• Journal of the Korean Crystal Growth and Crystal Technology
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• v.15 no.1
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• pp.34-38
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• 2005

Effects of pH level and slurry particle size on material removal rate and planarization of langasite single crystal wafer have been examined. Higher material removal rate was obtained with lower pH level slurries while the planarization was found to be determined by average particle size of colloidal silica slurries. Slurries containing 0.045 ㎛ amorphous silica particles showed the best polishing effect without any scratches on the surface. Effective particle number has a strong effect on the surface planarization and the removal rate, so that the lower effective particle numbers produced low removal rate but the better planarization results.

• Transactions of the Korean Society of Mechanical Engineers
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• v.15 no.2
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• pp.618-629
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• 1991

The purpose of this experiment is to understand the distribution of coal particles inside CWM droplet which is believed to be a very important factor controlling the flame stability. CWM slurry is atomized by an air assisted twin fluid nozzle. An experimental rig is designed and fabricated. The mean size of coal particle distribution in CWM slurry, atomizing air pressure, coal particle loading in slurry and sampling position inside spray are main experimental variables. The atomized CWM droplets are sampled on the thin white layer of magnesium oxide by the emergency sampling shutter. The sampled coal particles on magnesium oxide layers are collected into test tubes and dispersed completely by Ultra-Sonicator. The size distribution of coal particles inside droplets are measured by Coulter Counter. The presence of coal particle inside the impressions of droplets on magnesium oxide layer are investigated by photo technique. There are quite many droplets which do not have any coal particles. Those are just water droplets, not CWM droplets. The population ratio of droplets without coal particles to toal number of droplets is strongly affected by the mean size of coal particle distribution in slurry and this ration becomes bigger number as the mean size of coal particles be larger. The size distribution of coal particles inside CWM droplets is not even and depends on the size of droplet. Experimental results show that the larger CWM droplets has droplets has bigger mean value of particle size distribution. This trend becomes more evident as the atomizing air pressure is raised and the mean size of coal particles in CWM slurry is bigger. That is, the distribution of coal particles inside CWM dropolets is very much affected by the atomizing air pressure and the mean size of pulverized coal particles in CWM slurry.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.138-143
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• 2004

CMP (Chemical Mechanical Polishing) technology for global planarization of multilevel interconnection structure has been widely studied for the next generation devices. Among the consumables for CMP process, especially, slurry and their chemical compositions play a very important role in the removal rates and within-wafer non-uniformity (WIWNU) for global planarization ability of CMP process. However, CMP slurries contain abrasive particles exceeding 1 ${\mu}{\textrm}{m}$ size, which can cause micro-scratch on the wafer surface after CMP process. Such a large size particle in these slurries may be caused by particle agglomeration in slurry supply-line. In this work, to investigate the effects of agglomeration on the performance of oxide CMP slurry, we have studied an aging effect of silica slurry as a function of particle size distribution and aging time during one month. We Prepared and compared the self-developed silica slurry by adding of alumina powders. Also, we have investigated the oxide CMP characteristics. As an experimental result, we could be obtained the relatively stable slurry characteristics comparable to aging effect of original silica slurry. Consequently, we can expect the saving of high-cost slurry.

• Journal of the Korean Ceramic Society
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• v.50 no.6
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• pp.528-532
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• 2013

Well-dispersed slurries of submicron-sized alumina powders were pressure-infiltrated in 3D preforms of mullite fibers and the effects of the particle size and infiltration pressure on the particle packing characteristics were investigated. Infiltration without pressure showed that the packing density increased as the particle size decreased due to the reduction of the friction between the particles and the fibers. The infiltrated preforms contained large pores in the large voids between the fiber tows and small pores in the narrow voids between the individual fibers. Pressure infiltration resulted in a packing density of 77% regardless of the particle size or the infiltration pressure(210 ~ 620 kPa). Pressure infiltration shortened the infiltration time and eliminated the large pores in preforms infiltrated with the slurries of smaller particles. The slurry pressure-infiltration process is thus an efficient method for the packing of matrix materials in various preforms.

• Particle and aerosol research
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• v.12 no.4
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• pp.145-150
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• 2016

During the chemical mechanical planarization (CMP) process, slurry that comprises abrasive particles can directly affect the CMP performance and quality. Mainly, the large particles in the slurry can generate the defects on the wafer. Thus, many kinds of filters have been used in the CMP process to remove unwanted over-sized particles. Among these filters, the point-of-use (POU) filter is used just before the slurry is supplied onto the CMP pad. In the CMP research field, analysis of the POU filter has been relatively exceptional, and previous studies have not focused on the standardized filtration efficiency (FE) or filter performance. Furthermore, conventional evaluation methods of filter performance are not appropriate for POU filters, as the POU filter is not a membrane type, but is instead a depth type roll filter. In order to accurately evaluate the POU filter, slurry FE according to particle size was measured in this study. Additionally, a CMP experiment was conducted with filtered slurry to demonstrate the effects of filtered slurry on CMP performance. Depending on the flow rate and the filter retention size, the FE according to particle size was different. When the small and large particles have different FEs, the total filtration efficiency (TFE) can still have a similar value. For this reason, there is a need to measure the FE with respect to the particle size to verify the effects of the POU filter on the CMP process.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.37-40
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric (IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Micro-scratches are generated by agglomerated slurry, solidified and attached slurry in pipe line of slurry supply system. It is well known that the presence of hard and larger size particles in the CMP slurries increases the defect density and surface roughness of the polished wafers. In this paper, we have studied aging effect the of CMP slurry as a function of particle size. We prepared and compared the self-developed silica slurry by adding of abrasives before and after annealing. As our preliminary experiment results, we could be obtained the relatively stable slurry characteristics comparable to original silica slurry in the slurry aging effect.

• Journal of Industrial Technology
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• v.24 no.A
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• pp.251-261
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• 2004

A series of column test with a silty marine soil mixed with Jumunjin Standard Sand were performed to investigate the characteristics of settling and consolidation of non-plastic dredged soils. Column tests were carried out by using the separable column to measure the grain size distribution of consolidated layer. Column tests were performed with changing the mixing ratio of Jumunjin Standard Sand to the silty marine soil, initial water content of slurry and initial height of slurry. Height of interface of slurry was monitored during tests and grain size distribution tests were carried out after finishing tests. Influencing factors on the particle segregation, eventually to the characteristics of settling and consolidation of non-plastic soil, were analyzed on the thesis of test results. As results of column tests, the mixing ratio of sand to the silty marine soil and the initial water content of slurry were known to affect the characteristics of settling and consolidation resulted in significant particle segregation of slurry. Initial height of slurry was found not to affect seriously to particle segregation.

• Journal of the Korean Ceramic Society
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• v.34 no.11
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• pp.1173-1181
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• 1997

Effects of particle size distribution of alumina ceramics on behaviors of tape casting were investigated with emphases on the rheological characteristic of slurry, green density, green sheet strength, and sintering density. For the control of particle size distribution of alumina, the commercial grade low soda alumina, which had different mean particle size of 3.58 ${\mu}{\textrm}{m}$ and 0.42 ${\mu}{\textrm}{m}$, were chosen and blended together. As results, the mixing of 80 wt% fine powder and 20 wt% coarse powder(designated to FC20) led to the increase of packing density and strength of green sheet, and made it easy to handle during processing without lowering of sintering density. Besides, the pseudoplastic behavior of slurry decreased with increase of the fraction of coarse alumina powder.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07a
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• pp.389-392
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. we investigated the performance of $SnO_2$-CMP process using commonly used silica slurry, ceria slurry, tungsten slurry. This study shows removal rate and non-uniformity of $SnO_2$ thin film used to gas sensor by using Ceria, Silica, W-Slurry after CMP process. This study also shows the relation between particle size and CMP with particle size analysis of used slurry.

• Journal of Industrial Technology
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• v.21 no.B
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• pp.141-147
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• 2001

For the preparation of calcium carbonate particles from aqueous $Ca(OH)_2$ slurry, carbonation reaction of aqueous $Ca(OH)_2$ slurry was carried out by batch method the $CO_2$ into reactor filled with aqueous slurry of $Ca(OH)_2$. The concentration of $Ca(OH)_2$ varies from 1.00 to 7.00wt%, reactor temperature at 20 and $40^{\circ}C$, and reactor pressure from atmospheric pressure to $6.0kg_f/cm^2$. Crystal structure of calcium carbonate was of calcite, the particle size were about $0.05{\sim}2.0{\mu}m$, and the particle shape was cubic and spindle. When reactor temperature was higher, particle size of calcium carbonate was bigger and particle shape was varied, but reaction rate was increased. When reactor pressure was higher, particle size of calcium carbonate was smaller, particle shape was cubic, and reaction rate was increased.