• Bulletin of the Korean Chemical Society
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• 제16권11호
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• pp.1019-1023
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• 1995

A light-emitting silicon material was prepared by electrochemical etching of n-Si single crystal wafers in a solution of hydrofluoric acid and ethanol. Visible photoluminescence from the silicon was inhomogeneous and decayed rapidly in the ambient laboratory conditions or with photoirradiation. Substantial improvements in photoluminescence which include little-dependent luminescence peak energy with excitation energy variation and longer-lasting room temperature visible photoluminescence were achieved when the surface of photoluminescent silicon material was derivatized with the surface modifier of octadecylmercaptan. Surface modification of the photoluminescent silicon was evidenced by the measurements of contact angles of static water drops, FT-IR spectra and XPS data, in addition to changed photoluminescence. Similar improvements in photoluminescence were observed with the light-emitting silicon treated with dodecylmercaptan, but not with octadecane. The present results indicate that sulfurs of octadecylmercaptans or dodecylmercaptans appear to coordinate the surface Si atoms of LESi and perturb the surface states to significantly change the luminescent characteristics of LESi.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 춘계학술대회 논문집 전자세라믹스 센서 및 박막재료 반도체재료 일렉트렛트 및 응용기술
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• pp.147-151
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• 2000

This paper presents the electrochemical etch-stop characteristics of single-crystal silicon in a tetramethyl ammonium hyciroxide(TMAH):isopropyl alcohol(IPA):pyrazine solution. Addition of pyrazine to a TMAH:IPA etchant increases the etch-rate of (100) silicon, thus the elapsed time for etch-stop was shortened. The current-voltage(I-V) characteristics of n- and p-type silicon in a TMAH:IPA:pyrazine solution were obtained, respectively. Open circuit potential(OCP) and passivation potential(PP) of n- and p-type silicon, respectively, were obtained and applied potential was selected between n- and p-type silicon PP. The electrochemical etch-stop is applied to the fabrication of 801 microdiaphragms having $20\;{\mu}m$ thickness on a 5-inch silicon wafer. The averge thicknesses of 801 microdiaphragms fabricated on the one wafer were $20.03\;{\mu}m$ and standard deviation was ${\pm}0.26{\mu}m$. The silicon surface of the etch-stopped microdiaphragm was extremely flat without noticeable taper or other nonuniformities. The benefits of the electrochemical etch-stop in a TMAH:IPA:pyrazine solution become apparent when reproducibility in the microdiaphragm thickness for mass production is considered. These results indicate that the electrochemical etch-stop in a TMAH:IPA:pyrazine solution provides a powerful and versatile alternative process for fabricating high-yield silicon microdiaphragms.

• The Korean Journal of Ceramics
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• 제3권4호
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• pp.229-234
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• 1997

Silicon carbide-carbon fiber composites have been prepared by partially Infiltrating porous carbon fiber composites with liquid silicon at a reaction temperature of $1670^{\circ}C$. Reaction between molten silicon and the fiber preform yielded silicon carbide-carbon fiber composites composed of aggregates of loosely bonded SiC crystallites of about 10$\mu\textrm{m}$ in size and preserved the appearance of a fiber. In addition, the SiC/C fiber composites had carbon fibers coated with a dense layer consisted of SiC particles of sizes smaller than 1$\mu\textrm{m}$. The physical and mechanical properties of SiC/C fiber composites were discussed in terms of infiltrated pore volume fraction of carbon preform occupied by liquid silicon at the beginning of reaction. Lower bending strength of the SiC/C fiber composites which had a heterogeneous structure in nature, was attributed to the disruption of geometric configuration of the original carbon fiber preform and the formation of the fibrous aggregates of the loosely bonded coarse SiC particles produced by solution-precipitation mechanism.

• Bulletin of the Korean Chemical Society
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• 제32권7호
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• pp.2227-2232
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• 2011

The new metrology, Advanced Poly-silicon Ultra-Trace Profiling (APUTP), was developed for measuring bulk Cu and Ni in heavily boron-doped silicon wafers. A Ni recovery yield of 98.8% and a Cu recovery yield of 96.0% were achieved by optimizing the vapor phase etching and the wafer surface scanning conditions, following capture of Cu and Ni by the poly-silicon layer. A lower limit of detection (LOD) than previous techniques could be achieved using the mixture vapor etching method. This method can be used to indicate the amount of Cu and Ni resulting from bulk contamination in heavily boron-doped silicon wafers during wafer manufacturing. It was found that a higher degree of bulk Ni contamination arose during alkaline etching of heavily boron-doped silicon wafers compared with lightly boron-doped silicon wafers. In addition, it was proven that bulk Cu contamination was easily introduced in the heavily boron-doped silicon wafer by polishing the wafer with a slurry containing Cu in the presence of amine additives.

• 한국세라믹학회지
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• 제23권5호
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• pp.67-74
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• 1986

To investigate the effects of unreacted silicon on the $\alpha$/$\beta$transfornation variation of morphology and mechanical strength of Sintered Reaction Bonded Silicon Nitride the mixtures of $\alpha$-$Si_3N_4$ and Si powder and Reaction Bonded Silicon Nitride were heat treated. The heat-treatments were performed in Ar atmosphere in order to inhibit the nitridation of silicon. In the mixtures heat-trated at 1$700^{\circ}C$ the amount of $\beta$-TEX>$Si_3N_4$transformed from $\alpha$-TEX>$Si_3N_4$was sigmoidally increased and the equiaxed $\alpha$-TEX>$Si_3N_4$grains elongated with the amount of silicon and heat treating time. And large $\beta$-TEX>$Si_3N_4$grains grown into silicon were observed. On the other hand there was no change in the heat-treatment of pure $\alpha$-TEX>$Si_3N_4$In case of the heat-treatment of RBSN the same phenomena due to the silicon appearing from the decomposition of $\alpha$-Smatte and needle were observed. From the three point bending test the strength of the sintered specimens with the and without 5wt% silicon addition had 53Kg/$mm^2$ and 73Kg/$mm^2$ respectively.

• 한국주조공학회지
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• 제17권6호
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• pp.608-614
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• 1997

The effect of mold preheating temperature on the microstructure such as grain size, eutectic silicon morphology was investigated for the Al-7wt%Si-0.3wt%Mg alloy. Microstructural variations have been characterized as a function of Sr addition and cooling rate during solidification. Microstructures were correlated with cooling rate, local solidification time and eutectic nucleation temperature, etc. In this study, Sr addition caused increase of local solidification time, undercooling and reduction of eutectic plateau temperature. In logarithmic scale, local solidification time was in inverse proportion to cooling rate. Eutectic nucleation temperature was in inverse proportion to cooling rate of logarithmic scale. Increasing the cooling rate refined dendrite arm spacing and eutectic silicon. Dendrite arm spacing was logarithmically in inverse proportion to cooling rate. Without modifier addition, eutectic silicon was modified at cooling rate of $7^{\circ}C/s$ or higher.

• 한국세라믹학회지
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• 제46권5호
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• pp.520-524
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• 2009

Porous self-bonded silicon carbide (SBSC) ceramics were fabricated at temperatures ranging from 1750 to $1850^{\circ}C$ using SiC, Si, C as starting materials and Al as an optional sintering additive. The effect of Al addition on the porosity and strength of the porous SBSC ceramics were investigated as functions of sintering temperature and Si:C ratio. The porosity increased with decreasing the Si:C ratio and increasing the sintering temperature. It was possible to fabricate SBSC ceramics with porosities ranging from 37% to 44% by adjusting the Si:C ratio and the sintering temperature. Addition of Al additive promoted densification and necking between SiC grains, resulting in improved strength. Typical flexural strengths of SBSC ceramics with and without Al addition were 44 MPa and 34MPa, respectively.

• 한국진공학회지
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• 제4권S2호
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• pp.64-68
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• 1995

Silicon films were deposited at $430^{\circ}C$ by remote plasma chemical vapor deposition(RPECVD) with a gas mixture of $Si_2H_6/SiF_4/H_2$. The silicon films deposited without and with $SiF_4$ were characterized using atomic force microscopy(AFM), transmission electron microscopy(TEM) and X-ray diffraction(XRD). Both silicon films have the same rugged surface morphology, but, the silicon film deposited with $SiF_4$ exhibits more rugged. The silicon film deposited without $SiF_4$ is amorphous, whereas the silicon film deposited with $SiF_4$ is polycrystalline with very small needle-like grains which are perpendicular to the substrate and uniformly distributed in the thickness of the film. The silicon film deposited with $SiF_4$ was found to have a preferred orientation along the growth direction with the<110> of the film parallel to the <111> of the substrate. The effect of $SiF_4$ during RPECVD was discussed.

• 한국표면공학회지
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• 제12권1호
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• pp.3-10
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• 1979

Many excellent Al-Zn-In anode have been developed up to the present. But for the purpose of the better performance of Al-Zn-In anodes in sea water the effect of calcium silicon addition on anodic polarization and current capacity of Al-Zn-In anodes was measured and analysed in sea water and artificial sea water. The results and conclusions obtained are summarized as follows. 1) Being compared with Al-Zn-In anodes, Al-Zn-In anodes containing 0.05% calcium silicon had superior characteristics in both anodic polarization and current capacity. 2) Corrosion patterns of the anodes containing calcium silicon were much more uniform than those of Al-Zn-In anodes. 3) In this experiment the most useful anode was Al-4% Zn-0.03% In-0.05% (Ca-Si). It had a capacity of 2.60Amp-hr of current/g and a voltage of 1.13(SCE reference) at anodic current density 1,000 4{\mu}A/cm^2$.

• KIEE International Transactions on Electrophysics and Applications
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• 제4C권4호
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• pp.165-169
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• 2004

This paper reports a miniaturized conductor-backed CPW (CBCPW) bandpass filter based on a thin film polyimide layer coated on CMOS-grade silicon. With a 20 ${\mu}{\textrm}{m}$-thick polyimide interface layer and back metallization on the CMOS-grade silicon, the interaction of electromagnetic fields with the lossy silicon substrate has been isolated, and as a result a low-loss and low-dispersive CBCPW line has been obtained. Measured attenuation constant at 20 GHz is below 1.2 ㏈/cm, which is compatible with the CPW on GaAs. In addition, by using the proposed CBCPW geometry, miniaturized BPF for Ku band application is designed and its measured frequency response shows excellent agreement with the predicted value with validating the performances of the proposed CBCPW geometry for RFIC interconnects and filter applications.