature Storage(HTS) test, the samples were aged a constant testing temperature of $120^{\circ}C$ for up to 250h. After the HTS test, high speed shear tests with various shear speed of 0.01, 0.1, 1, 3 m/s were conducted. $Ni_3Sn_4$ intermetallic compound(IMC) layer was observed at the solder/Ni-P interface and thickness of IMC was increased with aging process. The shear strength increased with increasing shear speed. The fracture surfaces of solder joints showed various fracture modes dependent on shear speed and aging time. Fracture mode was changed from ductile fracture to brittle fracture with increasing shear speed.