Browse > Article
http://dx.doi.org/10.6111/JKCGCT.2017.27.2.094

Microstructure of Sn-Ag-Cu Pb-free solder  

Lee, Jung-Il (Department of Materials Science and Engineering, Korea National University of Transportation)
Lee, Ho Jun (Department of Materials Science and Engineering, Korea National University of Transportation)
Yoon, Yo Han (Department of Materials Science and Engineering, Korea National University of Transportation)
Lee, Ju Yeon (Department of Materials Science and Engineering, Korea National University of Transportation)
Cho, Hyun Su (Department of Materials Science and Engineering, Korea National University of Transportation)
Cho, Hyun (Department of Nanomechatronics Engineering, Pusan National University)
Ryu, Jeong Ho (Department of Materials Science and Engineering, Korea National University of Transportation)
Publication Information
Journal of the Korean Crystal Growth and Crystal Technology / v.27, no.2, 2017 , pp. 94-98 More about this Journal
Abstract
In the past few years, Sn-3.0Ag-0.5Cu (weight%) solder composition has been a representative material to electronic industries as a replacement of Pb-base solder alloy. Therefore, extensive studies on process and/or reliability related with the composition have been reported. However, recent rapid rise in Ag price has demanded solder compositions of low Ag content. In this study, Sn-3.0Ag-0.5Cu solder bar sample was fabricated by melting of Sn, Ag and Cu metal powders. Crystal structure and element concentration were analyzed by XRD, optical microscope, FE-SEM and EDS. The Sn-3.0Ag-0.5Cu solder sample was composed of ${\beta}$-Sn, ${\varepsilon}-Ag_3Sn$ and ${\eta}-Cu_6Sn_5$ phases.
Keywords
Pb-free solder; Sn-3.0Ag-0.5Cu; ${\beta}$-Sn; ${\varepsilon}-Ag_3Sn$; ${\eta}-Cu_6Sn_5$;
Citations & Related Records
연도 인용수 순위
  • Reference
1 D.R. Frear, "Issues related to the implementation of Pbfree electronic solders in consumer electronics", J. Mater. Sci.-Mater. Electron. 18 (2007) 319.
2 O. Unal, D.J. Barnard and I.E. Anderson, "A shear test method to measure shear strength of metallic materials and solder joints using small specimens", Scr. Mater. 40 (1999) 271.   DOI
3 C.M. Miller, E.A. Iver and J.F. Smith, "A viable tin-lead solder substitute: Sn-Ag-Cu", J. Electron. Mater. 23 (1994) 595.   DOI
4 A.K. Larsson, L. Stenberg and S. Lidin, "The superstructure of domain-twinned ${\eta}", Acta Crystallogra. Sect. B-Struct. Sci. 50 (1994) 636.   DOI
5 J.M. Song, C.F. Huang and H.Y. Chuang, "Crystalliza-tion, morphology and distribution of $Ag_3Sn$ in Sn-Ag- Cu alloys and their influence on the vibration fracture properties", Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process. 466 (2007) 9.   DOI
6 L.R. Garcia, W.R. Osorio and A. Garcia, "The effect of cooling rate on the dendritic spacing and morphology of $Ag_3Sn$ intermetallic particles of SnAg solder alloys", Mater. Des. 32 (2011) 3008.   DOI
7 D. Swenson, "The effects of suppressed beta tin nucleation on the microstructural evolution of lead-free solder joints", J. Mater. Sci.-Mater. Electron. 18 (2007) 39.   DOI
8 I.E. Anderson, J.K. Walleser, J.L. Harringa, F Laabs and A. Kracher, "Nucleation control and thermal aging resistance of near-eutectic Sn-Ag-Cu-X solder joints by alloy design", J. Electron. Mater. 38 (2009) 2770.   DOI
9 C.-M. Chuang and K.-L. Lin, "Effect of microelement addition on the interfacial reaction between Sn-Ag-Cu and the Cu substrate", J. Electron. Mater. 32 (2003) 1426.   DOI
10 C. Andersson, Z. Lai, J. Liu, H. Jiang and Y. Yu, "Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders", Mater. Sci. Eng. A-Struct. Mater. Prop. Microstruct. Process. 394 (2005) 20.   DOI
11 K. Suganuma, S.H. Huh, K.S. Kim, H. Nakase and Y. Nakamura, "Effect of Ag content on properties of Sn-Ag binary alloy solder", Mater. Trans. JIM 42 (2001) 286.   DOI
12 K.S. Kim, S.H. Huh and K. Suganuma, "Effects of Intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints", J. Alloy. Compd. 352 (2003) 226.   DOI
13 C.W. Hwang and K. Suganuma, "Interface microstructures between Ni-P alloy plating and Sn-Ag-(Cu) leadfree solders", J. Mater. Res. 18 (2003) 2540.   DOI
14 C.W. Hwang, K. Suganuma, M. Kiso and S. Hashimoto, "Influence of Cu addition to interface microstructure between Sn-Ag solder and Au/Ni-6P plating", J. Electron. Mater. 33 (2004) 1200.   DOI
15 S.W. Kim, J.W. Yoon and S.B. Jung, "Interfacial reactions and shear strengths between Sn-Ag-based Pb-free solder balls and Au/EN/Cu metallization", J. Electron. Mater. 33 (2004) 1182.   DOI
16 J.W. Yoon, W.C. Moon and S.B. Jung, "Interfacial reaction of ENIG/Sn-Ag-Cu/ENIG sandwich solder joint during isothermal aging", Microelectron. Eng. 83 (2006) 2329.   DOI
17 T.C. Chiu and K.L. Lin, "Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination", J. Mater. Res. 23 (2008) 264.   DOI