Proceedings of the KWS Conference (대한용접접합학회:학술대회논문집)
- 2003.11a
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- Pages.83-85
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- 2003
A Study on Mechanical Properties for Pb-free Solders of Electronic Packages
전자부품의 Pb-free 솔더에 대한 기계적 특성에 관한 연구
Abstract
This paper is investigated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which would be surely applicable to the electronic packages. As a result, in case of Max. shear strength, Sn-4Ag-0.5Cu has the highest value and Sn-37Pb has the lowest value on every condition of experiment temperature. Also, In case of Pb-free solder joint specimens, it was found that Pb-free solder alloys have higher value of shear strength than eutectic Sn-Pb solder alloy and Sn-4Ag-0.5Cu has the highest value.
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