• 한국전기전자재료학회논문지
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• 제18권6호
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• pp.521-526
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• 2005

Within wafer non-uniformity(WIWNU) improves as the stiffness of pad decrease. We designed the pad groove to study of pad stiffness on WIWNU in Chemical mechanical polishing(CMP) and measured the pad stiffness according to groove width. The groove influences effective pad stiffness although original mechanical properties of pad are unchanged by grooving. Also, it affects the flow of slurry that has an effect on the lubrication regime and polishing results. An Increase of the apparent contact area of pad by groove width results in decrease of effective pad stiffness. WIWNU and profile of removal tate improved as effective pad stiffness decreased. Because grooving the pad reduce its effective stiffness and it makes slurry distribution to be uniform. Futhermore, it ensures that pad conforms to wafer-scale flatness variability. By grooving the top pad, it is possible to reduce its stiffness and hence reduce WIWNU and edge effect.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.247-251
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• 2004

Chemical-Mechanical Polishing(CMP) especially is becoming one of the most important ULSI processes for the 0.25m generation and beyond. And there are many elements affecting CMP performance such as slurry, pad, process parameters and pad conditioning. Among these elements the CMP pad is considered one of the most important because of its change. But the surface of the pad has irregular pores, so there is non-uniformity of slurry flow and of contact area between wafer and the pad, and glazing occurs on the surface of the pad. So we make CMP pad with micro structure using micro molding method. This paper introduces the basic concept and fabrication technique of CMP pad with micro-structure and the characteristic of polishing. Experimental results demonstrate the removal rate, uniformity, and time vs. removal rate.

• Korean Journal of Chemical Engineering
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• 제35권12호
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• pp.2355-2364
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• 2018

We evaluated the effect of particle size and associated dynamics on a hydrocyclone separation process in order to understand the movement of the particle trajectories inside the hydrocyclone via numerical analysis, with particles of acid hydrolysis residues discharged in $TiO_2$ production via the sulfate method as a case study. The values obtained from the numerical simulation were successfully compared with those from experimental tests in the literature, allowing a description of the dynamics of the particles, their acting forces, and their relevant properties together with separation efficiency. The results showed that particle motion is jointly controlled by the drag force, the pressure gradient force and the centrifugal force. With increasing particle size, the influence of the drag force is weakened, whereas that of the centrifugal force and pressure gradient is strengthened. Factors including particle density, slurry viscosity, and inlet slurry flow rate also contribute to a clear and useful understanding of particle motion behavior in the hydrocyclone as a method for improving the separation efficiency.

• Transactions on Electrical and Electronic Materials
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• 제12권3호
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• pp.115-118
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• 2011

Process characterization of the chemical mechanical polishing (CMP) process for undensified phosphosilicate glass (PSG) film is reported using design of experiments (DOE). DOE has been addressed to experimenters to understand the relationship between input variables and responses of interest in a simple and efficient way. It is typically beneficial for determining the adequate size of experiments with multiple process variables and making statistical inferences for the responses of interests. Equipment controllable parameters to operate the machine include the down force (DF) of the wafer carrier, pressure on the backside of the wafer, table and spindle speed (SS), slurry flow rate, and pad condition. None of them is independent; thus, the interaction between parameters also needs to be indicated to improve process characterization in CMP. In this paper, we have selected the five controllable equipment parameters, such as DF, back pressure (BP), table speed (TS), SS, and slurry flow (SF), most process engineers recommend to characterize the CMP process with respect to material removal rate (RR) and film uniformity as a percentage. The polished material is undensified PSG. PSG is widely used for the plananization in multi-layered metal interconnects. We identify the main effect of DF, BP, and TS on both RR and film uniformity, as expected, by the statistical modeling and analysis on the metrology data acquired from a series of $2^{5-1}$ fractional factorial design with two center points. This revealed the film uniformity of the polished PSG film contains two and three-way interactions. Therefore, one can easily infer that the process control based on better understanding of the process is the key to success in semiconductor manufacturing, typically when the wafer size reaches 300 mm and is continuously scheduled to expand up to 450 mm in or little after 2012.

• 한국초전도ㆍ저온공학회논문지
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• 제20권2호
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• pp.16-19
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• 2018

Comprehensive utilization of zinc smelting iron slag not only solves environmental problems but also creates huge economic benefits. This study was conducted on the enrichment and recovery of ${\alpha}-Fe_2O_3$ from zinc smelting iron slag by superconducting HGMS technology. Several variables such as slurry flow velocity, slag concentration, magnetic field intensity and the amount of dispersing agent were tested in magnetic separation. In the experiments, obtained optimal magnetic separation parameters were 1.60 T of magnetic flux intensity, 600 mL/min of slurry flow velocity of, 15 g/L of slag concentration of, 0.10 g/L of dispersing agent. Under this condition, the content of ${\alpha}-Fe_2O_3$ was increased from 86.22% to 94.39% that can approach the Chinese national standard requirements (A level) of iron oxide red. It was concluded that using superconducting HGMS technology was an effective method for the purification of ${\alpha}-Fe_2O_3$ from zinc smelting iron slag.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2010년도 추계 학술발표회
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• pp.1264-1273
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• 2010

Soil-bentonite cutoff walls are widely recognized to be the effective barrier for containment of wastes and groundwater. Bentonite cake is usually found remaining on the trench surface due to the use of bentonite slurry during the excavation for the cutoff wall construction. Defects also inevitably take place due to the inappropriate construction procedures or improperly mixed soil-bentonite backfill. The defects include insufficient keys and windows in the soilbentonite cutoff wall. In this study, the performance of the soil-bentonite cutoff wall is evaluated based on the flow rates through the wall. Three-dimensional numerical models were applied to simulate the groundwater flow through the soil-bentonite cutoff walls of typical geometries with consideration of the defects and bentonite cake. Results of the simulations showed that the bentonite cake has no effect in the insufficient key cases. In the keyed wall cases, the bentonite cake with very low hydraulic conductivity significantly impedes the flow of groundwater through the wall. The presence of the bentonite cake not only compromises the window defect but also renders the wall construction more effective in blocking the groundwater flow. These findings show the significance of the bentonite cake in a soil-bentonite cutoff wall construction.

• International Journal of Fluid Machinery and Systems
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• 제6권3호
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• pp.121-136
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• 2013

This paper reports the 1-D fluid transient simulation results of the discharge flow conditions in a 6-cylinder reciprocating slurry pump. Two discharge manifold configurations are studied comparatively; a case with a hexagon shaped discharge manifold where each cylinder discharges at a single vertex, and a case where all the cylinders discharges are lumped together into a tank shaped manifold. In addition, the study examines the effect of two pulsation mitigation measures in the case of hexagonal manifold; a single inline orifice in one of the hexagon sides and a volumetric dampener at the manifold outlet. The study establishes the pressure and flow fluctuation characteristics of each configuration and decouples the pulsation characteristics of the pump and the discharge manifold.

• 한국유체기계학회 논문집
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• 제6권4호
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• pp.21-28
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• 2003

CMP (Chemical Mechanical Polishing) is to achieve adequate local and global planarization for future sub-micrometer VLSI requirements. In designing CMP, numerical computation is quite helpful in terms of reducing the amount of experimental works. Stresses on pad, concentration of particles and particle tracking are studied for design. In this research, the optimization of grooved pad shape of CMP is performed through numerical investigation of slurry flow in CMP process. The result indicates that the combination of sinusoidal groove and skewed pad is the most optimal shape among the twenty candidates. Useful information can be obtained in velocity, pressure, stress, concentration of particles and particles trajectories, etc.

• 환경위생공학
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• 제10권2호
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• pp.13-22
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• 1995

Most of small- scale livestock facility have difficulties to treat organic wastewater by activated sludge process as distinguished feces and urine. The organic wastewater discharged have characteristics of slurry, high concentration of BOD, 55 etc. This study was performed to estimate suitable condition for the application of packing materials, air flow, pollutant load and so on as important parameter to treat organic wastewater by thermopile oxlc process. As a result obtained at this experiments the most suitable condition for BOD load, air flow indicate 3.0kg · m$^{-3}$ day$^{-1}$,50 ∼ 100L· min$^{-1}$ m$^{-3}$, respectively, and we knew that it was necessary to add waste contained high calories to degrade about 80% of pollutant among waste- water. It showed that plastic material can be used as packing media because it can be provided as inhabitation for microorganism owing to intensity of material and characteristic of keeping moisture.

• 반도체디스플레이기술학회지
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• 제21권4호
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• pp.71-76
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• 2022

We evaluated and developed a 6th generation large-size polisher in the type of face-up and Oscar. We removed the hillocks of the low temperature poly-silicon (LTPS) thin film with this polisher. The surface roughness of LTPS was lowered from 7.9 nm to 0.6 nm after CMP(chemical mechanical polishing). The thickness of the LTPS is measured through reflectance in real time during polishing, and the polishing process is completed according to this thickness. The within glass non-uniformity (WIGNU) was 6.2% and the glass-to-glass non-uniformity (GTGNU) was 2.5%, targeting the LTPS thickness of 400Å. In addition, the residual slurry after the CMP process was removed through the Core Flow PVA Brush and alkaline chemical.