• 제어로봇시스템학회:학술대회논문집
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• 1986.10a
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• pp.238-243
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• 1986

Distillation columns are widely used in almost every chemical plant. The use of multivariable control for such units is attractive because of the strong interactions exhibited between outputs and inputs and the desire to control simultaneously both top and bottom products. In this research design of a robust multivariable controller for distillation column was considered; output feedback controller with proportional and integral modes was designed using pole assignment. The transfer function matrix was obtained by fitting the step response realtions between single input double output pairs of variables. This matrix was then converted to linear time invariant state space model by multivariable realization technique. With the proposed multivariable proportional and integral controller applied to the process, the result of the digital computer simulation showed a good performance of asymtotic tracking. The limited experimental performance of this multivariable control was compared with the result from simulation. It was found that the proposed controller performed satisfactorily for the distillation column which separated binary mixture of methanol and water.

• Journal of Applied Reliability
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• v.17 no.1
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• pp.28-37
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• 2017

Purpose: This paper proposes a procedure that may infer and identify interaction failures in a module. Methods: In design FMEA, we defined an interaction model between components and proposed a method for selecting a single component by using the standard specification classification table and four methods for choosing the related components. We also introduced the function tree for function and requirement characteristic analysis and proposed utilization of standard stress lists and 1st and 2nd stress analysis tables to determine the effect the stress analysis has on interactions. Finally, the interaction mechanism diagram was proposed and used to infer the failure mechanism. Process FMEA also established procedures in a similar way. Results: We established a procedure for predicting the failure mode due to interaction between components based on Company A's multi-step FMEA procedure. Conclusion: By applying the proposed interaction FMEA procedure to the development model, we were able to confirm the effect of the new derivation on the failure mode of interaction, which was not predicted by the existing FMEA.

• Macromolecular Research
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• v.14 no.6
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• pp.617-623
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• 2006

In order to achieve an oriental lacquer (OL) film with a thick consistency, UV-curable silicone acrylate (SA) was added to OL by a dual curing process. The addition of 5 wt% UV-curable SA to the OL fomulation enabled the preparation via a single drying step of a $77{\mu}m-thick$ film exhibiting excellent surface properties. FTIR-ATR was used to investigate the effect of UV-curable SA on the behavior of film formation during curing, and the relaxation behavior of the produced films was investigated by dielectric spectroscopy. Dielectric properties were measured in the frequency range $10^{-2}-10^5\;Hz$ at various temperatures between -100 and $200^{\circ}C$. The results demonstrated that OL modified by UV-curable SA has a higher glass transition temperature and stronger secondary relaxation at a lower temperature than the conventional OL system. The OL film modified with UV-curable SA was presumed to be harder at the surface and tougher than conventional OL film.

• Journal of the Optical Society of Korea
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• v.1 no.1
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• pp.10-14
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• 1997

Single pulse laser excitation at 656 nm and successive pulse excitation at 635.2 and 648.4 nm produced blue emission at 480 nm by two-step upconversion process in Tm/sup 3+/:LaF/sub 3/. The excited-state absorption cross-section of the /sup 3/F/sub 4/ to /sup 1/G/sub 4/ transition was estimated by a looping mechanism with cross-relaxation processes. The dynamics of up-conversion andthe possibility of the photon avalanche by a pulse laser excitation were studied by numerical simulation with the rate equation model.

• JSTS:Journal of Semiconductor Technology and Science
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• v.14 no.6
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• pp.706-711
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• 2014

A low power 6-bit flash ADC that uses an input voltage range detection algorithm is described. An input voltage level detector circuit has been designed to overcome the disadvantages of the flash ADC which consume most of the dynamic power dissipation due to comparators array. In this work, four digital input voltage range detectors are employed and each input voltage range detector generates the specific clock signal only if the input voltage falls between two adjacent reference voltages applied to the detector. The specific clock signal generated by the detector is applied to turn the corresponding latched comparators on and the rest of the comparators off. This ADC consumes 68.82 mW with a single power supply of 1.2V and achieves 4.3 effective number of bits for input frequency up to 1 MHz at 500 MS/s. Therefore it results in 4.6 pJ/step of Figure of Merit (FoM). The chip is fabricated in 0.13-um CMOS process.

• Advances in materials Research
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• v.1 no.1
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• pp.13-29
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• 2012

In order to simultaneously enhance the strength and plasticity in nanostructured / ultrafine-grained alloys, a strategy of introducing multiple length scales into microstructure (or called bimodal composite microstructure) has been developed recently. This paper presents a brief overview of the alloy developement and the mechanical behavior of ultrafine-grained Ti-Fe-based alloys with different length-scale phases, i.e., micrometer-sized primary phases (dendrites or eutectic) embedded in an ultrafine-grained eutectic matrix. These ultrafine-grained titanium bimodal composites could be directly obtained through a simple single-step solidification process. The as-prepared composites exhibit superior mechanical properties, including high strength of 2000-2700 MPa, large plasticity up to 15-20% and high specific strength. Plastic deformation of the ultrafine-grained titanium bimodal composites occurs through a combination of dislocation-based slip in the nano-/ultrafine scale matrix and constraint multiple shear banding around the micrometer-sized primary phase. The microstructural charactersitcs associated to the mechanical behaivor have been detailed discussed.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1999.11a
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• pp.173-176
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• 1999

Continuing improvement of microprocessor performance involves in the devece size. This allow greater device speed, an increase in device packing density, and an increase in the number of functions that can reside on a single chip. However this has led to propagation delay, crosstalk noise, and power dissipation due to resistance-capacitance(RC) coupling become significant due to increased wiring capacitance, especially interline capacitance between the metal lines on the same metal level. Becase of pattering MSSQ (Methylsilsequioxane), we use RIE(Reactive ton Etching) which is a good anisotrgpy. In this study, according as we control a flow rate of CF$_4$/O$_2$ gas, RF power, we analysis by using ${\alpha}$ -step, SEM and AFM,

• Nuclear Engineering and Technology
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• v.42 no.4
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• pp.365-376
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• 2010

This paper summarizes the results of a Writing Group on the Extension of CFD codes to two-phase flow safety problems, which was created by the Group for Analysis and Management of Accidents of the Nuclear Energy Agency' Committee on the Safety of Nuclear Installations (NEA-CSNI). Two-phase CFD used for safety investigations may predict small scale flow processes, which are not seen by system thermalhydraulic codes. However, the two-phase CFD models are not as mature as those in the single phase CFD and potential users need some guidance for proper application. In this paper, a classification of various modelling approaches is proposed. Then, a general multi-step methodology for using two-phase-CFD is explained, including a preliminary identification of flow processes, a model selection, and a verification and validation process. A list of 26 nuclear reactor safety issues that could benefit from investigations at the CFD scale is identified. Then, a few issues are analyzed in more detail, and a preliminary state-of-the-art is proposed and the remaining gaps in the existing approaches are identified. Finally, guidelines for users are proposed.

• Applied Microscopy
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• v.51
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• pp.8.1-8.7
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• 2021

Growing demands for comprehending complicated nano-scale phenomena in atomic resolution has attracted in-situ transmission electron microscopy (TEM) techniques for understanding their dynamics. However, simple to safe TEM sample preparation for in-situ observation has been limited. Here, we suggested the optical microscopy based micro-manipulating system for transferring TEM samples. By adopting our manipulator system, several types of samples from nano-wires to plate-like thin samples were transferred on micro-electro mechanical systems (MEMS) chip in a single step. Furthermore, the control of electrostatic force between the sample and the probe tip is found to be a key role in transferring process.

• Journal of the Korean Society for Precision Engineering
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• v.13 no.9
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• pp.70-76
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• 1996

In the Stereolithography process, three-dimensional objects are built by sequentially curing, generated by horizontal slicing of a three-dimensional CAD model. The dimensional accuracy of a menufactured part depends on the accuracy of curing performed by laser beam radius and the half of curing width. When offsetting, some slices have collinear segments, coincident vertices, line jerks and open loops. After remove above issues we have correct offsets data. And in last step, these data are used to scan paths.