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http://dx.doi.org/10.5293/KFMA.2003.6.4.021

Design of Pad Groove in CMP using CFD  

Choi, Chi-Woong (한양대학교 대학원 기계공학과)
Lee, Do-hyung (한양대학교 기계산업공학부)
Publication Information
The KSFM Journal of Fluid Machinery / v.6, no.4, 2003 , pp. 21-28 More about this Journal
Abstract
CMP (Chemical Mechanical Polishing) is to achieve adequate local and global planarization for future sub-micrometer VLSI requirements. In designing CMP, numerical computation is quite helpful in terms of reducing the amount of experimental works. Stresses on pad, concentration of particles and particle tracking are studied for design. In this research, the optimization of grooved pad shape of CMP is performed through numerical investigation of slurry flow in CMP process. The result indicates that the combination of sinusoidal groove and skewed pad is the most optimal shape among the twenty candidates. Useful information can be obtained in velocity, pressure, stress, concentration of particles and particles trajectories, etc.
Keywords
CMP; Groove; Pad; Two-phase flow; Vortex;
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