• Design & Manufacturing
• /
• v.16 no.3
• /
• pp.1-8
• /
• 2022

In this study, an artificial neural network(ANN) was constructed to establish the relationship between process condition prameters and the qualities of the injection-molded product in the injection molding process. Six process parmeters were set as input parameter for ANN: melt temperature, mold temperature, injection speed, packing pressure, packing time, and cooling time. As output parameters, the mass, nominal diameter, and height of the injection-molded product were set. Two learning structures were applied to the ANN. The single-task learning, in which all output parameters are learned in correlation with each other, and the multi-task learning structure in which each output parameters is individually learned according to the characteristics, were constructed. As a result of constructing an artificial neural network with two learning structures and evaluating the prediction performance, it was confirmed that the predicted value of the ANN to which the multi-task learning structure was applied had a low RMSE compared with the single-task learning structure. In addition, when comparing the quality specifications of injection molded products with the prediction values of the ANN, it was confirmed that the ANN of the multi-task learning structure satisfies the quality specifications for all of the mass, diameter, and height.

• ETRI Journal
• /
• v.29 no.4
• /
• pp.421-429
• /
• 2007

This paper presents a direct-conversion CMOS transceiver for fully digital DS-UWB systems. The transceiver includes all of the radio building blocks, such as a T/R switch, a low noise amplifier, an I/Q demodulator, a low pass filter, a variable gain amplifier as a receiver, the same receiver blocks as a transmitter including a phase-locked loop (PLL), and a voltage controlled oscillator (VCO). A single-ended-to-differential converter is implemented in the down-conversion mixer and a differential-to-single-ended converter is implemented in the driver amplifier stage. The chip is fabricated on a 9.0 $mm^2$ die using standard 0.18 ${\mu}m$ CMOS technology and a 64-pin MicroLead Frame package. Experimental results show the total current consumption is 143 mA including the PLL and VCO. The chip has a 3.5 dB receiver gain flatness at the 660 MHz bandwidth. These results indicate that the architecture and circuits are adaptable to the implementation of a wideband, low-power, and high-speed wireless personal area network.

• Proceedings of the KIEE Conference
• /
• 2008.07a
• /
• pp.705-706
• /
• 2008

There has been, in recent years, effort to make cast copper rotors for industrial use of induction motors. Because the incorporation of copper for the conductor bars and end rings of the induction motor in place of aluminum would result in attractive improvements in motor energy efficiency. The purpose of this method is a reducing the copper loss as using higher conductivity of copper. In this paper as the single phase induction motor is studied, the stator slots and coil turn number is designed for adjusting the slot fill factor and improving its efficiency. At this time design is basis on calculation of reducing loss. And finally this paper shows that the before and after result is compared and analyzed.

• Journal of Pharmaceutical Investigation
• /
• v.22 no.1
• /
• pp.49-54
• /
• 1992

This study was carried out for the purpose of developing an effective temazepam soft elastic gelatin capsule (softgel) which exhibits an excellent bioavailability and of comparing the rate and extent of absorption of temazepam from the marked elixir and prepared softgel using hydrophilic liquid such as polyethylene glycol 400 as a suspending agent by rotary die method. Both softgel and elixir containing 3 mg of temazepam were given to 7 healthy male New Zealand White rabbits in a single oral dose cross-over study. Plasma temazepam concentrations were measured by HPLC. The mean peak concentrations of temazepam following a single oral dosing as softgel and elixir dosage form were 13.84 and 13.25 ng/ml, respectively. And the mean time to peak concentration was 1.29 hr for the softgel and 1.07 hr for the elixir. There was no significant difference in the extent of drug absorption (AUC) for the two different dosage froms (p>0.05). While the softgel exhibited mean lag time of 0.63 hr, the elixir did not show any lag time. Statistical moment parameters such as the mean residence time and variance of the mean residence time did not differ significantly for the two formulations.

• JSTS:Journal of Semiconductor Technology and Science
• /
• v.14 no.6
• /
• pp.697-705
• /
• 2014

A single chip Programmable AC to DC Power Converter, consisting of wide band gap SiC MOSFET and SiC diodes, has been proposed which converts high frequency ac voltage to a conditioned dc output voltage at user defined given power level. The converter has high conversion efficiency because of negligible reverse recovery current in SiC diode and SiC MOSFET. High frequency operation reduces the need of bigger size inductor. Lead inductors are enough to maintain current continuity. A complete electrical analysis, die area estimation and thermal analysis of the converter has been presented. It has been found that settling time and peak overshoot voltage across the device has reduced significantly when SiC devices are used with respect to Si devices. Reduction in peak overshoot also increases the converter efficiency. The total package substrate dimension of the converter circuit is only $5mm{\times}5mm$. Thermal analysis performed in the paper shows that these devices would be very useful for use as miniaturized power converters for load currents of up to 5-7 amp, keeping the package thermal conductivity limitation in mind. The converter is ideal for voltage requirements for sub-5 V level power supplies for high temperatures and space electronics systems.

• ETRI Journal
• /
• v.41 no.3
• /
• pp.396-407
• /
• 2019

Laser-assisted bonding (LAB) is an advanced technology in which a homogenized laser beam is selectively applied to a chip. Previous researches have demonstrated the feasibility of using a single-tier LAB process for 3D through-silicon via (TSV) integration with nonconductive paste (NCP), where each TSV die is bonded one at a time. A collective LAB process, where several TSV dies can be stacked simultaneously, is developed to improve the productivity while maintaining the reliability of the solder joints. A single-tier LAB process for 3D TSV integration with NCP is introduced for two different values of laser power, namely 100 W and 150 W. For the 100 W case, a maximum of three dies can be collectively stacked, whereas for the 150 W case, a total of six tiers can be simultaneously bonded. For the 100 W case, the intermetallic compound microstructure is a typical Cu-Sn phase system, whereas for the 150 W case, it is asymmetrical owing to a thermogradient across the solder joint. The collective LAB process can be realized through proper design of the bonding parameters such as laser power, time, and number of stacked dies.

• Journal of the Korean Institute of Telematics and Electronics C
• /
• v.34C no.4
• /
• pp.1-15
• /
• 1997

This paper proposes CMOS on-chip voltage and current reference circuits that operate at supply voltages between 2.5V and 5.5V without using a vonventional bandgap voltage structure. The proposed reference circuits based on enhancement-type MOS transistors show low cost, compatibility with other on-chip MOS circuits, low-power consumption, and small-chip size. The prototype was implemented in a 0.6 um n-well single-poly double-metal CMOS process and occupies an active die area of $710 um \times 190 um$. The proposed voltage reference realizes a mean value of 0.97 V with a standard deviation of $\pm0.39 mV$, and a temperature coefficient of $8.2 ppm/^{\circ}C$ over an extended temeprature range from TEX>$-25^{\circ}C$ to $75^{\circ}C$. A measured PSRR (power supply rejection ratio) is about -67 dB at 50kHz.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2002.05a
• /
• pp.666-669
• /
• 2002

Process design of hot forging, asymmetric to symmetric rail, which is used for the turnout of railway express has been investigated. Owing to the big difference in shape between the initial billet and the final forged product, it is impossible to hot forge the rail in a single step. Therefore, multi step forging as well as die design for each step are necessary for the production. The deformation behavior during hot forging has been analyzed by the numerical simulation through commercial FEA software, DEFORM$^{TM}$-2D. Modification of the design and repeated simulation have been carried out on the basis of the simulation result. For comparison with the simulation results, flow analysis experiment using plasticize has been also carried out. The results of the flow analysis experiment showed good agreement with those of the simulation. Therefore, the developed process design could be applied to the actual production.

• Journal of the Korean Society for Precision Engineering
• /
• v.7 no.3
• /
• pp.56-65
• /
• 1990

This paper describes a computer aided tool design system of deep drawing of cylindrical cups with or without flange by press. An approach to system is based on knowledge based system. The computer program has written in basic language with personal computer Knowledges for tool design are formulated from the plasticity theory, handbooks, experimental results and empirical knowhow of the field experts. The capabilities of developed system include 1) the selection of tool structure (with or without blank holder, single or double action, lift up or draw off type), 2) the design of tool elements(punch/holder, die/holder etc.) for the previous selected tool structure by the process planning output and the production quantity. The final output is generated in graphics form for design sheet.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.5 no.2
• /
• pp.56-64
• /
• 2006

Rapid progress in many branches of technology has led to a demand on new materials such as high strength light weight alloys, powdered alloys and composite materials. The hydrostatic extrusion is essentially a method of extruding a clad rod through a die. In order to investigate the effect of the process conditions such as friction heat, deformation and clad thickness on the clad extrusion process, viscoplastic finite element simulations were conducted. A specific model for theoretical analysis used in this study is The single scalar variable version of Hart's model. An experiment also has been carried out using 1.5MN hydrostatic extruder with variable speed ram, LVDT and load cell for comparison. It is found that the hydrostatic extrusion pressure considering the effect of heat dissipation in this theoretical work was closer to the experimental pressure than the isothermal hydrostatic extrusion pressure.