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Design of Pad Groove in CMP using CFD

CFD를 이용한 CMP의 Pad Groove 형상 설계 연구

  • 최치웅 (한양대학교 대학원 기계공학과) ;
  • 이도형 (한양대학교 기계산업공학부)
  • Published : 2003.12.01

Abstract

CMP (Chemical Mechanical Polishing) is to achieve adequate local and global planarization for future sub-micrometer VLSI requirements. In designing CMP, numerical computation is quite helpful in terms of reducing the amount of experimental works. Stresses on pad, concentration of particles and particle tracking are studied for design. In this research, the optimization of grooved pad shape of CMP is performed through numerical investigation of slurry flow in CMP process. The result indicates that the combination of sinusoidal groove and skewed pad is the most optimal shape among the twenty candidates. Useful information can be obtained in velocity, pressure, stress, concentration of particles and particles trajectories, etc.

Keywords

References

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