• The monthly packaging world
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• s.290
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• pp.94-97
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• 2017

ICT기술이 전 산업으로 퍼져가며 모든 산업이 변화하고 있다. 4차 산업혁명 바람이 불고 있는 것이다. 농업 역시 예외일 수는 없다. 특히나 일손 부족으로 허덕이는 농가에 ICT기술은 반가운 소식이다. 정부에서도 두 손 걷어붙이고 나서고 있다. KT, SK텔레콤 등과 시범사업에 착수한 것이다. 센서와 네트워크 기반의 스마트 농업생산 시스템 '스마트 팜(smart farm)'은 이제 미래가 아닌 현실이 되고 있다. 이러한 흐름에 맞춰 농산물 포장 역시 변화하고 있다. LG가 세운 농축산 창업 특성화대학 연암대학교에서 스마트 팜을 위한 포장디자인 프로젝트를 진행 중인 김곡미 교수를 만나 스마트 팜은 무엇이고, 스마트 팜을 위한 포장디자인의 필요성, 차별화 전략 등에 대한 이야기를 들어보았다.

• International Journal of Internet, Broadcasting and Communication
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• v.13 no.1
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• pp.194-200
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• 2021

This study proposes a plan to construct an integrated platform that reduces manufacturing costs and efficiently produce by integrating the systems of main producers, production subcontractors, and raw material subcontractors for the production of food packaging containers. The production plan of food packaging containers and raw materials is established in real time between the main producers, production subcontractors, and raw material subcontractors in consideration of the demand characteristics of each product. It establishes basic information that all processes from the production planning stage to the forwarding stage of the product are linked to each other. The progress of each producer of interlinked processes is shared in real-time to improve productivity and quality of food packaging containers and raw materials and reduce manufacturing costs. By monitoring the system of the main producer and the production subcontractor in real time, the production of food packaging containers is performed in a timely manner, thereby improving productivity. The application of the plan-do-check-action (PDCA) process, which includes planning, execution, evaluation and improvement in the production operation processes of the main producer, production subcontractor and raw material subcontractor, enables improved production compliance rate. The contents of the main producers, production subcontractors, and raw material subcontractors are managed in real time, then a converged production management system is established through the platform proposed in this study to ensure timely supply and demand of raw materials without delay in ordering.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.29-34
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• 2022

A fabrication process of smart windows with controllable visible light transmittance by using retardation films is proposed. The 𝛌/4-phase retardation films that can convert a linearly polarized light into circularly polarized light are achieved through photo-alignment layers and reactive mesogen (RM) coating process. Two sheets of the fabricated retardation films with different orientation angles induced to light transmission mode (45°/-45°) and light blocking mode (45°/45°) for visible wavelength. We evaluated retardation characteristics according to the thickness of the birefringent RM material and found out the optimal condition for the film with 𝚫n·d of 𝛌/4-phase. The proposed structure of the smart window exhibited the light blocking ratio improved by more than 20% in the visible wavelength (380 nm to 780 nm). Finally, it was confirmed that the feasibility of the window structure by applying to a prototype for a smart window with a size of 150 × 150 mm².

• Journal of Institute of Control, Robotics and Systems
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• v.12 no.1
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• pp.23-27
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• 2006

As a pervasive healthcare application to help medication of elderly patients, the smart compliance monitors have been recently proposed. In this paper, we present a new smart drug/medicine pack (SDP) for ubiquitous medication monitoring, for which the packaging is either paper packet or blister pack. This ubiquitous compliance monitor is composed of several SDPs and a Bluetooth equipped PDA phone. The SDP is a wireless module that monitors the medication consumption unobtrusively by transmitting the sensed data of 'drug removal' events to the medical center and by reminding patients when they take a dose on their mobile phone. The communication between SDP modules and PDA is realized via Bluetooth. The PDA is basically embedded to indicate the medication record and to alert every prescribed medication time during treatment. Experimental results show that the proposed system works exactly when the SDPs are far within about 2 [m] from PDA.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.28 no.3
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• pp.223-229
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• 2022

This study was conducted to investigate the effect of packaging methods and sterilization treatment on storability and microbial control in paprika fruits. When treated with chlorine dioxide gas for 3, 6, and 12 hours and cold plasma gas for 1, 3, and 6 hours, and then packed in a carton box and stored in a 8 ± 1℃ chamber for 7 days, chlorine dioxide treated 12 hours and plasma treated 6 hours was prevented the development of E·coli and YM(yeast and mold). Accordingly, the control was treated with chlorine dioxide for 12 hours and plasma for 6 hours, packed using a carton box and 40,000 cc·m^-2·day^-1·atm^-1 OTR film (MAP), and stored in a 8 ± 1℃ chamber for 20 days. Fresh weight loss rate during storage was less than 1% in the MAP treatments, and the visual quality of the MAP treatments was above the marketability limit until the end of storage. There was no difference in the contents of oxygen, carbon dioxide, and ethylene in the film. In the case of firmness, the chlorine dioxide treatments was low, and the Hunter a^* value, which showed chromaticity, was highest in the Plasma 6h MAP treatment. Off-odor was investigated in the MAP treatments, but it was very low. The rate of mold growth on the fruit stalk of paprika was the fastest and highest in the chlorine dioxide treated box packaging treatments, and the lowest in the chlorine dioxide treated MAP treatments at the end of storage. The aerobic count in the pulp on the storage end date was the lowest in the plasma treated box packaging treatments, the lowest number of E·coli in the chlorine dioxide treated MAP treatments, and the lowest yeast & mold in the chlorine dioxide treated box packaging treatments. As a result, for the inhibition of microorganisms during paprika storage, it is considered appropriate to treat plasma for 6 hours before storage regardless of the packaging method.

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.71-76
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• 2012

A chip interconnection technology for smart fabrics was investigated by using flip-chip bonding of SnBi low-temperature solder. A fabric substrate with a Cu leadframe could be successfully fabricated with transferring a Cu leadframe from a carrier film to a fabric by hot-pressing at $130^{\circ}C$. A chip specimen with SnBi solder bumps was formed by screen printing of SnBi solder paste and was connected to the Cu leadframe of the fabric substrate by flip-chip bonding at $180^{\circ}C$ for 60 sec. The average contact resistance of the SnBi flip-chip joint of the smart fabric was measured as $9m{\Omega}$.

• Smart Media Journal
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• v.11 no.9
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• pp.21-29
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• 2022

Ultra Violet(UV) is gradually being replaced with LED instead of general UV lamps. However, the light efficiency of UV LED is still lower than that of the general lamp, and the light efficiency is also low. Due to the current environment and technical problems of UV lamps, the LED replacements are gradually being made. In this study, a new package design and analysis were performed to increase the lifetime and performance of UV LEDs. A new packaging for UV LED were designed and implemented. The new packaging for UV LED was constructed to improve light efficiency. And the electrical and optical characteristics were analyzed respectively. To improve the optical efficiency in UV LED package, the Al has been used based on high reflectivity and applying the optimal lens focusing. Compared to the existing silver Ag, the light efficiency was improved by about 30% or more, and it was confirmed that the light output degradation characteristic was improved by about 10% in the newly applied optical device chip.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.21-29
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• 2021

Recently, semiconductor chips and electronic components are increasingly being used in IT devices such as wearable watches, autonomous vehicles, and smart phones. As a result, there is a growing concern about device malfunctions that may occur due to electromagnetic interference being entangled with each other. In particular, electromagnetic wave emissions from wearable or flexible smart devices have detrimental effects on human health. Therefore, flexible and transparent electromagnetic interference (EMI) shielding materials and films with high optical transmittance and outstanding shielding effectiveness have been gaining more attention. The EMI shielding films for flexible and transparent electronic devices must exhibit high shielding effectiveness, high optical transmittance, high flexibility, ultrathin and excellent durability. Meanwhile, in order to prepare this EMI shielding films, many materials have been developed, and results regarding excellent EMI shielding performance of a new materials such as carbon nano tube (CNT), graphene, Ag nano wire and MXene have recently been reported. Thus, in this paper, we review the latest research results to EMI shielding films for flexible and transparent device using the new materials.

• Journal of Korea Multimedia Society
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• v.25 no.8
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• pp.1085-1096
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• 2022

The manufacturing industry is continuously pursuing advanced technology and smartization as it converges with innovative technology. Improvement of manufacturing productivity is achieved by monitoring, analyzing, and controlling the facilities and processes of the manufacturing site in real time through a network. In this paper, we proposed a new OPC-UA based digital twin model for smart factory facilities. A testbed system for USB flash drive packaging facility was implemented based on the proposed digital twin model and OPC-UA data communication scheme. Through OPC-UA based digital twin model, equipment and process status information is transmitted and received from PLC to monitoring and control 3D digital models and physical models in real time. The usefulness of the developed digital twin testbed system was evaluated through usability test.