• Title/Summary/Keyword: Single crystalline 3C-SiC

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Substrate tempperature dependence of crystalline Y2O3 films grown by Ionized Cluster Beam Deposition

  • Cho, M.H.;Whangbo, S.W.;Seo, J.G.;Choi, S.C.;Cho, S.J.;Whang, C.N.
    • Proceedings of the Korean Vacuum Society Conference
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    • 1998.02a
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    • pp.87-89
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    • 1998
  • The Y2O3 films on Si(111) was grown by ionized cluster beam depposition (ICBD) in ultrahigh-vacuum (UHV). The acceleration voltage and oxygen ppartial ppressure were fixed at 5 kV and 2$\times$10-5 Torr resppectively. The substrate tempperature was varied from 10$0^{\circ}C$ to $600^{\circ}C$ in order to find the deppendence of crystallinity of Y2O3 films on the substrate tempperature. The crystallinity of the films with the substrate tempperature studied using x-ray diffraction (XRD) and Rutherford backscattering sppectroscoppy (RES). Surface crystallinity and surface morpphology of the films were also investigated using the reflection high-energy electron diffraction (RHEED) and atomic force microscoppe (AFM) resppectively. The films grown at the substrate tempperature below 50$0^{\circ}C$showed the ppoly-crystalline structure of oxygen deficiency. On the contrary the single-crystalline structure was obtained at the substrate tempperature over 50$0^{\circ}C$ and the stochimetry was gradually matched as increasing the substrate tempperature. The surface morpphology showed the increase of the surface roughness as the substrate tempperature was increased upp to 50$0^{\circ}C$ The crystallinity of the film was not good and the minimum channeling yield $\chi$min was measured at 0.91 The stochiometric and high crystallinine film (surface $\chi$min=0.25) was obtained as the substrate tempperature increased upp to 60 $0^{\circ}C$ which indicate the tempperature was sufficient to migrate the depposited atom.

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Growth and structure of $CeO_2$ films by oxygen-plasma-assisted molecular beam epitaxy (산소 플라즈마에서의 분자살 적층성장에 의한 $CeO_2$ 박막의 성장과 구조)

  • ;S.A. Chambers
    • Journal of the Korean Vacuum Society
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    • v.9 no.1
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    • pp.16-23
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    • 2000
  • The epitaxial growth of $CeO_2$ films has been investigated on three different substrates-Si(111), $SrTiO_3$(001), and MgO(001)-over wide range of growth parameters using oxygen-plasma-assisted molecular beam epitaxy. Pure-phase, single-crystalline epitaxial films of $CeO_2$ (001) have been grown only on $SrTiO_3$(001). We discuss the growth conditions in conjunction with the choice of substrates required to synthe-size this oxide, as well as the associated characterization by menas of x-ray diffraction, reflection high-energy electron diffraction, low-energy electron diffraction, and x-ray photoelectron spectroscopy and diffraction. Successful growth of single crystalline $CeO_2$ depends critically on the choice of substrate and is rather insensitive to the growth conditions studied in this investigation. $CeO_2$(001) films on $SrTiO_3$exhibit the sturcture of bulk $CeO_2$ without surface reconstructions. Ti outdiffusion is observed on the films grown temperatures above $650^{\circ}C$.

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The Properties of Passivation Films on Al2O3/SiNX Stack Layer in Crystalline Silicon Solar Cells (결정질 실리콘 태양전지의 Al2O3/SiNX 패시베이션 특성 분석)

  • Hyun, Ji Yeon;Song, In Seol;Kim, Jae Eun;Bae, Soohyun;Kang, Yoonmook;Lee, Hae-Seok;Kim, Donghwan
    • Current Photovoltaic Research
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    • v.5 no.2
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    • pp.63-67
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    • 2017
  • Aluminum oxide ($Al_2O_3$) film deposited by atomic layer deposition (ALD) is known to supply excellent surface passivation properties on crystalline Si surface. The quality of passivation layer is important for high-efficiency silicon solar cell. double-layer structures have many advantages over single-layer materials. $Al_2O_3/SiN_X$ passivation stacks have been widely adopted for high- efficiency silicon solar cells. The first layer, $Al_2O_3$, passivates the surface, while $SiN_X$ acts as a hydrogen source that saturates silicon dangling bonds during annealing treatment. We explored the properties on passivation film of $Al_2O_3/SiN_X$ stack layer with changing the conditions. For the post annealing temperature, it was found that $500^{\circ}C$ is the most suitable temperature to improvement surface passivation.

Low-temperature crystallization of high-dielectric (Ba,Sr)$TiO_3$ thin films for embedded capacitors

  • Cho, Kwang-Hwan;Kang, Min-Gyu;Kang, Chong-Yun;Yoon, Seok-Jin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.03a
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    • pp.21-21
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    • 2010
  • (Ba,Sr)$TiO_3$ (BST) thin film with a perovskite structure has potential for the practical application in various functional devices such as nonvolatile-memory components, capacitor, gate insulator of thin-film transistors, and electro-optic devices for display. Normally, the BST thin films derived from sol-gel and sputtering are amorphous or partially crystalline when processed below $600^{\circ}C$. For the purpose of integrating BST thin film directly into a Si-based read-out integrated circuit (ROIC), it is necessary to process the BST film below $400^{\circ}C$. The microstructural and electrical properties of low-temperature crystallized BST film were studied. The BST thin films have been fabricated at $350^{\circ}C$ by UV-assisted rapidly thermal annealing (RTA). The BST films are in a single perovskite phase and have well-defined electrical properties such as high dielectric constant, low dielectric loss, low leakage current density, and high breakdown voltage. Photoexcitation of the organics contained in the sol-gel-derived films by high-intensity UV irradiation facilitates elimination of the organics and formation of the single-crystalline phase films at low temperatures. The amorphous BST thin film was transformed to a highly (h00)-oriented perovskite structure by high oxygen pressure processing (HOPP) at as low as $350^{\circ}C$. The dielectric properties of BST film were comparable to (or even better than) those of the conventionally processed BST films prepared by sputtering or post-annealing at temperature above $600^{\circ}C$. When external pressure was applied to the well-known contractive BST system during annealing, the nucleation energy barrier was reduced; correspondingly, the crystallization temperature decreased. The UV-assisted RTA and HOPP, as compatible with existing MOS technology, let the BST films be integrated into radio-frequency circuit and mixed-signal integrated circuit below the critical temperature of $400^{\circ}C$.

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Band Gap and Defect Sites of Silicon Nitride for Crystalline Silicon Solar Cells (단결정 실리콘 태양전지를 위한 실리콘 질화막의 밴드갭과 결함사이트)

  • Jung, Sung-Wook;Yi, Jun-Sin
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2010.06a
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    • pp.365-365
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    • 2010
  • In this paper, silicon nitride thin films with different silane and ammonia gas ratios were deposited and characterized for the antireflection and passivation layer of high efficiency single crystalline silicon solar cells. As the flow rate of the ammonia gas increased, the refractive index decreased and the band gap increased. Consequently, the transmittance increased due to the higher band gap and the decrease of the defect states which existed for the 1.68 and 1.80 eV in the SiNx films. The reduction in the carrier lifetime of the SiNx films deposited by using a higher $NH_3/SiH_4$ flow ratio was caused by the increase of the interface traps and the defect states in/on the interface between the SiNx and the silicon wafer. The silicon and nitrogen rich films are not suitable for generating both higher carrier lifetimes and transmittance. These results indicate that the band gap and the defect states of the SiNx films should be carefully controlled in order to obtain the maximum efficiency for c-Si solar cells.

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Permeability Aftereffect in FeCuNbSiB Alloy (FeCuNbSiB 합금의 투자율 여효)

  • Lee, Yong-Ho;Sin, Yong-Dol;No, Tae-Hwan;Gang, Il-Gu
    • Journal of the Korean Magnetics Society
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    • v.2 no.3
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    • pp.216-221
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    • 1992
  • Annealing effects on the permeability aftereffect(disaccommodation) of liquid quenched single strip $Fe_{73.5}Cu_1Nb_3Si_{16}B_{6.5}$ alloys were investigated with pulse method. The initial susceptibility X, $B_{10},$ (the flux density at 10 Oe) and disaccommodation intensity D (D = [X(1 s)-X(64 s)]/X(1 s), where X(1 s) and X(64 s) are the susceptibility of 1 and 64 s of rest time after A. C. demagnetization) were about 800, 0.8 T and 16 %, respectively. The soft magnetic properties were improved with isothermal annealing for 1 hour at $300{\sim}600^{\circ}C.$ X, $B_{10},$ and D at $570^{\circ}C$ of optimum annealing temperature were 15000, 1.2 T and 1.1 %, respectively. The origin of the change of characteristics were examined with fine crystalline structure and magnetostriction.

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Properties of Yttrium Manganates with MFS Structure Fabricated on Various Substates (MFS 구조로 적층된 Yttrium Manganates의 기판 변화에 따른 특성 연구)

  • 강승구
    • Journal of the Korean Ceramic Society
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    • v.40 no.2
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    • pp.206-211
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    • 2003
  • Effects of substrates and buffer layer upon the formation of crystalline phases and ferroelectricity of $YMnO_3$ thin films were investigated. The hexagonal $YMnO_3$ was easily formed on Si(100) while the mixed phases, hexagonal and orthorhombic $YMnO_3$, on $Pt(111)/TiO_2/SiO_2/Si$ substrate. When the $Y_2O_3$ buffer layer of 70 nm thick was inserted between the substrates and the $YMnO_3,$ the c-axis oriented hexagonal single phase formed on both substrates, Si(100) and $Pt(111)/TiO_2/SiO_2/Si$. The leakage current density of the hexagonal $YMnO_3$ thin films was lower than that consisting of mixed phases, hexagonal and orthorhombic. Furthermore the hexagonal $YMnO_3$ with c-axis preferred orientation showed the lowest leakage current density. The remnant polarization from a P-E hysteresis curve for the $YMnO_3$ formed on Si(100) was 0.14 without buffer layer and $0.24_{mu}C/cm^2$ for that with buffer layer. For the $Pt(111)/TiO_3/SiO_3/Si$ substrates, the specimen without $Y_2O_3$buffer layer did not show the hysteresis curve, while the buffer-layered has the remnant polarization of $1.14_{mu}C/cm^2$. It was concluded that the leakage current density and the ferroelectricity for the $YMnO_3$ thin films could be controlled by varying crystalline phases and their preferred orientation which depend on the kind of substrates and whether the $Y_2O_3$buffer layer exist or not.

Structural, Optical, and Magnetic Properties of Si1-xMnxTe1.5 Single Crystals (Si1-xMnxTe1.5 단결정의 구조적, 광학적, 자기적 특성에 관한 연구)

  • Hwang, Young-Hun;Um, Young-Ho;Cho, Sung-Lae
    • Journal of the Korean Magnetics Society
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    • v.16 no.3
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    • pp.178-181
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    • 2006
  • We have investigated the Mn concentration-dependent structural, optical, magnetic properties in IV-VI diluted magnetic semiconductor $Si_{1-x}Mn_xTe_{1.5} $ crystals prepared by the vertical Bridgman technique. X-ray studies showed the single crystalline hexagonal crystal structure. From the optical absorption measurements energy band gap were found to decreases with increasing x and temperature. From the magnetization measurements the samples had ferromagnetic ordering with Curie temperature $T_C$ about 80 K. With increasing Mn concentration, the average magnetic moments per Mn atom determined from the saturated magnetization increased.

The Effect of Stress on the Thermal Stability of the TiS$i_2$ Film (TiS$i_2$ 박막의 열안정성에 미치는 막 스트레스의 영향)

  • Kim, Yeong-Uk;Kim, Yeong-Uk;Go, Jong-U;Lee, Nae-In;Kim, Il-Gwon;Park, Sun-O;An, Seong-Tae;Lee, Mun-Yong;Lee, Jong-Gil
    • Korean Journal of Materials Research
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    • v.3 no.1
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    • pp.12-18
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    • 1993
  • Abstract The effect of the film stress on the thermal stability of TiSi, films under the dielectric overcoat was investigated. TiS$i_2$ films with the sheet resistance of 1.2 ohm/sq. were produced by a solid-state reaction between sputtered Ti film and single-crystalline Si in an RTA (rapid thermal anneal) machine. Dielectric overcoats such as the USG (Undoped Silicate Glass, Si$O_2$) film and the PE-SiN(S$i_3$$N_4$) film were deposited by AP-CVD and PE-CVD, respectively, on the TiS$i_2$ film. The thermal stability of the TiSi, film was evaluated by changes in the sheet resistance, film stress and microstructure after furnace anneals at 90$0^{\circ}C$. Agglomeration of the TiSi2 film high temperatures results in the increase of sheet resistance and the decrease of tensile stress of TiSi, film. The stress level of the TiSi" PE-SiN and ~SG films at 90$0^{\circ}C$C was 1.3${\times}{10^{9}}$, 1.25 ${\times}{10^{10}}$, 2.26 ${\times}{10^{10}}$ dyne/c$m^2$ in tensile, respectively. Dielectric films deposited by CVD on TiSi, was effective on preventing agglomeration of TiSi,. The PE-SiN film mproved the thermal stability of TiSi, more effectively than the AP-CVD USG film. It is considered that agglomeration of the TiS$i_2$ film under the stress of dielectric overcoat at high temperature can be caused by a diffusional flow of atom called Nabarro-Herring microcreep.reep.

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Preparation of Ferroelectric $BaTiO_3$ Thin Films on MgO-Buffered Si Substrates (MgO 완충층을 이용한 Si 기판상 강유전체 $BaTiO_3$ 박막의 제조)

  • 김상섭
    • Journal of the Korean Ceramic Society
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    • v.34 no.4
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    • pp.373-379
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    • 1997
  • A study on the deposition and characterization of BaTiO3 thin films on MgO-buffered Si(100) substrates by sputtering was conducted. The MgO buffer layers were investigated as a function of deposition temperature. At lower substrate temperature, the MgO layers were not fully crystalline, but a crystallized MgO layer with (001) preferred orientation was obtained at the substrate temperature of $700^{\circ}C$. Partially (00ι) or (h00) textured BaTiO3 films were obtained on Si(100) with the MgO buffer layer grown at 700ι. While, randomly oriented BaTiO3 films with large-scale cracks on the surface were made without the MgO layer. The crystallographic orientation, morphology and electrical properties between the BaTiO3 films on Si with and without the MgO layer were compared using the BaTiO3 film on MgO(100) single crystal substrate as a reference system. Also the favorable role of the MgO layer as a buffer for growing of oriented BaTiO3 films on Si substrates was confirmed.

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