• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제54권12호
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• pp.561-566
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• 2005

This paper describes electrical resistivity, dielectric strength, thermal conductivity, thermal stability and tensile strength of mica sheet impregnated with silicone rubber resin or silicone rubber resin containing alumina powder. The mica sheet impregnated with silicone rubber resin had higher electrical resistivity, dielectric strength and tensile strength than those of virgin mica sheet. Electrical resistivity of mica sheet impregnated with silicone rubber resin containing alumina increased with increasing the amount of alumina. However, dielectric strength and tensile strength of mica sheet impregnated with silicone rubber resin containing alumina decreased with increasing the amount of alumina. The mica sheet impregnated with silicone rubber resin had lower thermal conductivity than that of virgin mica sheet. However, thermal conductivity of mica sheet impregnated with silicone rubber resin conatining alumina increased with increasing the amount of alumina. In the case of thermal stability, thermal degradation of virgin mica sheet and impregnated mica sheet with silicone rubber resin did not occur up to $1100^{\circ}C$ and $400^{\circ}C$, respectively.

• 한국정밀공학회지
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• 제28권2호
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• pp.219-225
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• 2011

Silicone resin is recently used as encapsulant for high-power LED module due to its excellent thermal and optical properties. In the present investigation, finite element analysis of cure process was attempted to examine residual stress evolution behavior during silicone resin cure process which is composed of chemical curing and post-cooling. To model chemical curing of silicone, a cure kinetics equation was evaluated based on the measurement by differential scanning calorimeter. The evolutions of elastic modulus and chemical shrinkage during cure process were assumed as a function of the degree of cure to examine their effect on residual stress evolution. Finite element predictions showed how residual stress in cured silicone resin can be affected by elastic modulus and chemical shrinkage behavior. Finite element analysis is supposed to be utilized to select appropriate silicone resin or to design optimum cure process which brings about a minimum residual stress in encapsulant silicone resin.

• 한국잠사곤충학회지
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• 제27권2호
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• pp.28-39
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• 1985

견직물의 실용성능(방추도, 세탁성)을 개선할 목적으로 실크하브다이(silk habutae)에 실리콘수지를 유화 가공법으로 처리하였다. 실리콘가공 하브다이의 방추도, 발수도, 유연도, 강신도, 수분율 등은 직물검사 방법에 따라서 검사하였고 가공 후 견피브로인의 구조적인 변화를 구명하기 위하여 주사전자현미경, 아미노산분석, X-선 회절강도, FT-IR 흡수분석에 의하여 검토한 결과 아래와 같은 결과를 얻었다. 1) 견하브다이 직물의 방추도는 soaping 처리오 큐어링 조건에 의하여 현저히 개선되었다. 2) 실리콘 수지 가공에 의하여 견하브다이의 발수도와 유연도가 향상되었고, 가공 후 silk fibroin을 주사전자현미경으로 관찰한 결과 견섬유 특유의 불규칙한 섬유표면은 평활하게 관찰되었다. 3) 실리콘 수지와 silk fibroin의 반응에 따라서 피브로인 조성 아미노산 중 극성기를 가지고 있는 아미노산의 감소비율이 현저하였다. 4) 실리콘 수지가공 silk habutae는 soaping에 의하여 X-선 회절강도가 높아지는 경향이었다. 5) 가공 후 견하브다이의 FT-IR 흡수곡선에 실록산등의 peak가 검출된 것으로 미루어 fibroin의 개질이 가능하다고 생각된다.

• 대한화학회지
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• 제35권5호
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• pp.539-544
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• 1991

X-ray Compton 산란선의 강도를 측정하여 내지문처리재(Anti-fingerprint Steel)의 표면에 Coating 되어 있는 Silicone resin film의 두께를 신속하게 측정할 수 있는 새로운 분석방법을 연구하였다. Silicone resin과 같은 유기수지들은 C, H, O, Si 등과 같은 경원소들로 구성되어 있어 compton 산란선의 강도가 높게 나타나는데 이러한 성질을 이용, X-ray tube로부터 발생된 RhK$_{\alpha}$ 선을 시료표면에 조사한 후 발생된 RhK$_{\alpha}$ compton 산란선의 강도를 측정하여 silicone resin film의 두께를 구하였다. 검량곡선 작성결과 0.2 ~ 5.0 ${mu}$m 범위에서 직선성을 나타냈으며 두께측정에 대한 정확도는 0.22 ${mu}$m 이었다.

• 대한전기학회논문지
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• 제41권6호
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• pp.640-651
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• 1992

This paper describes the electric properties of mica reinforced silicone composites with the parameter of curing condition of silicone resin, application amount of silane coupling agent to the mica paper and the mica wt% to the composite. Heat-resistant silicone resin and mica paper made of mica flakes are used to prepared the mica/silicone composite as matrix and filler, respectively. To improve the dielectric properties and interfacial adhesion between matrix and filler, silane coupling agent is applied on the mica paper. As for matrix, tan$\delta$ value of 30$0^{\circ}C$ heat-treated silicone resin is the lowest under 1%. The optimal wt% of coupling agent is 0.3% to the weight of mica paper. 80 wt% of mica as filler to the mica/silicone composite shows the best electric properties. And the mica reinforced silicone composite shows good high-frequency and mechanical tensile stress properties.

• 한국응용과학기술학회지
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• 제24권3호
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• pp.253-263
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• 2007

Three different weather-resistant coatings were fabricated with the various weight ratios of a mill-base silicone/acrylic resin to let-down silicone /acrylic resin at 2:8, 3:7, and 4:6 respectively. The prepared coatings were tested to investigate the effect of composition of weather-resistant coatings on the physical properties. The thermal stability, salt spray exposure, and weather-resistance were improved with the increased silicone content. It was concluded that the optimum retio of mill-base silicone/acrylic resin to let-down silicone/acrylic resin would be 2:8 and the coating with 30 wt% of silicone content would have high weather-resistance.

• 접착 및 계면
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• 제7권4호
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• pp.39-44
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• 2006

A new kind of silicone-epoxy composite is reported in this research. The silicone-epoxy resin was synthesized by the hydrosilylation of tetramethycyclotetrasiloxane and 4-vinyl-1-cyclohexene 1,2-epoxy with a high reaction yield. It was found that the obtained silicone-epoxy resin shows a high reactive activity to the aluminum complex-silanol catalyst. The resin could be cured under the catalysis of $(Al(acac)_3/Ph_2Si(OH)_2$ at a concentration below 0.1 wt% to give a hard cured resin showing excellent optical clarity, UV resistance and thermal stability. It was also found that the Si-H groups facilitated the curing reaction and the silicone-epoxy resin bearing Si-H group could be cured effectively even if $Ph_2Si(OH)_2h$ was absent. Moreover, the UV resistance and thermal stability were improved significantly by the introduction of Si-H groups. This is possibly due to the reductive property of Si-H groups which can annihilate radical and peroxide effectively. This kind of silicone-containing epoxy composite might have very promising applications as optical resin, optical adhesive and encapsulation materials for electronic devices.

• 한국염색가공학회지
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• 제26권3호
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• pp.187-194
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• 2014

To improve the deep coloring effect of PET fabrics, the alkali treated and black dyed PET fabrics were treated with 2 kinds of low refractive compounds such as acrylic resin and silicone resin. The color depth effect of treated PET fabrics was evaluated as lightness(L) change by UV-visible spectrophotometer. As the weight loss of PET fiber treated with alkali increased, the color depth of PET fabrics increased. Lightness(L) of PET fabrics treated with deep coloring agent was lower than that of untreated PET fabrics. The optimum concentration of treated PET with deep coloring agent was 4% o.w.s. The deep coloring effect of PET fabrics treated with silicone resin was higher than one treated with acrylic resin. PET fabrics treated with silicone resin only might be more appropriate process than PET fabrics treated with acrylic and silicone resin for giving deep coloring effect for polyester fabrics.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1991년도 하계학술대회 논문집
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• pp.227-232
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• 1991

Silicone resin which is made from silicone(Si) is well known by its heat-resistant property. Its good heat-resistant enables silicons resin being used in high temperature (up to $200^{\circ}C$) heavy-dury environment for electric insulation. This paper has dealed with the electrical properties of silicone resin such as dielectric constant and tan ${\delta}$ with heat treatment temperature $(200^{\circ}C{\sim}450^{\circ}C)$. To investigate the electrical insulation of silicone resin, dielectric strength by A.C and anti-tracking properties under both AC and D.C have been performed.

• 소성∙가공
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• 제21권2호
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• pp.101-106
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• 2012

Generally, rapid cure reaction of LED encapsulation silicone resin causes serious defects in cured resin products such as warpage, residual bubbles, and reduced wettablility. In order to prevent residual bubbles in silicone resin, the step cure process was examined in the present paper. Three kinds of step cure processes were applied, and bubble-free phenomenon was observed. Most of the bubbles were removed under $70^{\circ}C$, the minimum temperature for activating cure reaction. In addition, degree of cure(DOC) and temperature distribution were predicted by using FEM analysis of heat transfer. It was concluded that maintaining cure temperature which provide a DOC under 0.5~0.6 effectively reduces residual bubbles.