• Smart Media Journal
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• v.11 no.9
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• pp.21-29
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• 2022

Ultra Violet(UV) is gradually being replaced with LED instead of general UV lamps. However, the light efficiency of UV LED is still lower than that of the general lamp, and the light efficiency is also low. Due to the current environment and technical problems of UV lamps, the LED replacements are gradually being made. In this study, a new package design and analysis were performed to increase the lifetime and performance of UV LEDs. A new packaging for UV LED were designed and implemented. The new packaging for UV LED was constructed to improve light efficiency. And the electrical and optical characteristics were analyzed respectively. To improve the optical efficiency in UV LED package, the Al has been used based on high reflectivity and applying the optimal lens focusing. Compared to the existing silver Ag, the light efficiency was improved by about 30% or more, and it was confirmed that the light output degradation characteristic was improved by about 10% in the newly applied optical device chip.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.1-5
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• 2015

Recently, data throughput of smart electric devices increases dramatically. There is a great interest in a new technology which exceeds the limit of electrical transmission method. Optical PCB can supplement the weakness of electrical signal processing, the research for optical PCB is very active. In this paper, we propose the thermal imprint lithography process to fabrication optical layer of optical PCB and experiment to optimize the process conditions. We confirm process time, pressure, process temperature, demolding temperature and fabricate optical interconnection structure which has $45^{\circ}$ tilted mirror surface for confirm the interconnection efficiency.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.1
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• pp.21-29
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• 2021

Recently, semiconductor chips and electronic components are increasingly being used in IT devices such as wearable watches, autonomous vehicles, and smart phones. As a result, there is a growing concern about device malfunctions that may occur due to electromagnetic interference being entangled with each other. In particular, electromagnetic wave emissions from wearable or flexible smart devices have detrimental effects on human health. Therefore, flexible and transparent electromagnetic interference (EMI) shielding materials and films with high optical transmittance and outstanding shielding effectiveness have been gaining more attention. The EMI shielding films for flexible and transparent electronic devices must exhibit high shielding effectiveness, high optical transmittance, high flexibility, ultrathin and excellent durability. Meanwhile, in order to prepare this EMI shielding films, many materials have been developed, and results regarding excellent EMI shielding performance of a new materials such as carbon nano tube (CNT), graphene, Ag nano wire and MXene have recently been reported. Thus, in this paper, we review the latest research results to EMI shielding films for flexible and transparent device using the new materials.

• Journal of Korea Multimedia Society
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• v.25 no.8
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• pp.1085-1096
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• 2022

The manufacturing industry is continuously pursuing advanced technology and smartization as it converges with innovative technology. Improvement of manufacturing productivity is achieved by monitoring, analyzing, and controlling the facilities and processes of the manufacturing site in real time through a network. In this paper, we proposed a new OPC-UA based digital twin model for smart factory facilities. A testbed system for USB flash drive packaging facility was implemented based on the proposed digital twin model and OPC-UA data communication scheme. Through OPC-UA based digital twin model, equipment and process status information is transmitted and received from PLC to monitoring and control 3D digital models and physical models in real time. The usefulness of the developed digital twin testbed system was evaluated through usability test.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.1
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• pp.51-56
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• 2017

In this paper, we have developed a differential pressure flow sensor designed as a single capacitive type. And the sensor was fabricated using a MEMS process. Differential pressure flow sensors are the most commonly used sensors for industrial applications. The sensing diaphragm and bonding joint of the MEMS pressure sensor are easily broken at high pressure. In this paper, we proposed a structure in which the diaphragm of the sensor was not broken at a pressure exceeding the proof pressure, and the differential pressure sensor was designed and manufactured accordingly. The operating characteristics of the sensor were evaluated at a pressure three times higher than the sensor operating pressure (0-3 bar). The developed sensor was $3.0{\times}3.0mm$ and measured with a LCR meter (HP 4284a) at a pressure between 0 and 3 bar. It showed 3.67 pF at 0 bar and 5.13 pF at 3 bar. The sensor operating pressure (0-3 bar) developed a pressure sensor with hysteresis of 0.37%.

• Smart Structures and Systems
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• v.6 no.3
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• pp.309-333
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• 2010

Civil infrastructure, in both its construction and maintenance, represents the largest societal investment in this country, outside of the health care industry. Despite being the lifeline of US commerce, civil infrastructure has scarcely benefited from the latest sensor technological advances. Our future should focus on harnessing these technologies to enhance the robustness, longevity and economic viability of this vast, societal investment, in light of inherent uncertainties and their exposure to service and even extreme loadings. One of the principal means of insuring the robustness and longevity of infrastructure is to strategically deploy smart sensors in them. Therefore, the objective is to develop novel, durable, smart sensors that are especially applicable to major infrastructure and the facilities to validate their reliability and long-term functionality. In some cases, this implies the development of new sensing elements themselves, while in other cases involves innovative packaging and use of existing sensor technologies. In either case, a parallel focus will be the integration and networking of these smart sensing elements for reliable data acquisition, transmission, and fusion, within a decision-making framework targeting efficient management and maintenance of infrastructure systems. In this paper, prudent and viable sensor and health monitoring technologies have been developed and used in several large structural systems. Discussion will also include several practical bridge health monitoring applications including their design, construction, and operation of the systems.

• Journal of the Korea Convergence Society
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• v.13 no.1
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• pp.149-160
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• 2022

In this study, the physical quality and microbial changes of ginseng sprout according to the pretreatment process and packaging container were evaluated to improve the storage properties of ginseng sprout produced in smart farm. Quality change during storage (10 days) according to pretreatment method (ascorbic acid, citric acid, peroxyacetic acid) and packaging container (expanded polystyrene (EP), polypropylene (PP), polyethylene (PE), polypropylene + polyethylene + cast polypropylene (PP+PE+CPP)) was evaluated in terms of texture, viable cell count, water content, and color. As a result of comparison according to the type of pretreatment, the citric acid treatment group showed the lowest texture change and the effect on inhibition of bacterial growth. On the other hand, citric acid, which was most effective among pretreatments, was treated in all samples and then stored in 4 types of containers. Specially, the ginseng sprout in PP packaging container was not observed significant softening or color changes after 10 days storage, and the lowest changes in viable cell number. Therefore, this study was shown that citric acid treatment and use of PP packaging container are effective in increasing the shelf life of ginseng sprout.

• International Journal of Internet, Broadcasting and Communication
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• v.12 no.4
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• pp.55-60
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• 2020

This study aims to apply Arduino and 3D printing technology considered as a key subject in the age of 4th industrial revolution which is a step 1 for customizing and applying the process of production by chemical molding companies producing environment-friendly biodegradable packaging materials to the 3D printing teaching in universities. Step 3 is applied to IoT for Arduino application, and 3D printing technology is also used on the basis of teaching creative integrated human resource. Integration of Arduino with 3D printers is based on the assumption that middle- and high-school students can learn it step by step to higher levels and university students majoring or not majoring in computing science can also have computing skills for solving 3D printing-based problems. For IoT application in this study, the 3D printing technology is applied to the external shape of products for producing an Arduino-based lighting fixture. The applied 3D printing technology is further extended to teaching modeling of producing packaging materials by chemical product molding companies in the age of 4th industrial revolution.

• Journal of Sensor Science and Technology
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• v.27 no.5
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• pp.300-305
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• 2018

The uncooled microbolometer thermal sensor for low cost and mass volume was designed to target the new infrared market that includes smart device, automotive, energy management, and so on. The microbolometer sensor features 80x60 pixels low-resolution format and enables the use of wafer-level vacuum packaging (WLVP) technology. Read-out IC (ROIC) implements infrared signal detection and offset correction for fixed pattern noise (FPN) using an internal digital to analog convertor (DAC) value control function. A reliable WLVP thermal sensor was obtained with the design of lid wafer, the formation of Au80%wtSn20% eutectic solder, outgassing control and wafer to wafer bonding condition. The measurement of thermal conductance enables us to inspect the internal atmosphere condition of WLVP microbolometer sensor. The difference between the measurement value and design one is $3.6{\times}10-9$ [W/K] which indicates that thermal loss is mainly on account of floating legs. The mean time to failure (MTTF) of a WLVP thermal sensor is estimated to be about 10.2 years with a confidence level of 95 %. Reliability tests such as high temperature/low temperature, bump, vibration, etc. were also conducted. Devices were found to work properly after accelerated stress tests. A thermal camera with visible camera was developed. The thermal camera is available for non-contact temperature measurement providing an image that merged the thermal image and the visible image.

• Journal of Adhesion and Interface
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• v.7 no.4
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• pp.53-59
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• 2006

The paper highlights technical advances and introduces recent innovations such as smart curing laminating adhesives for flexible packaging with low migration rates of aromatic isocyanates and amines. Latent reactive one-part systems on the basis of surface deactivated solid isocyanates open up new dimensions for heat setting adhesives and waterborne PU dispersions. The new generation of Purmelt Micro Emission adhesives contains less than 0.1% of MDI monomer, thereby drastically reducing the emission of hazardous isocyanate vapors during processing and setting a significantly improved technical standard in occupational safety. Once again, polyurethane adhesives have demonstrated their unique ability to adapt to new process, product, safety and environmental requirements.