• 대한의용생체공학회:의공학회지
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• 제43권4호
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• pp.219-229
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• 2022

In this study, we propose a miniaturized micro-ceramic heater device. After screen-printing a silver paste between pre-sintered two aluminum oxide plates to integrate a heating circuit, the device was fabricated through a low-temperature sintering process. In order to configure the optimal heating circuit integration condition, the output current evaluation and heating test were performed according to the number of screen prints of the silver paste at various voltages. A silver paste-based heating circuit printed with a line width of 200 ㎛ and a thickness of 60 ㎛ was successfully integrated on a pre-sintered alumina substrate through a low-temperature sintering process. In the case of the 5 times printed device, the thermal response showed a response rate of 18.19 ℃/sec. To demonstrate feasibility of the proposed device in the medical field, such as bio-tissue suturing and hemostasis, a voltage was applied to pig tissue in the device to test tissue change due to heat generated from the device. These results show the possibility that the proposed small ceramic heater could be used in the medical field based on its excellent temperature response.

• Composites Research
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• 제17권5호
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• pp.61-67
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• 2004

본 연구에서는 전자파 차폐용 도전성 개스킷 소재로 활용할 수 있는 은입자 충전 실리콘 복합 페이스트에 대한 전기전도성 및 응력-변형율 특성을 분석하였다. 불규칙한 구형의 은(Ag)입자와 상온습기경화형(RTV) 실리콘수지를 도입하여 복합 페이스트의 퍼콜레이션 농도(임계 농도)를 전기전도도 측정 결과로부터 결정하였다. 약 28%의 은입자 함량에서 퍼콜레이션 현상이 발생하였으며, 이 농도에서 급격한 감소를 보이는 은입자/실리콘 복합 페이스트의 체적 비저항, 인장강도 및 연신률의 특성 변화에 관하여 고찰하였다. 또한, 커플링제의 선택적 방법을 통해 퍼콜레이션 농도 이상으로 충전된 복합 페이스트의 응력-변형율 특성을 효과적으로 개선할 수 있음을 제시하여 주었다.

• 한국재료학회지
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• 제29권1호
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• pp.37-42
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• 2019

This study investigates Ag coated $Cu_2O$ nanoparticles that are produced with a changing molar ratio of Ag and $Cu_2O$. The results of XRD analysis reveal that each nanoparticle has a diffraction pattern peculiar to Ag and $Cu_2O$ determination, and SEM image analysis confirms that Ag is partially coated on the surface of $Cu_2O$ nanoparticles. The conductive paste with Ag coated $Cu_2O$ nanoparticles approaches the specific resistance of $6.4{\Omega}{\cdot}cm$ for silver paste(SP) as $(Ag)/(Cu_2O)$ the molar ratio increases. The paste(containing 70 % content and average a 100 nm particle size for the silver nanoparticles) for commercial use for mounting with a fine line width of $100{\mu}m$ or less has a surface resistance of 5 to $20{\mu}{\Omega}{\cdot}cm$, while in this research an Ag coated $Cu_2O$ paste has a larger surface resistance, which is disadvantageous. Its performance deteriorates as a material required for application of a fine line width electrode for a touch panel. A touch panel module that utilizes a nano imprinting technique of $10{\mu}m$ or less is expected to be used as an electrode material for electric and electronic parts where large precision(mounting with fine line width) is not required.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1998년도 춘계학술대회 논문집
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• pp.121-124
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• 1998

Generally the structure of powder electroluminescent devices (PELDs) on ITO-film was makeup of the ZnS:Cu phosphor layer and BaTiO$_3$ insulating layer. The active layer, which consists of a suitably doped ZnS powder mixed in a dielectric, is sandwiched between two electrodes; one of which are ITO film and the other is aluminum. In this paper, three kinds of powder eleotroluminescent devices (PELDs) : WK-A(ITO/BaTiO$_3$/ZnS:Cu/Silver paste). WK-B(ITO/BaTiO$_3$+ZnS:Cu/Silver paste) and WK-C(ITO/BaTiO$_3$/ZnS:Cu/BaTiO$_3$/Silver paste), fabricated by spin coating method, were investigated. To evaluate the luminescence properties of three kinds of PELDs, EL emission spectroscopy, transferred charge density and time response of EL emission intensity under square wave voltage driving were measured.

• Bulletin of the Korean Chemical Society
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• 제33권12호
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• pp.3987-3992
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• 2012

Silver nanopowders were prepared from silver 2-ethylhexylcarbamate (Ag-EHCB) complexes by simple thermal reduction at $85^{\circ}C$ without any reducing agent in organic solvent. 2-Ethylhexylammonium 2-ethylhexylcarbamate (EHAEHC) was investigated in terms of their abilities to stabilize the silver nanoparticles (Ag-NPs) and its subsequent effects on the preventing aggregation between Ag-NPs. Conditions (concentration of stabilizer and reaction time) used to reduce Ag-EHCB complex were systematically varied to determine their effects on the sizes of Ag-NPs. The formation of the stabilized Ag-NPs were easily monitored by UV-vis spectroscopy and characterized by TGA, TEM, SEM and XRD. When EHAEHC was used as a stabilizer, Ag-NPs of 10-30 nm in diameter were easily obtained in high yield. Silver patterns were obtained from a silver nano-paste by heat treatment at $200^{\circ}C$ in air and were found to have resistivity values of $2.9{\times}10^{-8}\;{\Omega}{\cdot}m$.

• 한국세라믹학회지
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• 제41권4호
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• pp.313-322
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• 2004

후막 광식각 기술은 스크린 인쇄 등의 일반적인 후막공정에 노광 및 현상 등의 리소그라피 공정을 접목시킨 새로운 기술이다. 본 연구에서는 후막 광식각 기술을 이용하여 미세라인을 형성할 수 있는 저온동시소성용 Ag 페이스트를 개발하였다. 페이스트를 구성하는 Ag분말과 폴리머, 모노머, 광개시제 등의 양을 조절하여 미세라인을 형성할 수 있는 최적 조성을 연구하였으며. 또한 노광량과 같은 공정변수가 미세라인 형성에 미치는 영향을 연구하였다. 실험결과 폴리머/모노머비, Ag 분말 중량비, 광개시제의 양 등이 미세라인의 해상도에 영향을 미치는 주요 인자임을 확인할 수 있었다. 개발된 감광성 Ag 페이스트를 저온동시소성용 그린 시트에 전면 인쇄한 후 건조, 노광, 현상, 적층, 소성 과정을 통하여, 소성 후 20$\mu\textrm{m}$ 이하의 선폭을 가지는 후막 미세라인을 형성할 수 있었다.

• 공업화학
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• 제29권6호
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• pp.782-788
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• 2018

서브 미크론 구리-은 코어-쉘 Cu@Ag 입자를 초음파화학과 결합된 금속교환 반응으로 합성하고 인쇄용 전자부품을 위한 저렴한 전도성 페이스트 적용을 평가하였다. 코어-쉘의 합성을 위한 반응에서 코어로 사용된 $Cu_2O/Cu$ 복합체의 $Cu_2O$는 초음파화학 반응으로 Cu로 환원되고 Cu 원자는 Ag의 금속교환 반응의 환원제로 작용하여 코어 표면에 Ag가 코팅된 코어-쉘 구조를 얻었다. TEM-EDS와 TG-DSC를 이용하여 서브 미크론 입자의 코어-쉘 구조를 확인하였다. 70 wt% Cu@Ag를 용매에 분산시킨 전도성 페이스트를 결합제와 습윤제를 사용하여 제조하고, 스크린 인쇄법을 사용하여 폴리아미드 필름상에 코팅하였다. Ag 함량이 8 at%와 16 at%인 Cu@Ag 입자를 함유하는 인쇄된 페이스트 필름은 공기 중의 $180^{\circ}C$에서 소결한 후 각각 96.2와 $38.4{\mu}{\Omega}cm$의 낮은 비저항 값을 나타내었다.

• 한국인쇄학회지
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• 제29권2호
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• pp.45-58
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• 2011

Gravure off-set printing recently is used in electronics display market. This method has advantages of mass production and high printing speed. It is also fine pattern can be implemented. We have manufactured low-curable conductive Ag pastes for gravure off-set printing. When printing, the pastes be used different silver powder shape because of the printing characteristics. The pastes were prepared with silver powder by silver powder shape and size, epoxy resin, solvent and homogenized on a standard three-roll mill. And the pastes exhibited a shear-thinning flow at viscosity profile. Moreover the adhesive strength and resistivity of silver film had a good characteristics. With the manufactured paste in this study, touch panel had is manufactured and it had $4{\times}10-5{\Omega}.cm$.

• Transactions on Electrical and Electronic Materials
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• 제18권4호
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• pp.181-184
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• 2017

Multilayer ceramics in which piezoelectric layers of $0.90Pb(Zr_{0.48}Ti_{0.52})O_3-0.05Pb(Mn_{1/3}Sb_{2/3})O_3-0.05Pb(Zn_{1/3}Nb_{2/3})O_3$ (0.90PZT-0.05PMS-0.05PZN) stack alternately with silver electrode layers were prepared by an advanced low-temperature co-fired ceramic (LTCC) method. The electrical properties and bonding strength of the multilayers were associated with the interface morphologies between the piezoelectric and silver-electrode layers. Usually, the inner silver electrodes are fabricated by sintering silver paste in multi-layer stacks. To improve the interface bonding strength, piezoelectric powders of 0.90PZT-0.05PMS-0.05PZN with an average particle size of $23{\mu}m$ were added to silver paste to form a gradient interface. SEM observation indicated clear interfaces in multilayer ceramics without powder addition. With the increase of piezoelectric powder addition in the silver paste, gradient interfaces were successfully obtained. The multilayer ceramics with gradient interfaces present greater bonding strength as well as excellent piezoelectric properties for 30~40 wt% of added powder. On the other hand, over addition greatly increased the resistance of the inner silver electrodes, leading to a piezoelectric behavior like that of bulk ceramics in multilayers.

• 대한화학회지
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• 제20권4호
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• pp.280-289
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• 1976

$Ag_2Se$ 전극을 제조하고 은이온에 대한 지시전극으로서의 성질을 조사하였다. Epoxy 수지를 Ag_2Se 전극의 binder로서, Silver paste를 감응막과 은판의 접착제로서 사용하였다. 감응막은 10ton/$cm^2$로 가압성형 한다음 질소분위기에서 200${\sim}$$500^{\circ}C$로 sintering한 후 전극을 제조한 결과sintering 하지않은 전극보다 감응성이 우수하고 견고하였다. 또한 $Ag_2Se$전극보다 감응성이 우수하였다. 은이온농도의 변화에 따르는 감응도는 10-6M까지 직선관계를 유지하였다. 대부분의 중금속 이온은 방해하지 않으나 수은(II) 이온이 크게 방해를 하였으며 음이온인 halide, cyanide, thiocyanate 이온의 방해는 더욱 심하였다. 반면 이전극은 halide 이온 정량시 전위차적정법으로 사용할 수 있음을 알았다.