Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)

The Korean Welding and Joining Society (대한용접접합학회)
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A Study on Mechanical Properties for Pb-free Solders of Electronic Packages

전자부품의 Pb-free 솔더에 대한 기계적 특성에 관한 연구

  • 허우진 (전북대학교 대학원 정밀기계공학과) ;
  • 백승세 (전북대학교 대학원 정밀기계공학과) ;
  • 정영훈 (전북대학교 대학원 정밀기계공학과) ;
  • 권일현 (전북대학교 기계항공시스템공학부) ;
  • 양성모 (전북대학교 기계항공시스템공학부) ;
  • 유효선 (전북대학교 기계항공시스템공학부)
  • Published : 2003.11.01
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Abstract

This paper is investigated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which would be surely applicable to the electronic packages. As a result, in case of Max. shear strength, Sn-4Ag-0.5Cu has the highest value and Sn-37Pb has the lowest value on every condition of experiment temperature. Also, In case of Pb-free solder joint specimens, it was found that Pb-free solder alloys have higher value of shear strength than eutectic Sn-Pb solder alloy and Sn-4Ag-0.5Cu has the highest value.

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