• Journal of the Korean institute of surface engineering
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• v.50 no.3
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• pp.155-163
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• 2017

In this study, the effects of the concentration of metal ions and the applied current density in the Sn-Ag plating solutions were examined in regards to the resulting composition and morphology of the solder bumps' surface. Furthermore the effect of any impurities present in the methanesulfonic acid used as a base acid in the Sn-Ag solder plating solution on the stability of plating solution as well as the characteristics of the Sn-Ag alloys films was also explored. As expected, the uniform bump was obtained by means of removing impurities in the plating solution. Consequently the resultant solder bump was obtained in an optimal current density of the range of $1A/dm^2$ to $15A/dm^2$, which has acceptable bump shape and surface roughness with 12inch wafer trial results.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.28 no.3
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• pp.130-134
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• 2018

In the past few years, various solder compositions have been a representative material to electronic packages and surface mount technology industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the low Ag composition have been reported because of recent rapid rise in Ag price. In this study, Sn-3.0Ag-0.5Cu, Sn-0.7Cu and Sn-0.3Ag-0.5Cu solder bar samples were fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, XRF, optical microscope, FE-SEM and EDS. The fabricated solder samples were composed of ${\beta}-Sn$, ${\varepsilon}-Ag_3Sn$ and ${\eta}-Cu_6Sn_5$ phases.

• Journal of the Microelectronics and Packaging Society
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• v.8 no.4
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• pp.25-33
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• 2001

Sn-3.5Ag-xBi alloys with five different levels of Bi (0, 2.5, 4.8, 7.5, 10 wt%) were prepared for evaluating creep properties. Cast alloys were roiled and heat treated to provide stable microstructures during the subsequent creep tests, which were conducted under constant load using dog-bone specimens. For the Bi containing alloys, creep strength showed the maximum around 2.5 wt%Bi and tended to decrease with increasing Bi content. The stress exponent of the alloy was around 4, suggesting typical dislocation creep, but the exponent was 2 for the 10 wt%Bi alloy, suggesting creep assisted by grain boundary Sliding. For the Bi containing alloys, the brittle fracture mode appeared showing small amount of reduction of area, while the ductile fracture mode was true for the Bi free alloy. Microstructural examination of ruptured specimens showed cavitations on grain boundaries normal to the load axis, and a significant of grain boundary sliding for the Bi containing alloys.

• Korean Journal of Dental Materials
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• v.44 no.3
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• pp.197-206
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• 2017

The hardening effect by ice-quenching after oxidation of a Pd-Ag-Sn-Au metal-ceramic alloy during porcelain firing simulation was investigated by means of hardness test, field emission scanning electron microscopic observations, and X-ray diffraction analysis. The hardness decreased by ice-quenching after oxidation, which was induced by the homogenization of the ice-quenched specimen. The decreased hardness by ice-quenching after oxidation was recovered from the wash stage which was the first stage of the remaining firing process for bonding porcelain. After wash stage, the hardness of the ice-quenched specimens decreased during the subsequent porcelain firing process. But the final hardness of the ice-quenched specimens after oxidation was higher than that of the specimens cooled at stage 0 after oxidation. The increase in hardness of the specimens during the first firing process was caused by the lattice strains generated at the interface between the face-centered cubic Pd-Ag-rich matrix and the face-centered tetragonal Pd3(Sn, Ga, In) precipitate. The decrease in hardness of the specimens during the remaining firing process was caused by the microstructural coarsening.

• Proceedings of the KWS Conference
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• 2003.11a
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• pp.83-85
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• 2003

This paper is investigated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which would be surely applicable to the electronic packages. As a result, in case of Max. shear strength, Sn-4Ag-0.5Cu has the highest value and Sn-37Pb has the lowest value on every condition of experiment temperature. Also, In case of Pb-free solder joint specimens, it was found that Pb-free solder alloys have higher value of shear strength than eutectic Sn-Pb solder alloy and Sn-4Ag-0.5Cu has the highest value.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.27 no.2
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• pp.94-98
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• 2017

In the past few years, Sn-3.0Ag-0.5Cu (weight%) solder composition has been a representative material to electronic industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the composition have been reported. However, recent rapid rise in Ag price has demanded solder compositions of low Ag content. In this study, Sn-3.0Ag-0.5Cu solder bar sample was fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, optical microscope, FE-SEM and EDS. The Sn-3.0Ag-0.5Cu solder sample was composed of ${\beta}$-Sn, ${\varepsilon}-Ag_3Sn$ and ${\eta}-Cu_6Sn_5$ phases.

• Korean Journal of Dental Materials
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• v.43 no.4
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• pp.343-349
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• 2016

This experiment was carried out to examine whether the post-firing heat treatment is effective in increasing the hardness of metal-ceramic alloy of the Pd-Au-Ag-Sn system. Precipitation hardening by holding at $600^{\circ}C$ after simulated complete porcelain firing in a metal-ceramic alloy of the Pd-Au-Ag-Sn system was examined by observing the change in hardness, crystal structure, and microstructure using a hardness test, X-ray diffraction (XRD), and field emission scanning electron microscopy (FE-SEM). The hardness of the alloy increased apparently by holding the specimen at $600^{\circ}C$ for 30 min after simulated complete porcelain firing. The formation of fine grain interior precipitates during holding at $600^{\circ}C$ caused the formation of lattice strain in the grain interior, resulting in apparent hardening. The faster cooling rate (stage 0) during simulated complete porcelain firing resulted in more effective precipitation hardening during holding at $600^{\circ}C$. From the above results, an appropriate post-firing heat treatment, such as holding at $600^{\circ}C$ for 30 min after complete porcelain firing may increase the durability of metal-ceramic prostheses composed of Pd-Au-Ag-Sn alloy.

• ETRI Journal
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• v.41 no.6
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• pp.820-828
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• 2019

A highly reliable conductive adhesive obtained by transient liquid-phase sintering (TLPS) technologies is studied for use in high-power device packaging. TLPS involves the low-temperature reaction of a low-melting metal or alloy with a high-melting metal or alloy to form a reacted metal matrix. For a TLPS material (consisting of Ag-coated Cu, a Sn96.5-Ag3.0-Cu0.5 solder, and a volatile fluxing resin) used herein, the melting temperature of the metal matrix exceeds the bonding temperature. After bonding of the TLPS material, a unique melting peak of TLPS is observed at 356 ℃, consistent with the transient behavior of Ag₃Sn + Cu₆Sn₅ → liquid + Cu₃Sn reported by the National Institute of Standards and Technology. The TLPS material shows superior thermal conductivity as compared with other commercially available Ag pastes under the same specimen preparation conditions. In conclusion, the TLPS material can be a promising candidate for a highly reliable conductive adhesive in power device packaging because remelting of the SAC305 solder, which is widely used in conventional power modules, is not observed.

• Korean Journal of Materials Research
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• v.9 no.10
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• pp.1018-1024
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• 1999

The effects of operating temperature and stress on degradation of components in high temperature steam generator were investigated. Several 2.25CrlMo tubes which had operated over 20 years and an unused 9CrlMoVNb tube were tested. For the former samples, the amount of $\textrm{M}_{6}\textrm{C}$ carbide and its size are increased with the aging or operating time. The precipitation behavior of carbides ($\textrm{M}_{2}\textrm{O}$, $\textrm{M}_{6}\textrm{C}$) is changed with the operating temperature of the tubes. However, unused 9CrlMoVNb samples show a different carbide precipitation process due to high chromium, vanadium, and niobium contents. The amount of Cr-rich $\textrm{M}_{23}\textrm{C}_{6}$ carbide is significantly increased with aging time, but that of $\textrm{M}_{6}\textrm{C}$ type carbide is rarely changed with aging time at elevated temperatures.

• Journal of the Korean institute of surface engineering
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• v.40 no.5
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• pp.225-233
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• 2007

Effects of alloying elements on the corrosion layer formation of Pb-grid/active materials interface has been researched for improvement of corrosion resistance of Pb-Ca alloy. For this research, various amounts of alloying elements such as Sn, Ag and Ba were added to the Pb-Ca alloys and investigated their corrosion behaviors. Batteries fabricated by using these alloys as cathode grids were subjected to life cycle test. Overcharge life cycle test was carried out at $75^{\circ}C$, 4.5 A, for 110 hrs. with KS standard (KSC 8504). And then, after keeping the battery with open circuit state for 48 hr, discharge was carried out at 300A for 30 sec. Corrosion morphology and interface between Pb-grid and active materials were investigated by using ICP, SEM, WDX, and LPM. Corrosion layer of Pb-Ca alloy got thicken with increasing Ca content. For Pb-Ca-Sn alloy, thickness of corrosion layer decreased as Sn and Ag content increased gradually. In case of Pb-Ca-Sn-Ba alloy, thickness of corrosion layer decreased up to 0.02 wt% Ba addition, whereas, it was not changed in case of above 0.02 wt% Ba addition.