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Effect of pH level and slurry particle size on the chemical mechanical planarization of langasite crystal wafer  

Cho Hyun (Department of Materials Engineering, Miryang National University)
Publication Information
Journal of the Korean Crystal Growth and Crystal Technology / v.15, no.1, 2005 , pp. 34-38 More about this Journal
Abstract
Effects of pH level and slurry particle size on material removal rate and planarization of langasite single crystal wafer have been examined. Higher material removal rate was obtained with lower pH level slurries while the planarization was found to be determined by average particle size of colloidal silica slurries. Slurries containing 0.045 ㎛ amorphous silica particles showed the best polishing effect without any scratches on the surface. Effective particle number has a strong effect on the surface planarization and the removal rate, so that the lower effective particle numbers produced low removal rate but the better planarization results.
Keywords
Langasite wafer; Chemical mechanical planarization; Colloidal silica slurry; pH level; Slurry particle size; Material removal rate; Planarization effect;
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